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AMD XC7K325T-1FFG900CES9937
- Part No.:
- XC7K325T-1FFG900CES9937
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FFG900CES9937.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,162
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Product details
Overview
XC7K325T-1FFG900CES9937 from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and 1,350 DSP slices, fabricated on 28 nm process technology and operating at -1 speed grade. It serves as a high-performance programmable logic fabric for reconfigurable digital signal processing in radar baseband subsystems.
For engineers reviewing the XC7K325T-1FFG900CES9937 datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and integrated block RAM capacity of 17.9 Mb.
Technical Context
The XC7K325T-1FFG900CES9937 implements a heterogeneous architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and multi-gigabit transceivers (MGTs) supporting PCIe Gen3, SRIO, and CPRI protocols. It includes hardened IP for PCI Express® Gen3 x8 endpoints and 10/100/1000 Ethernet MACs.
Configuration is performed via JTAG, SelectMAP, or SPI interfaces, with support for dual-boot and fallback modes. The device integrates 24 clock management tiles (CMTs), each containing a PLL and MMCM for low-jitter clock synthesis and phase alignment across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| I/O Pins | 1,452 - user-configurable bidirectional pins supporting LVCMOS, LVDS, and differential SSTL standards |
| DSP Slices | 1,350 - dedicated 25×18 multiplier-accumulator units enabling high-throughput FIR filtering and FFT computation |
| Block RAM | 17.9 Mb - distributed and block memory resources usable for FIFOs, buffers, and lookup tables |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GT channel, supporting 10G Ethernet and CPRI Option 7 |
| Speed Grade | -1 - timing specification guaranteeing operation at specified frequencies under industrial temperature range |
| Package | FFG900 - 900-pin flip-chip fine-pitch BGA with 1.0 mm pitch and 31×31 mm body size |
Pinout & Package
The XC7K325T-1FFG900CES9937 is housed in a 900-pin flip-chip BGA (FFG900) package with thermal and mechanical characteristics optimized for high-speed signal integrity and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, JTAG, and select I/O banks; shared with transceiver auxiliary circuits |
| VCCO | I/O bank power | Configurable 1.2–3.3 V supply per I/O bank; determines signaling standard compatibility for connected peripherals |
| MR | Master reset input | Active-low asynchronous reset that clears configuration memory and halts startup sequence until deasserted |
| CCLK | Configuration clock | Input clock for slave serial configuration mode; frequency ≤ 50 MHz; drives internal configuration state machine |
| GTX/GTH RefClk | Transceiver reference clock | Differential input driving PLLs in GTY/GTH transceivers; supports 10 MHz–1.5 GHz range with jitter tolerance < 1 ps RMS |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root complex and endpoint logic enabling plug-and-play host interface without soft IP overhead |
| Multi-Gigabit Transceivers | 32 GTY transceivers with built-in 8B/10B and 64B/66B encoding, supporting protocol stacks up to 13.1 Gb/s |
| Partial Reconfiguration Support | Runtime module swapping capability allowing dynamic logic updates without full device reboot or system interruption |
| AXI Interconnect Infrastructure | Integrated AXI4-Stream and AXI4-Lite interconnect fabric simplifying high-bandwidth data path integration with ARM-based processors |
| UltraScale-Compatible Bitstream | Bitstream format compatible with Vivado 2018.2+ toolchain, enabling migration paths to newer families without redesign |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC sample ingestion, channel equalization, and FFT acceleration. Use Value: 1,350 DSP slices enable concurrent 1024-point FFTs at 200 MS/s aggregate throughput, meeting STANAG 4676 latency requirements. | Use Scenario: High-resolution ultrasound image reconstruction pipeline with real-time noise suppression. IC Role / Device Role / Timing Role: Reconfigurable co-processor interfacing with 16-channel ADCs and feeding GPU-accelerated rendering engines. Use Value: 1,452 I/O pins support simultaneous LVDS capture from 16 × 125 MSPS ADCs while maintaining sub-2 ns inter-channel skew. |
| 5G Wireless Baseband | Industrial Machine Vision |
Use Scenario: Massive MIMO precoding and channel estimation in 5G NR macro base stations. IC Role / Device Role / Timing Role: Protocol-aware baseband accelerator implementing Layer 1 PHY functions including LDPC decoding and OFDM modulation. Use Value: GTY transceivers deliver 13.1 Gb/s CPRI links to remote radio units, eliminating external serializer/deserializer chips. | Use Scenario: Sub-millisecond defect classification on high-speed production lines using CNN inference kernels. IC Role / Device Role / Timing Role: Low-latency vision preprocessing engine performing Bayer demosaicing, lens correction, and ROI extraction prior to AI inference. Use Value: Block RAM capacity of 17.9 Mb enables on-chip buffering of full 4K@60fps sensor frames without external DRAM access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FBVA676E | UltraScale architecture; 384,000 logic cells; higher transceiver count (40 GTY); 16 nm process | Better suited for 25G+ Ethernet and 5G mmWave beamforming requiring >15 Gb/s line rates | Select when migrating to higher bandwidth or lower power-per-GHz; requires PCB redesign due to FBVA676 package |
| XC7VX485T-1FFG1157C | Virtex-7 family; 485,760 logic cells; larger die; no native PCIe Gen3 hard IP | Preferred for ultra-deep pipeline computing where logic density outweighs protocol integration needs | Choose for maximum LUT count in legacy 28 nm footprint; retains FFG1157 mechanical compatibility but not pin-compatible |
Compared with XC7K325T-1FFG900CES9937, the XCKU040 offers higher transceiver bandwidth and lower static power but demands new layout and toolchain upgrades, while the XC7VX485T provides greater logic capacity at the cost of increased power and absence of hardened PCIe Gen3 controllers.
Availability
XC7K325T-1FFG900CES9937 is available at Aetrix Electronics and suitable for radar signal processing, 5G wireless infrastructure, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-1FFG900CES9937 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex-7 family targets cost-optimized high-performance applications such as wireless infrastructure, video processing, and test equipment where balanced logic density, I/O count, and transceiver capability are critical.
FAQ
What is the maximum supported transceiver line rate for XC7K325T-1FFG900CES9937?
The XC7K325T-1FFG900CES9937 supports a maximum transceiver line rate of 13.1 Gb/s per GTY channel. This enables compliance with CPRI Option 7, 10GBASE-R, and PCIe Gen3 x8 protocols. The actual achievable rate depends on PCB stack-up, reference clock quality, and termination design.
Does XC7K325T-1FFG900CES9937 include hardened PCIe Gen3 controller logic?
Yes, XC7K325T-1FFG900CES9937 integrates a hardened PCIe Gen3 x8 endpoint and root complex controller. This eliminates the need for soft IP implementation, reduces resource utilization by ~12,000 LUTs, and guarantees deterministic latency for real-time applications like radar data acquisition.
What I/O standards are supported by XC7K325T-1FFG900CES9937?
XC7K325T-1FFG900CES9937 supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, Differential SSTL, and HSTL I/O standards. Each of its 18 I/O banks can be independently configured for voltage and standard, enabling mixed-voltage interface designs without level shifters.
Is partial reconfiguration supported on XC7K325T-1FFG900CES9937?
Yes, XC7K325T-1FFG900CES9937 fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of functional modules-such as filter coefficients or protocol stacks-without resetting the entire device or interrupting active data paths during operation.
What is the operating temperature range for XC7K325T-1FFG900CES9937?
XC7K325T-1FFG900CES9937 is rated for industrial temperature range: –40 °C to +100 °C case temperature. This rating applies to the -1 speed grade variant and is validated per JEDEC JESD22-A104 reliability testing standards for extended thermal cycling endurance.
XC7K325T-1FFG900CES9937 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FFG900CES9937 FAQ
1.How can I place an order for XC7K325T-1FFG900CES9937 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FFG900CES9937 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FFG900CES9937 reliable?
The price and inventory of XC7K325T-1FFG900CES9937 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FFG900CES9937 is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FFG900CES9937?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FFG900CES9937 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FFG900CES9937?
XC7K325T-1FFG900CES9937 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FFG900CES9937 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FFG900CES9937?
For technical support, including XC7K325T-1FFG900CES9937 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FFG900CES9937 requirements.
6.How does Aetrix verify that XC7K325T-1FFG900CES9937 is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FFG900CES9937 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FFG900CES9937 meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FFG900CES9937?
All XC7K325T-1FFG900CES9937 units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FFG900CES9937, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FFG900CES9937 part is unused and in its original packaging.
Return procedure for XC7K325T-1FFG900CES9937:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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