AMD XC7K325T-2FFG676C

Overview

XC7K325T-2FFG676C from AMD (Xilinx) is a Kintex-7 FPGA with 326,080 logic cells, 1,460 DSP slices, 16.3 Mb of block RAM, and 480 I/Os in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It operates at -2 speed grade and supports industrial temperature range (0°C to 85°C), commonly deployed in high-throughput packet processing systems.

For engineers reviewing the XC7K325T-2FFG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver line rate (13.1 Gb/s), DSP resource density, thermal envelope, and PCIe Gen3 endpoint compatibility.

Technical Context

The XC7K325T-2FFG676C implements a 28 nm HKMG process-based architecture with 24 GTX transceivers supporting 6.6–13.1 Gb/s line rates and integrated PCIe Gen3 x8 endpoint logic. It includes dual 36 Kb block RAM primitives and configurable I/O banks supporting LVDS, SSTL, HSTL, and MIPI standards.

Configuration is performed via Master SelectMAP or JTAG, with support for AES-256 bitstream encryption and SEU mitigation using built-in EDAC on configuration memory. The device integrates hardened clock management tiles (CMT) with MMCM and PLL blocks for low-jitter clock synthesis.

Key Specifications

Pinout & Package

XC7K325T-2FFG676C is housed in a 676-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 27×27 array, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Thermal pad on underside enables conduction cooling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC7K325T-2FFG901C, the XC7K325T-2FFG676C offers identical logic capacity in a smaller footprint and lower I/O count-ideal for space-constrained industrial systems. Against XCKU035-2FFVA676I, it trades Gen4 and higher logic density for proven maturity, lower cost, and simpler timing closure in established Kintex-7 toolflows.

Availability

XC7K325T-2FFG676C is available at Aetrix Electronics and suitable for high-speed data acquisition, wireless baseband processing, and industrial machine vision applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XC7K325T-2FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, AI, networking, and embedded markets.

The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, DSP, and I/O resources-targeting communications infrastructure, medical imaging, and test & measurement equipment.

FAQ

What is the maximum transceiver line rate supported by XC7K325T-2FFG676C?

The XC7K325T-2FFG676C supports GTX transceivers with a maximum line rate of 13.1 Gb/s. This enables direct JESD204B subclass 1 connectivity to high-speed ADCs and DACs, and supports SFP+ and CPRI protocols. The actual achievable rate depends on PCB interconnect quality, reference clock stability, and signal integrity margin.

Does XC7K325T-2FFG676C include hardened PCIe Gen3 logic?

Yes, XC7K325T-2FFG676C integrates a hardened PCIe Gen3 x8 endpoint block. This eliminates the need for a soft PCIe core, reduces resource utilization, and guarantees timing closure for PCIe interface implementation. The block supports both root port and endpoint configurations with full TLP handling and error reporting.

What configuration modes does XC7K325T-2FFG676C support?

XC7K325T-2FFG676C supports multiple configuration modes including Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial. Mode selection is controlled by M0–M2 pins at power-on reset. Configuration can be performed from SPI flash, BPI flash, or external processor via parallel or serial interfaces.

Is XC7K325T-2FFG676C suitable for aerospace or avionics applications?

XC7K325T-2FFG676C is rated for industrial temperature (0°C to 85°C) and includes SEU detection and correction for configuration memory. While not radiation-hardened or QML-certified, its reliability features make it suitable for non-safety-critical avionics subsystems such as data concentrators and display processors where commercial-grade assurance suffices.

What I/O standards are supported by XC7K325T-2FFG676C?

XC7K325T-2FFG676C supports LVDS, LVPECL, SSTL, HSTL, MIPI D-PHY, and single-ended standards including LVCMOS across its 12 I/O banks. Each bank is independently voltage-controlled, enabling simultaneous operation with 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without external level shifters.