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AMD XC7K325T-2FBG676I
- Part No.:
- XC7K325T-2FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-2FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,376
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Product details
Overview
XC7K325T-2FBG676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 16.3 Mb of block RAM, configured in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with -2 speed grade and industrial temperature range (-40°C to +100°C). It targets high-throughput data processing in radar signal conditioning and PCIe Gen2 endpoint interfaces.
For engineers reviewing the XC7K325T-2FBG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver line rate (up to 6.6 Gb/s), configuration interface (SPIx4/JTAG), and thermal design power (14.9 W typical).
Technical Context
The XC7K325T-2FBG676I implements a fully programmable logic fabric based on 6-input LUTs and distributed RAM, paired with 12 transceiver quads supporting multi-gigabit serial protocols including PCIe Gen2, SATA, and CPRI. Its clocking system includes 24 MMCMs and 12 PLLs for low-jitter frequency synthesis and phase alignment across multiple domains.
Configuration is performed via Master SPI or JTAG, with bitstream encryption enabled through AES-256 and HMAC authentication. The device supports partial reconfiguration and built-in self-test (BIST) for memory and transceivers, meeting functional safety requirements for industrial control systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 1,452 - enables parallel multiply-accumulate operations for FIR filtering and FFT acceleration |
| Block RAM | 16.3 Mb - supports large on-chip buffering for video frame stores or packet queues |
| Transceiver Line Rate | 6.6 Gb/s - meets PCIe Gen2 x8 and SATA III physical layer requirements |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with DDR3-1866 memory and ADC/DAC peripherals |
| Speed Grade | -2 - guarantees timing closure at 640 MHz for internal logic and 1,200 Mbps for DDR3 interfaces |
| Operating Temp | -40°C to +100°C - qualified for industrial and outdoor embedded deployments |
Pinout & Package
XC7K325T-2FBG676I is housed in a 27×27 mm, 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch and exposed thermal pad. Pin assignment follows Xilinx (now AMD) Kintex-7 FPGA pinout standard for FBG676 package variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source (SPI/JTAG) and configuration mode at power-up |
| CCLK | Configuration Clock | Drives master SPI configuration clock; also used for readback and debug operations |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and error detection |
| GTX/GTH RefClk | Transceiver Reference Clock | Accepts differential 10–625 MHz inputs for transceiver PLL locking and jitter cleanup |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate 1.0V core, 1.8V auxiliary, and programmable I/O (1.2–3.3V) supplies enable mixed-voltage board design |
Key Features
| Feature | Design Value |
|---|---|
| AES-256 Bitstream Encryption | Prevents unauthorized cloning and reverse engineering of FPGA configuration data |
| Partial Reconfiguration Support | Enables dynamic function swapping without full system reset or downtime |
| 24 MMCM + 12 PLL Clock Generators | Provides independent, low-jitter clock domains for mixed-signal and high-speed serial subsystems |
| Built-in Memory BIST | Automatically verifies block RAM integrity during startup or maintenance cycles |
| PCIe Gen2 Endpoint Hard IP | Reduces RTL integration effort and ensures compliance with PCI-SIG specification v2.1 |
Applications
| Radar Signal Processing | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT-based spectral analysis; transceivers interface with ADCs sampling at 250 MSPS. Use Value: 1,452 DSP slices deliver >2.1 TFLOPS peak compute for CFAR detection algorithms within deterministic latency. | Use Scenario: High-speed inspection of PCB assemblies using multi-camera synchronized capture and defect classification. IC Role / Device Role / Timing Role: Coordinates four MIPI CSI-2 camera links and runs CNN inference kernels on embedded BRAM and LUT-based accelerators. Use Value: 326,080 logic cells support concurrent image preprocessing pipelines and real-time decision logic at 120 fps. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Digital backend for ultrasound beamformers requiring channel count scaling and harmonic imaging support. IC Role / Device Role / Timing Role: Implements time-aligned digital down-conversion and dynamic receive focusing using 12-bit IQ data streams. Use Value: 16.3 Mb block RAM buffers up to 32 channels of 16-sample-deep IQ data at 40 MHz sample rate. | Use Scenario: Modular PXIe digitizer module capturing transient signals with 14-bit resolution and 250 MS/s sampling. IC Role / Device Role / Timing Role: Manages high-speed ADC interface, real-time decimation, and PCIe Gen2 x4 streaming to host memory. Use Value: Transceivers operate at 5.0 Gb/s to sustain 2 GB/s sustained throughput with sub-100 ns latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | UltraScale architecture, higher DSP density (1,920 slices), 16.3 Gb/s transceivers, 1.8× logic capacity | Targets PCIe Gen3/Gen4, 10G Ethernet, and higher-bandwidth medical imaging systems | Select when migrating to higher serial bandwidth or requiring hardened 10/25G Ethernet MACs |
| XC7K160T-2FBG484I | Same Kintex-7 family, reduced resources (162,240 LCs, 720 DSP slices, 8.8 Mb BRAM), 484-pin FCBGA | Suitable for cost-sensitive industrial controllers and mid-tier test equipment with lower throughput needs | Choose for footprint-constrained designs where XC7K325T-2FBG676I resources exceed requirements |
Compared with XC7K325T-2FBG676I, XCKU035-2FFVA676I offers scalable bandwidth and architectural headroom for next-generation protocols, while XC7K160T-2FBG484I provides a pin-compatible downsized option within the same family-both require validation against timing, thermal, and I/O voltage constraints of the target system.
Availability
XC7K325T-2FBG676I is available at Aetrix Electronics and suitable for radar signal processing, industrial machine vision, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-optimized applications demanding balanced logic, DSP, memory, and I/O resources-targeting wireless infrastructure, video processing, and industrial automation.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7K325T-2FBG676I?
The XC7K325T-2FBG676I supports DDR3-1866 (933 MHz clock) interfaces using its dedicated memory controller hard IP and I/O banks configured for SSTL15. Timing closure is guaranteed at this rate under -2 speed grade with proper PCB layout and termination. The XC7K325T-2FBG676I datasheet specifies tFAW, tRRD, and tRCD parameters compliant with JEDEC DDR3-1866 standards.
Does XC7K325T-2FBG676I include hardened PCIe Gen2 endpoint functionality?
Yes, XC7K325T-2FBG676I integrates a hardened PCIe Gen2 x1/x2/x4 endpoint block compliant with PCI-SIG specification v2.1. This includes PHY, data link, and transaction layers, eliminating the need for external bridge chips. The XC7K325T-2FBG676I supports both root port and endpoint roles depending on configuration, with automatic link training and power management.
What configuration modes are supported by XC7K325T-2FBG676I?
XC7K325T-2FBG676I supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7K325T-2FBG676I also supports dual-boot with fallback bitstream storage and secure configuration via AES-256 decryption keys stored in eFUSE.
Is XC7K325T-2FBG676I qualified for industrial temperature operation?
Yes, the XC7K325T-2FBG676I is rated for industrial temperature range (-40°C to +100°C) and undergoes extended burn-in and characterization per AMD's industrial qualification flow. Thermal performance data-including junction-to-case resistance and max power dissipation-is published in the XC7K325T-2FBG676I thermal reference guide.
Can XC7K325T-2FBG676I perform partial reconfiguration in the field?
Yes, XC7K325T-2FBG676I supports dynamic partial reconfiguration (PR) using the ICAP interface and frame-based bitstream loading. This allows runtime replacement of logic modules without disrupting active functions. The XC7K325T-2FBG676I PR implementation requires specific floorplanning and checkpointed design flows validated in Vivado 2022.2+.
XC7K325T-2FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-2FBG676I FAQ
1.How can I place an order for XC7K325T-2FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-2FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-2FBG676I reliable?
The price and inventory of XC7K325T-2FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-2FBG676I is usually 5 days.
3.What payment methods are accepted for XC7K325T-2FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-2FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-2FBG676I?
XC7K325T-2FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-2FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-2FBG676I?
For technical support, including XC7K325T-2FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-2FBG676I requirements.
6.How does Aetrix verify that XC7K325T-2FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-2FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-2FBG676I meets industry standards.
7.What is the process for return or replacement of XC7K325T-2FBG676I?
All XC7K325T-2FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-2FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-2FBG676I part is unused and in its original packaging.
Return procedure for XC7K325T-2FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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