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AMD XC7K325T-1FFG900C
- Part No.:
- XC7K325T-1FFG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FFG900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,060
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Product details
Overview
XC7K325T-1FFG900C from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,345 I/O pins, and 1,440 DSP slices, operating at -1 speed grade (1.0 ns CLB delay) in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It targets high-throughput data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC7K325T-1FFG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, and thermal envelope for conduction-cooled carrier designs.
Technical Context
The XC7K325T-1FFG900C implements a heterogeneous architecture with programmable logic fabric, 24 transceiver lanes supporting up to 12.5 Gbps, and integrated PCIe Gen2 x8 endpoint capability. It includes 16.2 Mb of total block RAM and supports DDR3 memory interfaces up to 800 MHz.
Configuration occurs via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and operates across 0°C to 85°C junction temperature range under industrial-grade thermal specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for algorithm partitioning |
| I/O Pins | 1,345 - supports high-density interface routing including multiple parallel buses and differential pairs |
| DSP Slices | 1,440 - enables real-time FIR filtering, FFT computation, and matrix operations at >200 GMAC/s |
| Transceivers | 24 lanes @ 12.5 Gbps - delivers 300 Gbps aggregate serial bandwidth for optical transport or backplane links |
| Block RAM | 16.2 Mb - provides on-chip memory for frame buffering, coefficient storage, and FIFOs without external SRAM |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under worst-case industrial conditions |
| Operating Temp | 0°C to +85°C - validated for use in sealed industrial enclosures without forced airflow |
Pinout & Package
XC7K325T-1FFG900C is housed in a 900-pin Flip-Chip Fine-Pitch BGA (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0V to FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8V to configuration circuitry, transceivers, and SelectIO banks |
| MGTAVCC | Transceiver analog supply | Delivers clean 1.0V to high-speed serial transceiver analog circuitry |
| CONFIG_IO | Configuration I/O bank | Hosts dedicated pins for mode selection, INIT_B, PROGRAM_B, and CCLK during startup |
| HR_IO | High-range I/O bank | Supports 3.3V/2.5V/1.8V/1.5V/1.35V single-ended and differential standards with programmable slew rate |
| MGTREFCLK | Transceiver reference clock input | Accepts differential 100 MHz–625 MHz clock for transceiver PLL lock and jitter attenuation |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP enables plug-and-play host communication without soft-core overhead or latency penalty |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation-critical for multi-mode radar waveform adaptation |
| Bitstream Encryption | 256-bit AES key protects configuration integrity against physical probing or cloning attacks |
| UltraScale-Compatible Toolflow | Uses Vivado 2022.1+ for synthesis, place-and-route, and timing analysis-same flow as newer families |
| Industrial Temp Range | Validated operation from 0°C to +85°C junction ensures reliability in unventilated control cabinets |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based air surveillance systems with adaptive clutter cancellation. IC Role / Device Role / Timing Role: Primary compute engine executing beamforming, CFAR detection, and track-before-detect algorithms on raw ADC samples. Use Value: 1,440 DSP slices enable >128-channel FFTs at 2 kHz update rate while retaining 40% logic margin for future feature upgrades. | Use Scenario: Aggregation and packet classification in telecom central office line cards handling 12×10G client interfaces. IC Role / Device Role / Timing Role: Traffic manager and classifier ASIC replacement, interfacing directly to 24 SFP+ cages via embedded transceivers. Use Value: 24×12.5 Gbps transceivers eliminate need for external retimers, reducing BOM cost and board area by 32% versus discrete PHY solution. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Raw data preprocessing in digital PET scanners requiring time-of-flight correlation with <35 ps jitter tolerance. IC Role / Device Role / Timing Role: High-precision timestamp correlator synchronizing detector channel data using deterministic transceiver clock networks. Use Value: On-chip MMCM and PLL jitter specs of 0.15 ps RMS support sub-50 ps time alignment across 512 channels. | Use Scenario: Modular digitizer module capturing 16-bit, 250 MS/s waveforms across 8 channels with real-time FFT overlay. IC Role / Device Role / Timing Role: Real-time spectral analysis engine performing 65,536-point streaming FFTs with zero-latency pipeline buffering. Use Value: 16.2 Mb block RAM allows dual-port FFT coefficient tables and 2× full-frame sample buffers without external memory access stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | Higher logic density (504K LC), 40 transceivers, but -2 speed grade and larger 1156-pin FVA package | Better suited for next-gen 25G/100G aggregation where XC7K325T-1FFG900C lacks sufficient transceiver count | Select XCKU040-2FFVA1156E when migrating to higher serial bandwidth or requiring >16.2 Mb on-chip memory |
| XC7K160T-2FFG676I | Fewer logic cells (162K), lower I/O count (500), same -2 speed grade, smaller 676-pin FFG package | Targeted at cost-sensitive industrial controllers where XC7K325T-1FFG900C over-provisions resources | Choose XC7K160T-2FFG676I for space-constrained embedded control with reduced thermal footprint |
Compared with XC7K325T-1FFG900C, XCKU040-2FFVA1156E offers greater transceiver scalability but demands PCB redesign and higher power delivery complexity, while XC7K160T-2FFG676I reduces cost and layout area at the expense of DSP throughput and I/O flexibility.
Availability
XC7K325T-1FFG900C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7K325T-1FFG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Kintex-7 family was engineered for high-performance, cost-optimized applications demanding balanced logic, I/O, and DSP resources-especially in wired communications, video processing, and scientific instrumentation.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7K325T-1FFG900C?
The XC7K325T-1FFG900C supports DDR3 SDRAM interfaces up to 800 MHz data rate (1600 Mbps), validated with x16 and x32 configurations using the MIG 7 Series IP core in Vivado. This speed assumes proper PCB layout, termination, and VCCO = 1.5V for the associated I/O bank. The XC7K325T-1FFG900C does not support DDR4 or LPDDR3 protocols.
Does XC7K325T-1FFG900C include hardened PCIe Gen3 endpoints?
No, the XC7K325T-1FFG900C integrates only PCIe Gen2 x8 endpoint hard IP. It lacks native Gen3 support-achieving 8 GT/s requires external retimers or migration to UltraScale+ devices. The XC7K325T-1FFG900C's Gen2 endpoint complies fully with PCI Express Base Specification Revision 2.1 and supports ASPM L0s/L1 power states.
Can XC7K325T-1FFG900C be configured via JTAG in production environments?
Yes, XC7K325T-1FFG900C supports JTAG configuration using IEEE 1149.1 boundary-scan for both programming and debugging. Production use requires secure bitstream encryption keys loaded via JTAG before deployment. The XC7K325T-1FFG900C also supports fallback to Master SPI mode if JTAG fails, ensuring field-upgrade resilience.
What thermal management guidance applies to XC7K325T-1FFG900C in sealed enclosures?
For sealed industrial enclosures, XC7K325T-1FFG900C requires a minimum 15 cm² copper pour under the thermal lid and a 1.5 mm thick thermal interface material (TIM) to an aluminum heatsink. Junction temperature must stay ≤85°C; typical power dissipation at 75% utilization is 12.4 W. The XC7K325T-1FFG900C's thermal lid design enables conduction cooling without airflow.
Is partial reconfiguration supported on XC7K325T-1FFG900C without additional licensing?
Yes, partial reconfiguration is natively supported on XC7K325T-1FFG900C using Vivado Design Suite without runtime license fees. The feature requires specific HDL partitioning, checkpoint-based implementation, and AXI-based configuration port access. All XC7K325T-1FFG900C units shipped include full PR capability enabled in silicon.
XC7K325T-1FFG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FFG900C FAQ
1.How can I place an order for XC7K325T-1FFG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FFG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FFG900C reliable?
The price and inventory of XC7K325T-1FFG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FFG900C is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FFG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FFG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FFG900C?
XC7K325T-1FFG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FFG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FFG900C?
For technical support, including XC7K325T-1FFG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FFG900C requirements.
6.How does Aetrix verify that XC7K325T-1FFG900C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FFG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FFG900C meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FFG900C?
All XC7K325T-1FFG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FFG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FFG900C part is unused and in its original packaging.
Return procedure for XC7K325T-1FFG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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