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AMD XC7K325T-2FF900C
- Part No.:
- XC7K325T-2FF900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-2FF900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,763
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Product details
Overview
XC7K325T-2FF900C from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,345 I/O pins, and 1,440 DSP slices, fabricated on 28 nm process technology and operating at -2 speed grade. It integrates dual 622 MHz DDR3 memory controllers and supports PCIe Gen2 x8 endpoint functionality for high-bandwidth data acquisition systems.
For engineers reviewing the XC7K325T-2FF900C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, thermal design power of 14.5 W (typical), and configuration via SPIx4 or JTAG.
Technical Context
The XC7K325T-2FF900C implements a fully programmable logic fabric with CLB-based LUTs and distributed RAM, paired with 24 transceiver blocks supporting protocols including SATA, PCIe, and CPRI. Its clocking system includes 24 MMCMs and 12 PLLs for precise jitter management and multi-domain timing control.
Configuration is performed through Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation in signal processing pipelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for RTL implementation |
| I/O Pins | 1,345 - supports high-pin-count interface aggregation (e.g., parallel ADCs, video buses) |
| DSP Slices | 1,440 - enables concurrent floating-point and fixed-point arithmetic for radar or imaging algorithms |
| Transceiver Line Rate | 13.1 Gbps - meets 10G Ethernet KR/KX4 and CPRI Option 7 physical layer requirements |
| Memory Controller | Dual 622 MHz DDR3 - provides 12.4 GB/s aggregate bandwidth for frame buffer or streaming applications |
| Configuration Interface | Master SPIx4 or JTAG - enables secure, field-upgradable bitstream loading with HMAC verification |
Pinout & Package
XC7K325T-2FF900C is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FF900) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in industrial and aerospace enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O Bank | Configurable as PS peripherals (UART, SPI, I2C, SDIO) or PL I/O with 1.8 V/3.3 V support |
| HR_IO_L[0:69] | High-Range I/O Bank | Supports 1.2–3.3 V signaling; used for DDR3 address/control and high-speed parallel interfaces |
| GTXE2_CHANNEL | Transceiver Lane | Provides full-rate 13.1 Gbps serial link with integrated CDR and 8B/10B encoding |
| CONFIG_M[2:0] | Configuration Mode | Selects boot source: SPIx4, JTAG, or BPI; determines initial bitstream load behavior |
| VCCAUX | Analog Auxiliary Supply | 1.8 V supply for transceivers, PLLs, and configuration logic; requires low-noise regulation |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables dynamic logic module swapping without system reset-critical for adaptive radio or protocol gateways |
| AXI4-Stream Support | Native interface for pipelined data flow between IP cores, reducing handshake overhead in video processing |
| HMAC Authentication | Verifies bitstream integrity using SHA-256 hash; prevents unauthorized firmware modification |
| PCIe Gen2 x8 Endpoint | Direct host CPU attachment with DMA engine and MSI-X interrupt support for low-latency host offload |
| UltraScale-Compatible Toolflow | Uses Vivado 2023.1+ synthesis and implementation tools with timing closure guarantees for -2 speed grade |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing on airborne SAR platforms. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; transceivers interface with ADC/DAC arrays. Use Value: 1,440 DSP slices enable concurrent 1024-point FFTs at 200 MSPS; 13.1 Gbps transceivers sustain raw sensor data ingestion. | Use Scenario: High-resolution ultrasound image reconstruction with parallel channel digitization. IC Role / Device Role / Timing Role: Configurable logic manages 128-channel echo data alignment, filtering, and beam synthesis. Use Value: Dual DDR3 controllers feed 12.4 GB/s to image buffers; HR I/O banks drive LVDS ADC interfaces at 160 MSPS. |
| 5G Baseband Unit | Industrial Vision Inspection |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations with CPRI fronthaul. IC Role / Device Role / Timing Role: Transceivers handle CPRI Option 7 links; CLBs implement channel estimation and precoding. Use Value: 24 GTXE2 transceivers support eight 10.1376 Gbps CPRI lanes; MMCMs generate precise 30.72 MHz sampling clocks. | Use Scenario: Sub-millisecond defect classification on high-speed production lines using CNN inference. IC Role / Device Role / Timing Role: Accelerates convolution layers via DSP-slice-based MAC units; interfaces with CMOS image sensors. Use Value: 326,080 logic cells host custom CNN engines; 1,345 I/O pins route parallel camera interfaces and GPIO triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Higher logic density (505K LC), 20.6 Gbps transceivers, but larger FFVA1156 package and higher TDP (22 W) | Better suited for 5G mmWave PHY where >10 Gbps serial bandwidth is mandatory | Select when requiring >13.1 Gbps line rates or >400K logic cells; verify thermal and PCB footprint compatibility |
| XC7K160T-2FF676C | Fewer logic cells (162K), reduced I/O count (500), same -2 speed grade and 13.1 Gbps transceivers | Targeted at cost-sensitive embedded vision or motor control where full XC7K325T resources are unused | Choose for lower BOM cost and smaller board area when design fits within 162K LC and 500 I/O constraints |
Compared with XC7K325T-2FF900C, XCKU040 offers higher bandwidth and density at increased power and size, while XC7K160T delivers identical speed grade and transceiver performance in a compact, lower-cost form factor suitable for scaled-down implementations.
Availability
XC7K325T-2FF900C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, 5G baseband unit, and industrial vision inspection applications requiring stable component supply across long-lifecycle programs.
Supply support for XC7K325T-2FF900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for data center, communications, and embedded markets.
The Kintex-7 family was engineered for balanced performance, power, and cost in high-throughput signal processing and connectivity applications, targeting aerospace, medical imaging, and wireless infrastructure.
FAQ
What is the maximum supported DDR3 memory speed for XC7K325T-2FF900C?
The XC7K325T-2FF900C integrates dual 622 MHz DDR3 memory controllers, enabling operation at DDR3-1244 data rates (622 MHz clock, 1244 MT/s). This supports up to 12.4 GB/s aggregate bandwidth across both controllers, verified under -2 speed grade conditions with appropriate PCB layout and termination.
Does XC7K325T-2FF900C support PCIe Gen3?
No, XC7K325T-2FF900C supports PCIe Gen2 x8 endpoint functionality only. Its GTXE2 transceivers are rated up to 13.1 Gbps line rate, which exceeds PCIe Gen2 (5 GT/s) but does not meet the 8 GT/s requirement of PCIe Gen3. For Gen3 support, AMD recommends Virtex-7 or UltraScale families.
What configuration modes are available for XC7K325T-2FF900C?
XC7K325T-2FF900C supports Master SPIx4, JTAG, and BPI parallel configuration modes. Configuration mode is selected via CONFIG_M[2:0] pins at power-up. SPIx4 is most common for secure, compact flash-based boot; JTAG is used for debug and programming during development.
Is partial reconfiguration supported on XC7K325T-2FF900C?
Yes, XCK7K325T-2FF900C fully supports partial reconfiguration using Vivado Design Suite. This allows dynamic swapping of logic modules (e.g., filter banks or protocol engines) without resetting the entire device, enabling adaptive systems such as software-defined radios or multi-standard baseband units.
What is the thermal design power (TDP) of XC7K325T-2FF900C?
The typical thermal design power (TDP) of XC7K325T-2FF900C is 14.5 W under representative industrial workload conditions at junction temperature of 85°C. Actual power varies with design utilization, I/O activity, and transceiver usage; AMD XPE tool provides accurate estimates based on user-specific netlist and constraints.
XC7K325T-2FF900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-2FF900C FAQ
1.How can I place an order for XC7K325T-2FF900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-2FF900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-2FF900C reliable?
The price and inventory of XC7K325T-2FF900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-2FF900C is usually 5 days.
3.What payment methods are accepted for XC7K325T-2FF900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-2FF900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-2FF900C?
XC7K325T-2FF900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-2FF900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-2FF900C?
For technical support, including XC7K325T-2FF900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-2FF900C requirements.
6.How does Aetrix verify that XC7K325T-2FF900C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-2FF900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-2FF900C meets industry standards.
7.What is the process for return or replacement of XC7K325T-2FF900C?
All XC7K325T-2FF900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-2FF900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-2FF900C part is unused and in its original packaging.
Return procedure for XC7K325T-2FF900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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