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AMD XC7K325T-2FBG676C
- Part No.:
- XC7K325T-2FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-2FBG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,743
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Product details
Overview
XC7K325T-2FBG676C from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 16.2 Mb of block RAM, configured in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, used in high-throughput data acquisition systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XC7K325T-2FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, and -2 speed grade timing performance across commercial temperature range.
Technical Context
The XC7K325T-2FBG676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb RAM blocks, and integrated Multi-Gigabit Transceivers (MGTs) supporting PCIe Gen2/Gen3, SATA, and SRIO protocols. It includes clock management tiles with MMCM and PLL blocks for jitter reduction and frequency synthesis.
Configuration is performed via JTAG, SPIx4, or SelectMAP interfaces; bitstream encryption and HMAC authentication are supported for secure boot. The device supports partial reconfiguration and AXI4-Stream interconnect for modular system design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUTs + flip-flops for combinatorial and sequential logic implementation |
| DSP Slices | 1,452 - dedicated 25×18 multiplier-accumulator units with pre-adder support for high-speed filtering |
| Block RAM | 16.2 Mb - configurable as 36 Kb or 18 Kb blocks, supporting true dual-port operation |
| Transceiver Line Rate | 13.1 Gbps - maximum serial I/O speed per GT lane, compliant with PCIe Gen3 x8 and 10G Ethernet |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - supports mixed-voltage banks with independent VCCO per bank |
| Speed Grade | -2 - guarantees timing closure at worst-case commercial conditions (0°C to 85°C, VCCINT = 0.95–1.05 V) |
| Package | FBG676 - 676-ball FCBGA, 27×27 mm, 0.8 mm pitch, RoHS-compliant, thermal pad exposed on underside |
Pinout & Package
XC7K325T-2FBG676C is housed in a 676-ball Flip-Chip BGA (FBG676) package with thermal pad and 12 I/O banks. Pin functions are defined by configuration mode and bank voltage settings; dedicated configuration, clock, and transceiver pins are fixed per package drawing UG475 v1.15.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | MRCC_L15P | Primary single-ended clock input for MRCC bank; supports 33 MHz to 800 MHz with phase alignment |
| K17 | SRN | Global asynchronous reset input; active-low, internally pulled-up, synchronous deassertion |
| A13 | MGTREFCLK0P | Dedicated differential reference clock input for GTY transceivers; 100 MHz typical, AC-coupled |
| P15 | VCCINT | Core logic supply (1.0 V); requires low-noise regulation and local decoupling |
| T1 | GND | Signal ground plane connection; tied to internal substrate and thermal pad |
| U2 | VCCAUX | Analog auxiliary supply (1.8 V); powers configuration logic, PLLs, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reboot; verified in Vivado 2022.2 toolflow |
| Secure Boot with HMAC | Prevents unauthorized bitstream loading using SHA-256 hash verification during configuration |
| AXI4-Stream Native Interface | Direct integration with Xilinx IP cores for video, DSP, and packet processing pipelines |
| UltraScale-Compatible Toolchain | Fully supported in Vivado Design Suite 2022.2 with timing analysis, power estimation, and debug probes |
| Thermal Management | Thermal sensor and THERMAL_ALERT output enable real-time junction temperature monitoring |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR detection; GTY transceivers interface with ADC/DAC over JESD204B v1.1. Use Value: 13.1 Gbps transceivers sustain 4× JESD204B lanes at 12.5 Gbps each, enabling 16-bit @ 1.25 GSPS sampling per channel. | Use Scenario: Multi-channel oscilloscope front-end with synchronized 12-bit, 1 GS/s digitization. IC Role / Device Role / Timing Role: Configurable I/O banks condition LVDS inputs; CLBs implement trigger arbitration and deep memory buffering. Use Value: 326,080 logic cells support 16-channel timestamping and pattern-matching logic with sub-ns resolution. |
| PCIe Gen3 Endpoint Acceleration | Industrial Machine Vision |
Use Scenario: FPGA-based co-processor for CPU offload in edge inference servers. IC Role / Device Role / Timing Role: PCIe Gen3 x8 root port endpoint; DMA engines move image tensors between host DRAM and on-chip BRAM. Use Value: -2 speed grade ensures reliable 8 GT/s link training and error-free payload transfer at full bandwidth. | Use Scenario: Embedded vision controller for robotic guidance with multi-camera synchronization. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver + frame buffer manager; uses 16.2 Mb block RAM for triple-buffered 4K@60fps streams. Use Value: Independent I/O banks allow simultaneous 1.2 V MIPI and 3.3 V GPIO signaling without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | Ultrascale architecture, higher DSP density (1,920 slices), 25.8 Mb BRAM, but larger 1156-ball package | Better suited for compute-intensive CNN inference; requires PCB redesign due to different footprint | Select when >1.5× DSP throughput or >20 Mb BRAM is required; not drop-in compatible |
| XC7K160T-2FBG484C | Same Kintex-7 family, lower logic count (162,240 cells), 400 DSP slices, 484-ball package | Targeted at cost-sensitive prototyping or mid-bandwidth communication gateways | Choose for reduced BOM cost and smaller board area where XC7K325T-2FBG676C resources exceed requirements |
Compared with XC7K325T-2FBG676C, XCKU040-2FFVA1156E delivers higher computational density at the cost of layout compatibility, while XC7K160T-2FBG484C offers proportional scaling in logic, DSP, and I/O with mechanical and thermal simplification.
Availability
XC7K325T-2FBG676C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and PCIe Gen3 endpoint acceleration requiring stable component supply and long-term industrial availability.
Supply support for XC7K325T-2FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, AI, and high-performance processing solutions for data centers, embedded systems, and edge devices.
The Kintex-7 family was designed for balanced performance, power efficiency, and cost in high-throughput I/O and DSP-intensive applications such as communications infrastructure and test equipment.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-2FBG676C?
The XC7K325T-2FBG676C supports a maximum transceiver line rate of 13.1 Gbps per GTY lane. This enables compliance with PCIe Gen3 x8, 10GBASE-R, and JESD204B v1.1 standards. The -2 speed grade ensures this performance is guaranteed under commercial temperature and voltage conditions specified in DS182.
Does XC7K325T-2FBG676C support partial reconfiguration?
Yes, XC7K325T-2FBG676C fully supports partial reconfiguration through Vivado Design Suite. This allows runtime swapping of logical modules-such as filter coefficients or protocol stacks-without resetting the entire FPGA fabric or disrupting active I/O channels.
What configuration modes are available for XC7K325T-2FBG676C?
XC7K325T-2FBG676C supports JTAG, Master SPIx4, Slave SPI, and SelectMAP configuration modes. Master SPIx4 is commonly used for fast, single-image boot from QSPI flash; JTAG is preferred for debugging and programming during development.
Is XC7K325T-2FBG676C pin-compatible with other Kintex-7 devices in the FBG676 package?
No, XC7K325T-2FBG676C is not pin-compatible with other Kintex-7 devices in the same FBG676 package. While the ball map is identical, I/O bank assignments, voltage requirements, and transceiver placement differ across density variants, requiring unique PCB layout per part number.
What thermal management features does XC7K325T-2FBG676C include?
XC7K325T-2FBG676C integrates an on-die thermal sensor and THERMAL_ALERT output pin. When junction temperature exceeds user-defined thresholds, the pin asserts to trigger external cooling or safe shutdown. Calibration data is stored in eFUSE and accessible via ICAP interface.
XC7K325T-2FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-2FBG676C FAQ
1.How can I place an order for XC7K325T-2FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-2FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-2FBG676C reliable?
The price and inventory of XC7K325T-2FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-2FBG676C is usually 5 days.
3.What payment methods are accepted for XC7K325T-2FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-2FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
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XC7K325T-2FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-2FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-2FBG676C?
For technical support, including XC7K325T-2FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-2FBG676C requirements.
6.How does Aetrix verify that XC7K325T-2FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-2FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-2FBG676C meets industry standards.
7.What is the process for return or replacement of XC7K325T-2FBG676C?
All XC7K325T-2FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-2FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-2FBG676C part is unused and in its original packaging.
Return procedure for XC7K325T-2FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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