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AMD XC7K325T-1FFV900I
- Part No.:
- XC7K325T-1FFV900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-1FFV900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,293
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Product details
Overview
XC7K325T-1FFV900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 DSP slices, and 16.4 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package for high-speed serial interface and embedded vision applications.
For engineers reviewing the XC7K325T-1FFV900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (up to 13.1 Gb/s), thermal performance (-40°C to +100°C junction), and speed grade (-1).
Technical Context
The XC7K325T-1FFV900I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic acceleration, and integrated 6.6 Gb/s to 13.1 Gb/s multi-gigabit transceivers supporting PCIe Gen2/Gen3, SATA, and SRIO protocols.
It supports SelectIO™ technology with programmable I/O standards (LVDS, SSTL, HSTL), on-chip termination, and differential signaling across 500 user-accessible pins; configuration is performed via JTAG, SPI, or BPI interfaces with AES encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUTs+FFs for combinational and sequential logic implementation |
| DSP Slices | 1,460 - fixed-point multiply-accumulate units enabling real-time signal processing |
| Block RAM | 16.4 Mb - distributed memory capacity for buffering, FIFOs, and lookup tables |
| User I/O Pins | 500 - configurable single-ended and differential I/Os with voltage support from 1.2 V to 3.3 V |
| Transceiver Line Rate | 13.1 Gb/s - maximum serial data rate per GT lane for high-bandwidth interconnect |
| Operating Temperature | -40°C to +100°C - industrial-grade junction temperature range for rugged deployment |
| Speed Grade | -1 - timing performance level defining maximum clock frequencies for internal logic paths |
Pinout & Package
XC7K325T-1FFV900I is housed in a 900-ball Flip-Chip Fine-Pitch Ball Grid Array (FFV) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal-enhanced construction for high-power FPGA operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M16 | VCCINT | Core supply input (1.0 V) powering CLBs, DSP slices, and interconnect |
| P15 | VCCAUX | Auxiliary supply (1.8 V) for configuration, clocking, and transceiver reference |
| R14 | VCCO_0 | I/O bank 0 output supply (1.2–3.3 V selectable) for signal level translation |
| T13 | GND | Signal and power return path for adjacent I/O and core domains |
| Y16 | MRCC_L15P | Multi-Region Clock Capable differential input pair for high-skew-tolerance clock routing |
| W15 | GTGREFCLK0 | Reference clock input for GTY transceiver quad operating up to 13.1 Gb/s |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint Support | Integrated hard IP enables low-latency, full-line-rate endpoint operation without soft-core overhead |
| AXI Interconnect Fabric | Configurable AMBA AXI4/AXI4-Lite interface simplifies integration with ARM-based processors and peripherals |
| Partial Reconfiguration | Enables dynamic logic module swapping during runtime for adaptive system behavior |
| Secure Configuration | AES-256 bitstream encryption and HMAC authentication prevent unauthorized programming and cloning |
| UltraScale-Compatible Toolflow | Supports Vivado Design Suite 2018.2+ with synthesis, place-and-route, and timing analysis optimized for Kintex-7 |
Applications
| High-Speed Data Acquisition | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time sensor fusion from multiple ADCs and image sensors in test equipment. IC Role / Device Role / Timing Role: FPGA fabric processes parallel pixel streams and synchronizes timestamped analog samples. Use Value: 13.1 Gb/s transceivers interface directly to high-speed ADCs and CMOS image sensors without bridging chips. | Use Scenario: Embedded vision systems performing defect detection on production lines. IC Role / Device Role / Timing Role: Configurable logic executes custom convolution kernels and manages camera link (CL) or CoaXPress interfaces. Use Value: 1,460 DSP slices accelerate real-time filtering and feature extraction at frame rates up to 120 fps. |
| Communications Baseband Processing | Avionics Data Concentrators |
Use Scenario: LTE and 5G NR physical layer processing in small-cell base stations. IC Role / Device Role / Timing Role: Soft-core processor plus hardware accelerators handle FFT, channel coding, and MIMO precoding. Use Value: 326,080 logic cells accommodate dual-core MicroBlaze with custom datapaths and protocol stacks. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553 bridge modules in flight control systems. IC Role / Device Role / Timing Role: Deterministic packet switching engine with time-triggered scheduling and redundancy management. Use Value: -40°C to +100°C operation ensures reliability in uncontrolled avionics bays without active cooling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 384K logic cells, higher transceiver count (32 GTY), 15G line rate | Better suited for 100G Ethernet and advanced radar beamforming requiring >100K DSP resources | Select when migrating to higher bandwidth or needing hardened 100G MAC/PCS blocks |
| XC7K160T-2FFG676I | Same Kintex-7 family, lower density (162K LC), 676-pin FCBGA, reduced I/O (300) and DSP (600) | Targeted for cost-sensitive, space-constrained designs with moderate compute and I/O needs | Choose for legacy Kintex-7 compatibility where full XC7K325T resources are unnecessary |
Compared with XC7K325T-1FFV900I, XCKU040-2FFVA1156I delivers higher throughput and scalability but requires new PCB layout and toolchain migration, while XC7K160T-2FFG676I offers pin-compatible footprint reduction and lower power at the expense of logic and transceiver capability.
Availability
XC7K325T-1FFV900I is available at Aetrix Electronics and suitable for high-speed communications infrastructure, embedded vision systems, and industrial automation requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-1FFV900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was engineered for balanced performance, power efficiency, and cost in high-throughput, I/O-intensive applications such as wired communications and machine vision.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-1FFV900I?
The XC7K325T-1FFV900I supports a maximum transceiver line rate of 13.1 Gb/s per GTY lane. This capability enables direct interfacing with 10G/25G Ethernet PHYs, CPRI, and high-speed ADC/DAC devices. The XC7K325T-1FFV900I implements 16 GTY transceivers, each configurable for protocols including PCIe Gen3, SATA III, and SRIO 2.1.
Does XC7K325T-1FFV900I support partial reconfiguration?
Yes, XC7K325T-1FFV900I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules during operation without resetting the entire device. The XC7K325T-1FFV900I's configuration logic and frame-based bitstream architecture enable secure, deterministic updates of functional blocks in real time.
What I/O standards are compatible with XC7K325T-1FFV900I?
XC7K325T-1FFV900I supports LVDS, LVPECL, SSTL, HSTL, TMDS, and differential signaling standards across its 500 user I/Os. Each bank operates independently with programmable drive strength, slew rate, and on-die termination. The XC7K325T-1FFV900I also supports mixed-voltage operation with VCCO ranging from 1.2 V to 3.3 V per bank.
Is XC7K325T-1FFV900I qualified for industrial temperature operation?
Yes, XC7K325T-1FFV900I is rated for industrial temperature operation with a junction temperature range of -40°C to +100°C. This qualification meets JEDEC JESD22-A104 and JESD22-A108 standards. The XC7K325T-1FFV900I's FFV900 package includes thermal vias and enhanced copper layers to sustain continuous operation under thermal stress.
What configuration modes does XC7K325T-1FFV900I support?
XC7K325T-1FFV900I supports master SPI, slave SPI, BPI, JTAG, and fallback configuration modes. Bitstream loading can be initiated from external flash, host processor, or boundary-scan controller. The XC7K325T-1FFV900I also provides dual-boot capability and AES-256 encrypted bitstream support for secure field updates.
XC7K325T-1FFV900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-1FFV900I FAQ
1.How can I place an order for XC7K325T-1FFV900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-1FFV900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-1FFV900I reliable?
The price and inventory of XC7K325T-1FFV900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-1FFV900I is usually 5 days.
3.What payment methods are accepted for XC7K325T-1FFV900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-1FFV900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-1FFV900I?
XC7K325T-1FFV900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-1FFV900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-1FFV900I?
For technical support, including XC7K325T-1FFV900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-1FFV900I requirements.
6.How does Aetrix verify that XC7K325T-1FFV900I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-1FFV900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-1FFV900I meets industry standards.
7.What is the process for return or replacement of XC7K325T-1FFV900I?
All XC7K325T-1FFV900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-1FFV900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-1FFV900I part is unused and in its original packaging.
Return procedure for XC7K325T-1FFV900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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