AMD XC7K325T-2FFG676I

Overview

XC7K325T-2FFG676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and -2 speed grade, configured in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-performance embedded vision and industrial control applications.

For engineers reviewing the XC7K325T-2FFG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver line rate (13.1 Gb/s), block RAM capacity (17.9 Mb), and thermal performance in extended industrial temperature range (-40°C to +100°C).

Technical Context

The XC7K325T-2FFG676I implements a 28 nm HKMG process architecture with integrated multi-gigabit transceivers supporting PCIe Gen3, SATA, and SRIO protocols. It includes hardened IP blocks for memory controllers (DDR3/DDR2/LPDDR3), clock management (MMCM/PLL), and configuration security (AES/SHA-256).

Its logic fabric comprises CLBs with 6-input LUTs and dual flip-flops per slice, while DSP48E1 slices deliver 18×25-bit multiply-accumulate operations at up to 450 MHz. Configuration occurs via Master SPI, SelectMAP, or JTAG interfaces with fallback support.

Key Specifications

Pinout & Package

XC7K325T-2FFG676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system-on-module applications.

Compared with XC7K410T-2FFG901I and XC7K160T-2FFG676I, the XC7K325T-2FFG676I delivers optimal balance of logic capacity, I/O flexibility, and thermal efficiency in standard 676-ball layouts-making it preferred for mid-scale embedded vision and avionics data concentrators where scalability and board reuse matter.

Availability

XC7K325T-2FFG676I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC7K325T-2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.

The Kintex-7 family targets high-performance, cost-optimized applications such as wireless infrastructure, video processing, and industrial automation where balanced logic, I/O, and transceiver resources are critical.

FAQ

What is the maximum supported DDR3 memory data rate for XC7K325T-2FFG676I?

The XC7K325T-2FFG676I supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s) with 64-bit bus width and optional ECC. This capability is implemented via its hardened memory controller IP block, which is fully integrated into the device and validated across voltage and temperature corners for industrial operation.

Does XC7K325T-2FFG676I support partial reconfiguration?

Yes, the XC7K325T-2FFG676I supports partial reconfiguration through Xilinx Vivado Design Suite tools. This allows dynamic swapping of logic modules without resetting the entire device, enabling runtime adaptation in applications like protocol gateways or multi-standard RF front-ends where functional modes change on-the-fly.

What configuration security features are built into XC7K325T-2FFG676I?

The XC7K325T-2FFG676I includes AES-256 bitstream encryption and SHA-256 authentication to protect intellectual property and prevent unauthorized configuration. These features are hardware-accelerated and operate transparently during configuration, requiring no external security ICs or firmware intervention.

Can XC7K325T-2FFG676I operate in extended industrial temperature range?

Yes, the XC7K325T-2FFG676I is rated for -40°C to +100°C ambient operation and is qualified to meet extended industrial temperature specifications. Its thermal design-including FC-FBGA package with thermal lid and optimized power delivery-ensures reliable timing closure and signal integrity across this full range.

Which transceiver protocols are natively supported by XC7K325T-2FFG676I?

The XC7K325T-2FFG676I includes 16 multi-gigabit transceivers supporting native protocols including PCIe Gen3, SATA Gen3, SRIO Gen2, and CPRI. These are implemented in hardened logic with protocol-specific PHY layers, eliminating need for soft-core implementations and reducing latency and resource usage.