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AMD XC7K325T-2FF676I
- Part No.:
- XC7K325T-2FF676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-2FF676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,502
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Product details
Overview
XC7K325T-2FF676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 16.4 Mb of block RAM, configured in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) package for high-speed serial interface and embedded vision applications.
For engineers reviewing the XC7K325T-2FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver line rate (up to 13.1 Gb/s), speed grade (-2), and industrial temperature range (-40°C to +100°C).
Technical Context
The XC7K325T-2FF676I implements a heterogeneous architecture integrating programmable logic, hardened transceivers, memory controllers, and PCIe Gen2/Gen3 endpoints. It supports JTAG, SelectMAP, and SPI configuration modes with dual-boot capability.
It delivers deterministic timing closure for designs requiring up to 400 MHz system clocking, 24 transceiver quads (96 lanes), and AXI4-compliant interconnect fabric supporting multiple master-slave configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total configurable LUTs+FFs for complex digital logic implementation |
| DSP Slices | 1,452 - dedicated 25×18 multiplier-accumulator units for high-throughput math |
| Block RAM | 16.4 Mb - distributed and block memory resources for on-chip data buffering |
| User I/Os | 400 - LVDS/LVCMOS-compatible pins with programmable drive strength and slew rate |
| Transceiver Speed | 13.1 Gb/s - per lane serial line rate supporting SRIO, CPRI, and 10G Ethernet |
| Speed Grade | -2 - guaranteed timing performance at industrial temperature range (-40°C to +100°C) |
| Package | FF676 - 676-ball flip-chip BGA, 27×27 mm, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC7K325T-2FF676I uses a 676-ball flip-chip BGA (FF676) package with 400 user-configurable I/Os distributed across 16 banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VRP/VRN reference pins per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core logic supply (1.0V ±3%) - must be filtered and decoupled within 10 mm of ball |
| M20 | VCCAUX | Auxiliary supply (1.8V) for configuration, clocking, and transceiver analog circuitry |
| R15 | VCCO_14 | I/O bank 14 output supply (1.2–3.3V selectable) - sets voltage level for all I/Os in bank |
| T13 | VRP_14 | Positive reference for differential standards (e.g., LVDS) in bank 14 |
| U13 | VRN_14 | Negative reference for differential standards in bank 14 |
| P16 | CLK_IN1_M2C | Dedicated single-ended clock input to MMCM #1, routed to clock management tile |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2/Gen3 Endpoint | Integrated root port and endpoint blocks eliminating external bridge ICs and reducing latency |
| 24 GTx Transceiver Quads | 96 high-speed serial lanes supporting protocol stacks without external retimers |
| AXI4 Interconnect Fabric | Configurable crossbar and interconnect IP enabling multi-master SoC-style subsystem integration |
| Partial Reconfiguration Support | Runtime logic module swapping without full device reset - critical for radar and comms waveform agility |
| Industrial Temperature Rating | Guaranteed operation from -40°C to +100°C ambient - validated for extended-life embedded deployments |
Applications
| Wireless Baseband Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time FFT, channel estimation, and MIMO processing in LTE/5G remote radio heads. IC Role / Device Role / Timing Role: Primary baseband processor implementing PHY-layer signal chain with deterministic sub-100 ns latency. Use Value: 1,452 DSP slices enable concurrent 4×4 MIMO matrix inversion at 120 MHz clock; transceivers interface directly to ADC/DAC via JESD204B v1.1. | Use Scenario: High-throughput image reconstruction in CT and MRI systems with real-time motion correction. IC Role / Device Role / Timing Role: Co-processor accelerating iterative back-projection and denoising kernels while offloading host CPU. Use Value: 16.4 Mb block RAM buffers full-slice projection data; AXI4 fabric enables concurrent DMA transfers from four DDR3 controllers. |
| Avionics Data Concentrators | Industrial Machine Vision Controllers |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic network interface controller with time-triggered scheduling and hardware CRC offload. Use Value: -2 speed grade ensures timing closure at 125 MHz AFDX packet parsing clock; 400 I/Os support dual-redundant physical interfaces. | Use Scenario: Multi-camera synchronization and pixel-level defect detection in semiconductor wafer inspection tools. IC Role / Device Role / Timing Role: Vision pipeline orchestrator managing camera triggers, frame buffering, and FPGA-accelerated CNN inference. Use Value: FF676 package provides thermal stability under continuous 24/7 operation; transceivers link to 12 Gbps CoaXPress 2.0 cameras. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA676I | UltraScale architecture, 242K logic cells, higher transceiver density (10.3 Gb/s max), no native PCIe Gen3 endpoint | Better suited for 25G+ Ethernet and DPDK-accelerated packet forwarding; lacks integrated Gen3 root port | Select when migrating to higher bandwidth interconnects and require >300K LUTs |
| XC7K160T-2FF676I | Same Kintex-7 family, 162K logic cells, 720 DSP slices, identical FF676 package footprint and pinout | Lower gate count and DSP count - appropriate for cost-sensitive radar front-end or motor control gateways | Drop-in replacement for scaled-down designs where XC7K325T-2FF676I resources exceed requirements |
Compared with XC7K325T-2FF676I, XCKU040-2FFVA676I offers higher serial bandwidth but requires PCB redesign due to different package and power delivery; XC7K160T-2FF676I shares identical packaging and pin compatibility, enabling direct substitution with reduced resource allocation.
Availability
XC7K325T-2FF676I is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-2FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications.
The Kintex-7 FPGA family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - optimized for wired communications, video processing, and industrial automation.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-2FF676I?
The XC7K325T-2FF676I supports a maximum transceiver line rate of 13.1 Gb/s per lane. This capability enables compliance with JESD204B v1.1, CPRI Option 3, and 10GBASE-R protocols. All 96 transceiver lanes in the XC7K325T-2FF676I operate within this specification under industrial temperature conditions and -2 speed grade timing constraints.
Does XC7K325T-2FF676I include a hard PCIe Gen3 endpoint?
Yes, XC7K325T-2FF676I integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. It supports both root port and endpoint configurations, includes integrated DMA engines, and delivers sub-100 ns transaction latency. The PCIe interface is accessible via dedicated GTY transceivers and AXI4 streaming interfaces in the XC7K325T-2FF676I.
What configuration modes does XC7K325T-2FF676I support?
XC7K325T-2FF676I supports JTAG, Master SelectMAP, Slave SelectMAP, and Serial Peripheral Interface (SPIx4) configuration modes. Dual-boot capability allows storage of two bitstreams in external flash, enabling field-upgradable firmware and fail-safe recovery. Configuration is initiated automatically on power-up using mode pins M[2:0] set to the required boot source.
Is XC7K325T-2FF676I qualified for industrial temperature operation?
Yes, XC7K325T-2FF676I is rated for industrial temperature operation from -40°C to +100°C ambient. This rating is guaranteed under the -2 speed grade and applies to all logic, I/O, and transceiver functionality. Thermal design must maintain junction temperature below 125°C, verified through board-level thermal simulation and validation per Xilinx UG476 guidelines.
What is the block RAM capacity of XC7K325T-2FF676I?
XC7K325T-2FF676I provides 16.4 Mb of total block RAM, composed of 720 BRAM primitives (each 36 Kb). These resources support true dual-port operation, registered outputs, and cascade chaining for deep memory structures. Block RAM is distributed across CLB columns and accessible via dedicated AXI4 interconnect paths in the XC7K325T-2FF676I architecture.
XC7K325T-2FF676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-2FF676I FAQ
1.How can I place an order for XC7K325T-2FF676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-2FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-2FF676I reliable?
The price and inventory of XC7K325T-2FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-2FF676I is usually 5 days.
3.What payment methods are accepted for XC7K325T-2FF676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-2FF676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-2FF676I?
XC7K325T-2FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-2FF676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-2FF676I?
For technical support, including XC7K325T-2FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-2FF676I requirements.
6.How does Aetrix verify that XC7K325T-2FF676I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-2FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-2FF676I meets industry standards.
7.What is the process for return or replacement of XC7K325T-2FF676I?
All XC7K325T-2FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-2FF676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-2FF676I part is unused and in its original packaging.
Return procedure for XC7K325T-2FF676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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