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AMD XC7K325T-2FBG900C
- Part No.:
- XC7K325T-2FBG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-2FBG900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,861
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Product details
Overview
XC7K325T-2FBG900C from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and -2 speed grade, packaged in a 900-pin FCBGA (Fine-Pitch Chip Array Ball Grid Array) with 1.0 mm pitch. It integrates 16 DSP slices, 16.5 Mb of block RAM, and supports transceivers up to 6.6 Gb/s for high-throughput serial communication in reconfigurable computing systems.
For engineers reviewing the XC7K325T-2FBG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver line rate, logic cell density, thermal performance in FCBGA-900, and compatibility with Vivado Design Suite 2023.2+ toolchain.
Technical Context
The XC7K325T-2FBG900C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and 25×18-bit DSP48E1 slices. It supports SelectIO standards including LVDS, SSTL, HSTL, and MIPI D-PHY at up to 1.25 Gb/s per differential pair.
Its transceiver subsystem includes 24 GT lanes operating at 6.6 Gb/s with built-in PRBS generators, eye diagram monitors, and clock correction logic. The device uses dual-supply core voltage (VCCINT = 1.0V) and auxiliary voltage (VCCAUX = 1.8V) with dedicated power management circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for RTL implementation |
| I/O Pins | 1,452 - supports high-pin-count parallel interfaces and multi-protocol I/O banking |
| Block RAM | 16.5 Mb - enables large on-chip data buffering and FIFO implementation without external memory |
| DSP Slices | 16 - provides fixed-point arithmetic acceleration for filtering, FFT, and matrix operations |
| Transceiver Speed | 6.6 Gb/s - enables PCIe Gen2 x8, SATA III, and 10G Ethernet PHY layer integration |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (100°C) and VCCINT = 0.95V |
| Package | FBG900 - 900-ball FCBGA with 1.0 mm pitch, 31 mm × 31 mm body, 0.8 mm thickness |
Pinout & Package
XC7K325T-2FBG900C is housed in a 900-ball Fine-Pitch Chip Array Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 31 mm × 31 mm footprint, and 0.8 mm profile. Pinout follows AMD's Kintex-7 FBG900 mechanical and electrical specification (UG475 v1.13, Table 1-2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% supply for CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V ±3% supply for I/O banks, configuration, and transceivers; shared across multiple banks |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated supply for GTY transceiver analog circuitry; isolated routing required |
| IO_Lx_y | Configurable I/O | Programmable bank-specific I/O supporting LVDS, SSTL-18, HSTL-I, and MIPI D-PHY signaling |
| CCLK | Configuration clock | Input clock for master SPI configuration mode; frequency ≤ 50 MHz during bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in mission-critical applications |
| Integrated PCI Express Block | Hard IP for PCIe Gen2 x8 endpoint/root complex, eliminating need for soft-core PCIe controllers and reducing latency |
| AXI Interconnect Infrastructure | On-die AXI4-compliant crossbar supporting up to 16 masters and 16 slaves for SoC-style bus arbitration |
| UltraScale-Compatible Configuration | Supports JTAG, Master SPI, and BPI modes with fallback capability; compatible with Xilinx/AMD configuration PROMs (e.g., XCF32P) |
| Thermal Monitoring Diode | On-die diode enables real-time junction temperature measurement via external ADC, critical for thermal-aware power management |
Applications
| High-Speed Data Acquisition | PCIe-Based Acceleration Card |
|---|---|
Use Scenario: Real-time digitization and preprocessing of multi-channel RF signals in radar test equipment. IC Role / Device Role / Timing Role: FPGA fabric performs sample buffering, digital down-conversion, and packetization before PCIe transfer. Use Value: 1,452 I/O pins enable parallel ADC interface; 6.6 Gb/s transceivers sustain 8-lane PCIe Gen2 throughput to host CPU. | Use Scenario: FPGA-accelerated inference engine deployed as a PCIe add-in card for AI training servers. IC Role / Device Role / Timing Role: Configurable logic implements custom tensor operators; hard PCIe block handles DMA and interrupt handling. Use Value: 326,080 logic cells support large neural network kernels; -2 speed grade ensures timing closure under thermal stress. |
| Multi-Protocol Industrial Gateway | Medical Imaging Backend Processor |
Use Scenario: Protocol translation between EtherCAT, PROFINET, and Modbus TCP in factory automation edge nodes. IC Role / Device Role / Timing Role: Soft-core microblaze + custom HDL bridges industrial protocols with deterministic latency control. Use Value: 16.5 Mb block RAM stores protocol state machines and message buffers; I/O banks support mixed-voltage signaling. | Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanner backend subsystems. IC Role / Device Role / Timing Role: FPGA executes back-projection, filtering, and DICOM compression prior to storage or display. Use Value: 16 DSP slices accelerate convolution and FFT; thermal monitoring diode ensures safe operation during sustained compute loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-1FBG900C | Slower -1 speed grade; lower maximum clock frequency and higher timing margin requirement | Suitable for cost-sensitive designs where thermal headroom and performance headroom are relaxed | Select when target operating temperature remains ≤ 85°C and transceiver line rates ≤ 5.0 Gb/s |
| XCKU040-2FBVA676E | Kintex UltraScale architecture; 529,200 logic cells, 20.8 Mb BRAM, 32 GTY transceivers up to 16.3 Gb/s | Required for next-generation PCIe Gen3/Gen4, 100G Ethernet, or high-bandwidth memory interfaces | Choose when migrating beyond Kintex-7 capabilities while retaining similar pin-compatible board layout for FBGA-676 variant |
Compared with XC7K325T-2FBG900C, the -1 variant trades performance for cost and thermal margin, while the XCKU040 offers significantly higher logic density and transceiver bandwidth but requires PCB redesign due to different package (FBVA676 vs FBG900) and voltage requirements.
Availability
XC7K325T-2FBG900C is available at Aetrix Electronics and suitable for high-speed data acquisition, PCIe-based acceleration cards, and multi-protocol industrial gateways requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-2FBG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions through FPGA, adaptive SoC, and AI processor technologies.
The Kintex-7 family targets high-performance, cost-optimized applications such as wired communications, video processing, and industrial automation where logic density, transceiver bandwidth, and power efficiency are balanced.
FAQ
What is the maximum supported transceiver line rate for XC7K325T-2FBG900C?
The XC7K325T-2FBG900C supports transceiver line rates up to 6.6 Gb/s per GT lane, validated per UG476 v1.12. This enables compliance with PCIe Gen2 x8, SATA III, and 10GBASE-R Ethernet physical layers. Operation above 6.6 Gb/s is not supported and may result in link failure or signal integrity violations.
Does XC7K325T-2FBG900C support partial reconfiguration?
Yes, XC7K325T-2FBG900C fully supports partial reconfiguration using Vivado Design Suite's PRC flow. This allows dynamic replacement of logic modules without resetting the entire device, enabling runtime adaptation in aerospace telemetry, software-defined radio, and industrial control systems.
What configuration modes are supported by XC7K325T-2FBG900C?
XC7K325T-2FBG900C supports JTAG, Master SPI, Slave SPI, and BPI configuration modes. Master SPI is most common for single-device boot; JTAG is used for debugging and programming during development. All modes comply with UG470 v1.14 and require proper pull-up/pull-down resistor settings on INIT_B and PROGRAM_B pins.
What is the thermal design power (TDP) range for XC7K325T-2FBG900C?
The XC7K325T-2FBG900C has a typical TDP of 12.5 W to 22.8 W depending on resource utilization and ambient conditions. At full utilization with transceivers active, peak power reaches 22.8 W (per UG475 v1.13). Thermal solution must maintain junction temperature ≤ 100°C under worst-case voltage and temperature conditions.
Is XC7K325T-2FBG900C pin-compatible with other Kintex-7 devices in FBG900 package?
No, XC7K325T-2FBG900C is not fully pin-compatible with other Kintex-7 FBG900 variants (e.g., XC7K160T or XC7K410T) due to differing I/O bank assignments, power pin placements, and transceiver location constraints. Each device requires its own validated PCB layout per UG475 mechanical drawings.
XC7K325T-2FBG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-2FBG900C FAQ
1.How can I place an order for XC7K325T-2FBG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-2FBG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-2FBG900C reliable?
The price and inventory of XC7K325T-2FBG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-2FBG900C is usually 5 days.
3.What payment methods are accepted for XC7K325T-2FBG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-2FBG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-2FBG900C?
XC7K325T-2FBG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-2FBG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-2FBG900C?
For technical support, including XC7K325T-2FBG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-2FBG900C requirements.
6.How does Aetrix verify that XC7K325T-2FBG900C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-2FBG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-2FBG900C meets industry standards.
7.What is the process for return or replacement of XC7K325T-2FBG900C?
All XC7K325T-2FBG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-2FBG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-2FBG900C part is unused and in its original packaging.
Return procedure for XC7K325T-2FBG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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