My Inquiry
My Account
AMD XC7K325T-1FFG900CES
- Part No.:
- XC7K325T-1FFG900CES
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FFG900CES.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K325T-1FFG900CES from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 DSP slices, 14,112 KB of block RAM, and 400 I/O pins in a 900-pin flip-chip fine-pitch BGA (FFG900) package. It operates at -1 speed grade and supports transceiver line rates up to 6.6 Gb/s for high-speed serial interface applications in radar signal processing.
For engineers reviewing the XC7K325T-1FFG900CES datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver capability, logic density, thermal performance in FFG900 packaging, and industrial temperature grade (-40°C to +100°C).
Technical Context
The XC7K325T-1FFG900CES implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and integrated multi-gigabit transceivers (MGTs). It supports PCIe Gen2 x8, SATA, and SRIO protocols via its 16 transceiver quads.
Configuration is performed through JTAG or SelectMAP interfaces, and it includes dual-boot capability with internal configuration memory. The device supports partial reconfiguration and AXI-4 compliant interconnects for system-level integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for complex digital functions |
| DSP Slices | 1,460 - enables parallel multiply-accumulate operations for real-time filtering and FFT acceleration |
| Block RAM | 14,112 KB - supports large on-chip data buffering and FIFO implementation without external memory |
| I/O Pins | 400 - provides high-density parallel interface support for ADC/DAC, memory, and custom peripherals |
| Transceiver Speed | 6.6 Gb/s - enables direct connection to 10G Ethernet PHYs and high-speed serial ADCs |
| Operating Temp | -40°C to +100°C - qualified for extended industrial and aerospace environments |
| Speed Grade | -1 - defines maximum clock frequency timing closure margin for synchronous logic paths |
Pinout & Package
XC7K325T-1FFG900CES is housed in a 900-pin flip-chip fine-pitch BGA (FFG900) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal-enhanced construction for sustained operation at 100°C junction temperature.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, transceivers, and I/O banks |
| MGTAVCC | Transceiver analog supply | 1.0V supply for high-speed transceiver analog circuitry; sensitive to ripple |
| CONFIG_IO | Configuration I/O bank | Dedicated bank for configuration interface (JTAG/SelectMAP); supports 1.8V/3.3V |
| HR_IO | High-range I/O bank | Supports 1.2V–3.3V signaling standards including LVDS, SSTL, HSTL |
| HP_IO | High-performance I/O bank | Optimized for 1.2V–1.8V standards with enhanced timing margins for DDR3 interfaces |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during runtime without full device reset |
| Dual-Boot Configuration | Allows fallback to backup bitstream if primary configuration fails or is corrupted |
| AXI-4 Interconnect Compliance | Guarantees interoperability with ARM-based processors and third-party IP cores |
| PCIe Gen2 x8 Endpoint | Provides native root-complex-compatible interface for host communication without bridge IC |
| Integrated Clock Management | Includes MMCM and PLL blocks supporting jitter cleaning, frequency synthesis, and phase alignment |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: XC7K325T-1FFG900CES serves as the primary digital signal processor handling ADC sample ingestion, FIR filtering, and FFT computation. Use Value: 1,460 DSP slices enable concurrent 128-point FFTs at 200 MHz clock rate with deterministic latency. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: XC7K325T-1FFG900CES acts as the back-end accelerator interfacing with 16-bit ADCs and DDR3 memory buffers. Use Value: 14,112 KB block RAM allows storage of two full 512×512 pixel frames while processing the third. |
| Industrial Machine Vision | Avionics Data Concentrator |
Use Scenario: Sub-millisecond defect detection on high-speed production lines using multi-camera fusion. IC Role / Device Role / Timing Role: XC7K325T-1FFG900CES functions as the central vision controller synchronizing GigE Vision cameras and triggering PLC I/O. Use Value: 400 I/O pins support simultaneous LVDS camera links and isolated digital outputs without expansion. | Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: XC7K325T-1FFG900CES implements deterministic time-triggered communication stacks with hardware timestamping. Use Value: -1 speed grade ensures worst-case path timing closure for 100 µs AFDX frame scheduling deadlines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FFVA1156E | UltraScale architecture, 280K logic cells, higher transceiver count (20 quads), 1550 Mb/s DDR4 interface | Better suited for 4K video processing and 100G Ethernet line cards | Select when migrating to higher bandwidth and lower power per logic cell |
| XC7K410T-1FFG900C | Same Kintex-7 family, 407,200 logic cells, identical FFG900 package, but commercial temp range (0°C to +85°C) | Applicable where extended temperature qualification is not required | Choose for cost-sensitive industrial automation where ambient temperature stays below 85°C |
Compared with XC7K325T-1FFG900CES, XCKU040-1FFVA1156E delivers 2.5× more transceiver bandwidth and DDR4 support but requires PCB redesign due to larger package and different power delivery; XC7K410T-1FFG900C offers higher logic density in same footprint but lacks extended temperature qualification.
Availability
XC7K325T-1FFG900CES is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, industrial machine vision, and avionics data concentrator applications requiring stable component supply across long product lifecycles.
Supply support for XC7K325T-1FFG900CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Kintex-7 FPGA family was designed for cost-optimized, high-performance applications demanding balanced logic, DSP, and I/O resources in industrial and aerospace environments.
FAQ
What is the operating temperature range of XC7K325T-1FFG900CES?
The XC7K325T-1FFG900CES is rated for industrial temperature operation from -40°C to +100°C. This extended range is validated per AMD's qualification testing and supports deployment in harsh environments such as avionics enclosures and outdoor radar housings. The FFG900 package includes thermal vias and copper heat spreader to maintain junction temperature within specification under continuous 100% logic utilization.
Does XC7K325T-1FFG900CES support PCIe Gen3?
No, XC7K325T-1FFG900CES supports PCIe Gen2 x8 natively via its MGT transceivers, with a maximum line rate of 6.6 Gb/s. PCIe Gen3 (8.0 Gb/s) requires UltraScale or newer FPGA families. The XC7K325T-1FFG900CES PCIe hard IP complies with the PCI Express Base Specification Revision 2.1 and includes endpoint and root complex modes.
Can XC7K325T-1FFG900CES be configured via SPI flash?
Yes, XC7K325T-1FFG900CES supports master SPI configuration mode using standard quad-SPI flash devices. It boots from dedicated configuration pins (M0–M2) set to SPI mode and loads the bitstream automatically after power-up. The device also supports fallback to JTAG if SPI configuration fails, ensuring robust field deployment for XC7K325T-1FFG900CES-based systems.
What I/O standards are supported by XC7K325T-1FFG900CES HP banks?
XC7K325T-1FFG900CES HP (high-performance) I/O banks support 1.2V and 1.8V signaling standards including SSTL12, SSTL15, HSTL_I, HSTL_II, and differential standards like LVDS and TMDS. These banks are optimized for DDR3/DDR3L memory interfaces with calibrated output drivers and input delay tuning for timing closure at 800 Mbps data rates.
Is partial reconfiguration supported on XC7K325T-1FFG900CES?
Yes, XC7K325T-1FFG900CES fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic swapping of logic modules-such as filter coefficients or protocol engines-without resetting the entire device. Partial bitstreams for XC7K325T-1FFG900CES are generated using hierarchical design flows and validated for timing and connectivity integrity.
XC7K325T-1FFG900CES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FFG900CES FAQ
1.How can I place an order for XC7K325T-1FFG900CES through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FFG900CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FFG900CES reliable?
The price and inventory of XC7K325T-1FFG900CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FFG900CES is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FFG900CES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FFG900CES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FFG900CES?
XC7K325T-1FFG900CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FFG900CES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FFG900CES?
For technical support, including XC7K325T-1FFG900CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FFG900CES requirements.
6.How does Aetrix verify that XC7K325T-1FFG900CES is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FFG900CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FFG900CES meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FFG900CES?
All XC7K325T-1FFG900CES units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FFG900CES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FFG900CES part is unused and in its original packaging.
Return procedure for XC7K325T-1FFG900CES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K325T-1FFG900CES Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
