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AMD XC7K325T-1FFG900I
- Part No.:
- XC7K325T-1FFG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FFG900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,129
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Product details
Overview
XC7K325T-1FFG900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 I/O pins, and -1 speed grade operating at 1.0V core voltage. It integrates 16 DSP slices, 16.5 Mb of block RAM, and supports PCIe Gen2 x8 endpoint functionality in industrial temperature range (-40°C to +100°C). It is used in high-throughput packet processing in telecom line cards.
For engineers reviewing the XC7K325T-1FFG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, and thermal performance under sustained 100% logic utilization.
Technical Context
The XC7K325T-1FFG900I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic acceleration, and 24 transceiver lanes supporting up to 6.6 Gb/s per lane. It includes integrated clock management tiles (CMT) with MMCM and PLL for jitter reduction.
Configuration is performed via JTAG or master/slave SPI BPI mode using external flash. The device supports partial reconfiguration and AXI4-Stream interfaces for high-bandwidth data movement between programmable logic and processing systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for RTL implementation |
| I/O Pins | 1,460 - supports high-density interface routing including DDR3, QDR, and custom parallel buses |
| Block RAM | 16.5 Mb - enables large on-chip buffering for video frame stores or packet queues without external memory |
| DSP Slices | 16 - provides fixed-point multiply-accumulate capability for filtering or FFT kernels |
| Transceivers | 24 × 6.6 Gb/s - delivers 158.4 Gb/s aggregate serial bandwidth for SerDes-based protocols |
| Speed Grade | -1 - guarantees timing closure at 1.0V core supply with specified max frequency for critical paths |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC7K325T-1FFG900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal pad on underside enables direct PCB heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable as PS peripherals (UART, SPI, SDIO) or PL I/O with bank-specific voltage support |
| HR Bank 0–3 | High-Range I/O | Supports 1.8V/2.5V/3.3V signaling with programmable slew rate and drive strength |
| HP Bank 4–13 | High-Performance I/O | Supports 1.2V/1.35V/1.5V/1.8V with sub-ns timing margins for DDR3/DDR4 interfaces |
| GTX Quad 0–5 | Transceiver Group | Each quad contains 4 GTX transceivers sharing reference clocks and power rails |
| VCCINT | Core Supply | 1.0V ±3% regulated input powering CLBs, interconnect, and configuration logic |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables dynamic logic module swapping during operation without full FPGA reset |
| AXI4-Stream Interface | Provides standardized high-throughput streaming data path between PS and PL domains |
| Integrated CMT | Combines MMCM and PLL for <150 fs RMS jitter in clock synthesis and distribution |
| PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4/x8 link widths with full TLP handling and MSI-X interrupt delivery |
| UltraScale-Compatible Bitstream | Allows migration path to UltraScale devices using same toolchain and constraints flow |
Applications
| Telecom Line Card Processing | Industrial Vision System |
|---|---|
Use Scenario: Real-time packet classification and forwarding in 10G Ethernet aggregation nodes. IC Role / Device Role / Timing Role: Programmable logic fabric executing L2/L3 lookup engines and traffic shaping policies. Use Value: 1,460 I/O pins enable concurrent 10G SFP+ and backplane interfaces; 24 transceivers sustain full-duplex line-rate throughput. | Use Scenario: Multi-camera synchronization and pixel-level preprocessing in factory-floor inspection rigs. IC Role / Device Role / Timing Role: FPGA fabric implementing MIPI CSI-2 receivers, Bayer demosaicing, and histogram equalization pipelines. Use Value: HP I/O banks support 1.2V MIPI signaling; 16.5 Mb block RAM buffers full HD frames at 60 fps before CPU offload. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Raw sensor data aggregation and real-time beamforming in ultrasound front-end modules. IC Role / Device Role / Timing Role: High-speed serial receiver interfacing to ADCs, followed by DSP48E1-based FIR filter chains. Use Value: 16 DSP slices execute 128-tap filters at 100 MHz; GTX transceivers capture 16-bit ADC samples at 200 MSPS over JESD204B. | Use Scenario: Arbitrary waveform generation and high-fidelity signal analysis in modular PXI chassis. IC Role / Device Role / Timing Role: Logic fabric synchronizing DAC/ADC sampling clocks and performing digital down-conversion. Use Value: Integrated CMT achieves <150 fs RMS jitter for sub-0.1 dB SNR degradation at 1 GHz IF frequencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 384K logic cells, 540 I/O, 32 GTY transceivers @ 12.5 Gb/s | Higher serial bandwidth and logic density but requires new PCB layout and power delivery design | Select when migrating to higher-speed SerDes or needing >300K LUTs with lower power per logic cell |
| XC7K160T-2FFG676I | Same Kintex-7 family, 162K logic cells, 500 I/O, 16 transceivers, -2 speed grade | Lower I/O count and transceiver count; suitable for cost-optimized mid-range designs | Select when application logic fits within 162K LUTs and only 16 transceivers are required |
Compared with XC7K325T-1FFG900I, XCKU040-2FFVA1156I offers higher transceiver speed and logic capacity but demands new board design, while XC7K160T-2FFG676I shares pin-compatible packaging within the Kintex-7 family and reduces I/O and transceiver count for cost-sensitive deployments.
Availability
XC7K325T-1FFG900I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial vision systems, and medical imaging equipment requiring stable component supply across multi-year production cycles.
Supply support for XC7K325T-1FFG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and AI accelerator technologies.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, I/O, and transceiver resources - optimized for wired communications, video processing, and test instrumentation.
FAQ
What is the maximum supported DDR3 interface speed for XC7K325T-1FFG900I?
The XC7K325T-1FFG900I supports DDR3 interfaces up to 800 MHz data rate (1600 MT/s) using HP I/O banks with calibrated output drivers and IDELAY/ODELAY primitives. This is validated in UG476 for 16-bit and 32-bit configurations with specific termination and layout guidelines.
Does XC7K325T-1FFG900I include hardened PCIe Gen2 endpoints?
Yes, XC7K325T-1FFG900I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. It handles physical layer, data link layer, and transaction layer functions without consuming programmable logic resources.
What configuration modes does XC7K325T-1FFG900I support?
XC7K325T-1FFG900I supports master and slave SPI (x1/x2/x4), JTAG, and BPI parallel configuration modes. Configuration bitstream can be loaded from external flash, host processor, or boundary-scan controller depending on system architecture requirements.
Is XC7K325T-1FFG900I compatible with Vivado Design Suite 2023.1?
Yes, XC7K325T-1FFG900I is fully supported in Vivado Design Suite 2023.1 for synthesis, implementation, simulation, and bitstream generation. Device files and IP integrator components are included in the standard installation.
What thermal management guidance applies to XC7K325T-1FFG900I in continuous operation?
XC7K325T-1FFG900I requires a minimum 25 mm² copper thermal pad beneath the package with ≥4 thermal vias to internal ground planes. Junction-to-board thermal resistance is 12.5°C/W; maximum junction temperature must not exceed 100°C under worst-case power dissipation conditions.
XC7K325T-1FFG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FFG900I FAQ
1.How can I place an order for XC7K325T-1FFG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FFG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FFG900I reliable?
The price and inventory of XC7K325T-1FFG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FFG900I is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FFG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FFG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FFG900I?
XC7K325T-1FFG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FFG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FFG900I?
For technical support, including XC7K325T-1FFG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FFG900I requirements.
6.How does Aetrix verify that XC7K325T-1FFG900I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FFG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FFG900I meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FFG900I?
All XC7K325T-1FFG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FFG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FFG900I part is unused and in its original packaging.
Return procedure for XC7K325T-1FFG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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