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AMD XC7K325T-2FF900I
- Part No.:
- XC7K325T-2FF900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-2FF900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,447
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Product details
Overview
XC7K325T-2FF900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 DSP slices, 16.3 Mb of block RAM, and 600 I/O pins in a 900-pin Flip-Chip Fine-Pitch BGA (FF900) package. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and supports transceivers up to 12.5 Gb/s for high-speed serial connectivity.
For engineers reviewing the XC7K325T-2FF900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver line rate, logic density, thermal performance in FF900 packaging, and compatibility with Vivado Design Suite 2023.2+ toolchain.
Technical Context
The XC7K325T-2FF900I implements a fully programmable logic fabric based on 28 nm HKMG process technology, with configurable logic blocks (CLBs), distributed RAM, shift registers, and carry chains. It integrates 24 multi-gigabit transceivers (MGTs) supporting protocols including PCIe Gen3, SATA, and CPRI.
Configuration is performed via JTAG, SelectMAP, or SPI interface using external configuration memory. The device supports partial reconfiguration and includes hardened IP blocks for PCI Express® Gen3 x8 endpoint/root complex, Gigabit Ethernet MAC, and AXI interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| DSP Slices | 1,460 - dedicated arithmetic units supporting 25×18-bit multiply-accumulate operations per slice |
| Block RAM | 16.3 Mb - configurable dual-port RAM blocks used for data buffering, FIFOs, and lookup tables |
| Transceivers | 24 × 12.5 Gb/s - serial I/O lanes compliant with PCIe Gen3, SATA III, and SRIO v2.1 standards |
| I/O Pins | 600 - user-configurable single-ended and differential I/O banks supporting LVDS, SSTL, HSTL, and TMDS signaling |
| Speed Grade | -2 - timing specification guaranteeing operation at maximum frequency under industrial temperature conditions |
| Package | FF900 - 900-ball flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
XC7K325T-2FF900I is housed in a 900-ball Flip-Chip Fine-Pitch BGA (FF900) package with 35 rows × 35 columns, ball pitch of 1.0 mm, and thermal pad center. Pinout follows AMD's Kintex-7 FF900 standard layout with dedicated configuration, clock, JTAG, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain output indicating successful completion of configuration loading sequence |
| E17 | INIT_B | Active-low open-drain output signaling device initialization status during power-up or reconfiguration |
| H17 | CCLK | Configuration clock input for master serial or slave parallel configuration modes |
| M22 | M0–M2 | Mode pins selecting configuration source (JTAG, SPI, BPI, or SelectMAP) |
| A12 | VRN/VRP | Differential reference voltage pair for I/O bank calibration and termination control |
| P15 | CLK_IN1_M2C | Primary differential clock input for MGT bank 2, supporting 100 MHz–1.2 GHz reference frequencies |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in real-time applications |
| PCIe Gen3 x8 Hard IP | Integrated endpoint/root complex core eliminating need for soft IP synthesis and reducing latency by >40% vs. soft implementation |
| AXI Interconnect Infrastructure | Pre-verified AMBA AXI4/AXI4-Lite crossbar supporting up to 16 masters and 16 slaves with QoS arbitration |
| UltraScale-Compatible Toolflow | Fully supported in Vivado 2023.2+ with timing closure, power analysis, and bitstream generation validated for -2 speed grade |
| Industrial Temp Range | Guaranteed operation from –40°C to +100°C junction temperature, enabling deployment in harsh environments without derating |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems requiring low-latency deterministic response. IC Role / Device Role / Timing Role: Primary logic fabric hosting custom FFT engines, digital down-converters, and DMA controllers synchronized to 125 MHz system clock. Use Value: 326,080 logic cells and 1,460 DSP slices enable concurrent execution of 16-channel FFTs at 2.4 GSPS aggregate throughput. | Use Scenario: High-resolution CT/MRI image reconstruction pipeline with real-time motion correction and noise filtering. IC Role / Device Role / Timing Role: Accelerator co-processor interfacing with ARM-based host via AXI4 bus and managing 12 Gb/s DDR3 memory bandwidth. Use Value: 16.3 Mb block RAM provides on-chip frame buffering for 4K×4K pixel matrices while minimizing off-chip DRAM access latency. |
| 5G Wireless Baseband | Industrial Vision Control |
Use Scenario: Massive MIMO baseband processing unit handling 64×64 antenna array modulation/demodulation in sub-6 GHz 5G NR infrastructure. IC Role / Device Role / Timing Role: Baseband processor implementing OFDM symbol generation, channel estimation, and LDPC decoding using hardened DSP slices and transceivers. Use Value: 24 × 12.5 Gb/s transceivers support CPRI/OBSAI fronthaul links and 100G Ethernet backhaul with <1.2 μs end-to-end latency. | Use Scenario: Multi-camera machine vision system performing real-time defect detection on high-speed production lines. IC Role / Device Role / Timing Role: Vision coprocessor receiving 8× MIPI CSI-2 streams, executing CNN inference kernels, and triggering pneumatic actuators via GPIO. Use Value: 600 I/O pins support simultaneous connection to 8 camera sensors, FPGA-to-ASIC bridge, and industrial I/O expansion modules without multiplexing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K355T-2FF900I | Higher logic density (354,240 LCs), same FF900 package and speed grade, +8.5% DSP slices | Targeted for larger algorithm partitions requiring additional routing resources and higher gate count | Select when design exceeds XC7K325T-2FF900I resource utilization by >12% in Vivado post-route report |
| XCKU040-2FFVA1156I | Ku-series UltraScale architecture, 331,200 logic cells, 1,920 DSP slices, 24.7 Mb BRAM, 1156-pin FCBGA | Supports higher transceiver rates (16.3 Gb/s), PCIe Gen4, and advanced memory interfaces (DDR4, RLDRAM3) | Choose for new designs requiring Gen4 PCIe, higher memory bandwidth, or future-proofing beyond Kintex-7 roadmap |
Compared with XC7K325T-2FF900I, XC7K355T-2FF900I offers incremental capacity within identical footprint and toolflow, while XCKU040-2FFVA1156I delivers architectural advancement at cost and layout change premium.
Availability
XC7K325T-2FF900I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, 5G wireless baseband, and industrial vision control requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-2FF900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and edge applications.
The Kintex-7 family targets high-performance, cost-sensitive applications such as wired communications, video processing, and test equipment where balanced logic, DSP, and I/O resources are critical.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-2FF900I?
The XC7K325T-2FF900I supports a maximum transceiver line rate of 12.5 Gb/s across its 24 multi-gigabit transceivers. This enables compliance with PCIe Gen3, SATA III, and CPRI protocols. Line rate is guaranteed under industrial temperature conditions and requires proper PCB stackup and reference clock jitter below 0.3 ps RMS for stable operation. The XC7K325T-2FF900I does not support 16.3 Gb/s or higher rates found in UltraScale devices.
Does XC7K325T-2FF900I support partial reconfiguration?
Yes, XC7K325T-2FF900I fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logic modules without resetting the entire device. This capability is validated for use cases including runtime protocol switching and adaptive filter updates. Configuration bitstreams must be generated using the PR flow in Vivado 2023.2+, and the XC7K325T-2FF900I requires external configuration memory with dual-bank support for seamless swap.
What configuration modes are supported by XC7K325T-2FF900I?
XC7K325T-2FF900I supports four primary configuration modes: JTAG, Master SPI, Slave SelectMAP, and Boundary Scan. Mode selection is controlled by M0–M2 pins at power-up. JTAG is used for debugging and programming; SPI is common for compact flash-based boot; SelectMAP enables high-speed parallel loading. All modes are electrically and functionally verified for XC7K325T-2FF900I in industrial temperature range.
Is XC7K325T-2FF900I compatible with Vivado 2024.1?
Yes, XC7K325T-2FF900I is fully supported in Vivado 2024.1, including synthesis, implementation, timing analysis, and bitstream generation. Device files, IP integrator catalogs, and constraint templates for XC7K325T-2FF900I are included out-of-the-box. Backward compatibility with 2023.2 toolchain ensures consistent timing closure and power estimation results across both versions for the XC7K325T-2FF900I.
What is the I/O voltage range supported per bank on XC7K325T-2FF900I?
XC7K325T-2FF900I supports I/O voltages from 1.2 V to 3.3 V per bank, with each of the 14 I/O banks independently configurable. Bank-specific VCCO and VRN/VRP references must be supplied externally. LVDS, SSTL-18, HSTL-I, and TMDS signaling standards are supported, but mixing incompatible standards within the same bank is prohibited. This flexibility allows direct interfacing with legacy and modern peripherals in the XC7K325T-2FF900I design.
XC7K325T-2FF900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-2FF900I FAQ
1.How can I place an order for XC7K325T-2FF900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-2FF900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-2FF900I reliable?
The price and inventory of XC7K325T-2FF900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-2FF900I is usually 5 days.
3.What payment methods are accepted for XC7K325T-2FF900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-2FF900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-2FF900I?
XC7K325T-2FF900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-2FF900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-2FF900I?
For technical support, including XC7K325T-2FF900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-2FF900I requirements.
6.How does Aetrix verify that XC7K325T-2FF900I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-2FF900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-2FF900I meets industry standards.
7.What is the process for return or replacement of XC7K325T-2FF900I?
All XC7K325T-2FF900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-2FF900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-2FF900I part is unused and in its original packaging.
Return procedure for XC7K325T-2FF900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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