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AMD XC7K325T-2FFG900C
- Part No.:
- XC7K325T-2FFG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-2FFG900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,087
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Product details
Overview
XC7K325T-2FFG900C from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,344 DSP slices, and 16.4 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and embedded vision applications.
For engineers reviewing the XC7K325T-2FFG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, and -2 speed grade timing performance across commercial temperature range.
Technical Context
The XC7K325T-2FFG900C implements a heterogeneous architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and 24 transceivers supporting protocols including PCIe Gen3, SATA, and CPRI. It integrates dual 32-bit AXI interconnects and supports partial reconfiguration.
Configuration is performed via JTAG, Master SPI, or BPI mode using external flash memory. The device includes integrated clock management tiles (CMTs) with MMCM and PLL blocks for jitter reduction and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| DSP Slices | 1,344 - fixed-point arithmetic units supporting multiply-accumulate operations at up to 450 MHz |
| Block RAM | 16.4 Mb - distributed as 720 x 36 Kb BRAM primitives usable as memory or FIFO buffers |
| Transceivers | 24 × GTX - serial I/O supporting 600 Mbps to 13.1 Gbps line rates with built-in 8b/10b and 64b/66b encoding |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS, TMDS - supports mixed-voltage operation across banks with independent VCCO per bank |
| Speed Grade | -2 - guarantees timing closure at worst-case commercial conditions (0°C to 85°C, VCCINT = 1.0V ±3%) |
| Package | FFG900 - 900-ball flip-chip FBGA, 31 mm × 31 mm, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC7K325T-2FFG900C uses a 900-ball flip-chip fine-pitch BGA (FFG900) package with 12 I/O banks, each supporting independent VCCO and VREF. Power delivery includes 12 dedicated VCCINT pins, 16 VCCAUX pins, and 4 VCCAUX_IO pins. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for master SPI/BPI configuration mode; driven by external source or internal oscillator |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and detecting CRC errors during load |
| M0–M2 | Mode Selection | Three-pin bus selecting configuration mode (JTAG, Master SPI, Slave Serial, etc.) at power-up |
| GTX/GTH RefClk | Transceiver Reference Clock | Dedicated differential inputs for transceiver PLL reference clocks, supporting frequencies from 10 MHz to 850 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in radar and comms systems |
| Dual 32-bit AXI Interconnect | Provides scalable, low-latency data path between processor subsystems and custom IP in Zynq-7000 compatible designs |
| Integrated Clock Management (CMT) | Combines MMCM and PLL for sub-100 fs jitter synthesis across multiple clock domains with phase alignment |
| PCIe Gen3 x8 Endpoint | Hard IP block delivering 8 GT/s per lane with integrated TLP handling and error reporting for host interface acceleration |
| UltraScale-Compatible Bitstream | Enables migration path to UltraScale+ devices using same toolflow and constraints, reducing redesign effort |
Applications
| High-Speed Data Acquisition | Multi-Antenna Wireless Baseband |
|---|---|
Use Scenario: Real-time digitization and preprocessing of multi-channel analog sensor data in test equipment and medical imaging systems. IC Role / Device Role / Timing Role: FPGA fabric performs parallel FFT, filtering, and packetization before transmission over PCIe or Ethernet. Use Value: 1,344 DSP slices enable simultaneous 1024-point FFTs across 16 channels at 200 MS/s aggregate sample rate. | Use Scenario: Digital pre-distortion (DPD) and MIMO signal processing in LTE-Advanced and 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms with real-time feedback loop latency under 500 ns. Use Value: GTX transceivers deliver deterministic 13.1 Gbps links to RFICs, maintaining <1 ps RMS jitter for EVM-sensitive modulation. |
| Industrial Machine Vision | Avionics Display Processing |
Use Scenario: High-resolution image stitching, defect detection, and protocol bridging (e.g., Camera Link to USB3 Vision) in automated optical inspection. IC Role / Device Role / Timing Role: Parallel pixel pipeline processes 4× 12-bit 80 MP/s sensors with sub-pixel interpolation and HDR fusion. Use Value: 16.4 Mb block RAM provides frame buffering for three full 4K@60fps frames with zero external DRAM dependency. | Use Scenario: ARINC 661-compliant cockpit display generation with multi-layer composition and real-time graphics rendering. IC Role / Device Role / Timing Role: Dedicated video processing pipeline handles gamma correction, color space conversion, and overlay blending at 60 Hz refresh. Use Value: -2 speed grade ensures deterministic timing for dual 1920×1080@60Hz LVDS outputs with <5 ns skew across all 24 lanes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-performance digital signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K410T-2FFG900C | Higher logic capacity (407,200 CLBs), +25% DSP slices, same package and speed grade | Required for larger algorithm footprints or additional protocol stacks (e.g., adding CPRI + OBSAI) | Select when design exceeds XC7K325T resource utilization by >15% in post-route analysis |
| XC7K160T-2FFG676C | Reduced logic (162,240 CLBs), 600 DSP slices, 676-ball FFG676 package, lower I/O count | Suitable for cost-optimized edge nodes where PCIe Gen2 and single 10G Ethernet suffice | Choose for compact form factor and lower BOM cost where transceiver count and memory bandwidth are relaxed |
Compared with XC7K410T-2FFG900C and XC7K160T-2FFG676C, the XC7K325T-2FFG900C delivers optimal balance of transceiver bandwidth, DSP throughput, and I/O flexibility for mid-tier 5G infrastructure and embedded vision platforms without over-provisioning resources.
Availability
XC7K325T-2FFG900C is available at Aetrix Electronics and suitable for high-speed data acquisition, multi-antenna wireless baseband, and industrial machine vision applications requiring stable component supply across extended production lifecycles.
Supply support for XC7K325T-2FFG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, AI acceleration, and high-performance processors and FPGAs for data center, edge, and embedded markets.
The Kintex-7 family targets cost-optimized high-performance applications including wired communications, video processing, and test & measurement, emphasizing transceiver density and DSP efficiency per watt.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-2FFG900C?
The XC7K325T-2FFG900C supports GTX transceivers with a maximum line rate of 13.1 Gbps. This capability enables compliance with PCIe Gen3, 10GBASE-R, and CPRI Option 10 standards. The actual achievable rate depends on PCB layout quality, reference clock stability, and channel loss characteristics.
Does XC7K325T-2FFG900C support partial reconfiguration?
Yes, XC7K325T-2FFG900C fully supports partial reconfiguration through Vivado Design Suite. This allows runtime modification of designated logic regions while keeping the rest of the design operational - critical for adaptive radio and real-time signal processing applications where uninterrupted operation is required.
What configuration modes are available for XC7K325T-2FFG900C?
XC7K325T-2FFG900C supports JTAG, Master SPI, Slave Serial, and Boundary Scan configuration modes. Mode selection is controlled by the M0–M2 pins at power-up. Master SPI is commonly used for fast, single-image boot from quad-SPI flash, while JTAG remains standard for debugging and programming.
Is XC7K325T-2FFG900C pin-compatible with other Kintex-7 devices in the FFG900 package?
No, XC7K325T-2FFG900C is not pin-compatible with other Kintex-7 FFG900 variants such as XC7K410T-2FFG900C. Although both use the same 900-ball footprint, I/O bank assignments, VCCO groupings, and transceiver locations differ significantly due to internal resource distribution variations.
What is the operating temperature range for XC7K325T-2FFG900C?
XC7K325T-2FFG900C is rated for commercial temperature operation from 0°C to +85°C ambient. This rating applies under specified voltage tolerances (VCCINT = 1.0V ±3%, VCCAUX = 1.8V ±3%) and is validated per AMD's Kintex-7 DC and switching characteristics documentation.
XC7K325T-2FFG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-2FFG900C FAQ
1.How can I place an order for XC7K325T-2FFG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-2FFG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-2FFG900C reliable?
The price and inventory of XC7K325T-2FFG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-2FFG900C is usually 5 days.
3.What payment methods are accepted for XC7K325T-2FFG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-2FFG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-2FFG900C?
XC7K325T-2FFG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-2FFG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-2FFG900C?
For technical support, including XC7K325T-2FFG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-2FFG900C requirements.
6.How does Aetrix verify that XC7K325T-2FFG900C is sourced from the original manufacturer or authorized distributors?
All XC7K325T-2FFG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-2FFG900C meets industry standards.
7.What is the process for return or replacement of XC7K325T-2FFG900C?
All XC7K325T-2FFG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-2FFG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-2FFG900C part is unused and in its original packaging.
Return procedure for XC7K325T-2FFG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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