AMD XC7K325T-2FFG900I

Overview

XC7K325T-2FFG900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 16.2 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and embedded vision applications.

For engineers reviewing the XC7K325T-2FFG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver line rates up to 13.1 Gb/s, and -2 speed grade timing performance across industrial temperature range (-40°C to +100°C).

Technical Context

The XC7K325T-2FFG900I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb RAM blocks, and integrated multi-gigabit transceivers (MGTs) supporting PCIe Gen2/Gen3, SATA, and SRIO protocols. It includes dedicated clock management tiles (CMTs) with MMCM and PLL blocks for low-jitter clock synthesis.

It supports SelectIO™ technology with programmable I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY, and features partial reconfiguration capability and built-in system monitoring via on-chip temperature and supply sensors.

Key Specifications

Pinout & Package

XC7K325T-2FFG900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XC7K410T-2FFG900I and XC7K160T-2FFG676I, the XC7K325T-2FFG900I delivers optimal balance of transceiver bandwidth, logic capacity, and thermal profile for mid-tier embedded vision and communications platforms-avoiding overdesign while maintaining upgrade path to higher-density Kintex-7 variants.

Availability

XC7K325T-2FFG900I is available at Aetrix Electronics and suitable for medical imaging systems, industrial machine vision platforms, and avionics data concentrators requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC7K325T-2FFG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency and heterogeneous integration.

The Kintex-7 family targets high-performance, cost-optimized applications such as wired communications, video processing, and aerospace systems-designed to deliver scalable logic, DSP, and transceiver resources without ultra-high-end pricing.

FAQ

What is the maximum transceiver line rate supported by XC7K325T-2FFG900I?

The XC7K325T-2FFG900I supports a maximum transceiver line rate of 13.1 Gb/s per GT lane. This enables compliance with PCIe Gen3 x4, 10G Ethernet KR, and SRIO Gen2 protocols. The transceiver architecture includes built-in clock data recovery (CDR) and adaptive equalization, and all GT lanes are fully functional in the -2 speed grade at industrial temperature range.

Does XC7K325T-2FFG900I support partial reconfiguration?

Yes, XC7K325T-2FFG900I supports hardware-accelerated partial reconfiguration through Xilinx Vivado Design Suite. This allows dynamic swapping of logic modules-such as protocol engines or filter kernels-without resetting the entire device. The feature is silicon-verified and documented in UG909, enabling use cases like adaptive radar waveform updates and multi-standard wireless baseband switching.

What I/O standards are supported by XC7K325T-2FFG900I banks?

XC7K325T-2FFG900I supports 21 I/O standards across its banks, including LVDS, SSTL-18/25, HSTL-I/III, MIPI D-PHY v1.2, and differential signaling modes with internal termination. Each bank operates independently with selectable VCCO (1.2V–3.3V), and DCI calibration ensures impedance matching for high-speed traces up to 1 GHz.

Is XC7K325T-2FFG900I qualified for industrial temperature operation?

Yes, XC7K325T-2FFG900I is rated for industrial temperature operation from -40°C to +100°C. This qualification includes full timing closure at the -2 speed grade under worst-case voltage and temperature corners, and the device undergoes extended burn-in and thermal cycling per JEDEC JESD22-A108. No derating is required within this range.

What configuration modes does XC7K325T-2FFG900I support?

XC7K325T-2FFG900I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M[2:0] pins at power-up. Configuration bitstreams can be loaded from external flash (e.g., Micron MT25QL), SD card, or host processor via SelectMAP interface-all verified in UG470 and supported in Vivado Hardware Manager.