AMD XC7K325T-2FBG900I

Overview

XC7K325T-2FBG900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and -2 speed grade, packaged in a 900-pin Flip-Chip Ball Grid Array (FCBGA) for high-performance embedded vision and industrial control applications.

For engineers reviewing the XC7K325T-2FBG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver line rate (13.1 Gb/s), block RAM capacity (17.9 Mb), and thermal performance in industrial temperature range (-40°C to +100°C).

Technical Context

The XC7K325T-2FBG900I implements a 28 nm HKMG process architecture with 600 DSP slices, 24 GTX transceivers supporting PCIe Gen3 and SRIO, and integrated configuration memory for single-chip boot. It supports partial reconfiguration and AXI4 interconnect for heterogeneous system integration.

Its -2 speed grade guarantees timing closure at 640 MHz for CLB logic and 1,250 MHz for I/O, with dedicated clock routing networks including 32 global clock buffers and 16 MMCM/PLLs for low-jitter clock synthesis and phase alignment across multiple domains.

Key Specifications

Pinout & Package

XC7K325T-2FBG900I is housed in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC7K325T-2FBG900I, XCKU040-2FFVA1156I offers higher serial bandwidth but lacks integrated ARM cores, while XC7VX485T-2FFG1157I provides greater logic resources at the cost of larger footprint and higher power-making XC7K325T-2FBG900I optimal for balanced SoC-class industrial applications requiring both processing and programmable logic.

Availability

XC7K325T-2FBG900I is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging systems requiring stable component supply across long product lifecycles.

Supply support for XC7K325T-2FBG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client platforms through high-performance CPUs, GPUs, and FPGAs.

The Kintex-7 family targets cost-optimized, high-performance applications where logic density, transceiver bandwidth, and power efficiency must be balanced-especially in industrial, aerospace, and medical equipment.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7K325T-2FBG900I?

The XC7K325T-2FBG900I supports DDR3 interfaces up to 800 MHz data rate (1600 MT/s) using its HP I/O banks with programmable I/O standards and calibrated delay elements. This capability is validated in Xilinx UG470 and confirmed by IBIS simulation models for the FBG900 package. The XC7K325T-2FBG900I includes dedicated memory controller logic and DQS tracking for reliable high-speed operation.

Does XC7K325T-2FBG900I include an integrated ARM processor subsystem?

No, the XC7K325T-2FBG900I is a pure FPGA device without an integrated ARM processing system. It belongs to the Kintex-7 family, which provides only programmable logic, transceivers, and memory resources. For SoC functionality with ARM cores, AMD offers the Zynq-7000 series-not the XC7K325T-2FBG900I. The XC7K325T-2FBG900I requires an external microcontroller or processor for system management.

What is the thermal design power (TDP) of XC7K325T-2FBG900I under typical industrial workload?

The XC7K325T-2FBG900I has a typical thermal design power of 12.5 W at 100°C junction temperature with 50% logic utilization and active transceivers. This value is derived from Xilinx XPE (Xilinx Power Estimator) v2018.3 using default settings for the -2 speed grade and FBG900 package. Actual power varies based on configuration, clock frequencies, and I/O activity-verified in UG482.

Can XC7K325T-2FBG900I be configured via JTAG only, or does it support other methods?

The XC7K325T-2FBG900I supports multiple configuration modes including JTAG, Master SPI, Slave SelectMAP, and BPI. Configuration via quad-SPI flash is commonly used for standalone boot, while JTAG remains essential for debugging and programming during development. All modes are documented in UG470, and the XC7K325T-2FBG900I's CONFIG_IO pins determine the active mode at power-up.

Is XC7K325T-2FBG900I qualified for automotive AEC-Q100 reliability testing?

No, the XC7K325T-2FBG900I is not AEC-Q100 qualified. It is rated for industrial temperature range (-40°C to +100°C) and intended for industrial, medical, and aerospace applications-not automotive. AMD offers separate Automotive-grade Kintex-7 devices (e.g., XCK7Axxx variants) with AEC-Q100 qualification; the XC7K325T-2FBG900I does not carry this certification.