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AMD XC7K325T-3FBG676E
- Part No.:
- XC7K325T-3FBG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-3FBG676E.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,318
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Product details
Overview
XC7K325T-3FBG676E from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 DSP slices, and 16.3 Mb of block RAM, configured in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package for high-speed serial interface and PCIe Gen2 endpoint applications in radar signal processing.
For engineers reviewing the XC7K325T-3FBG676E datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 12.5 Gb/s, -3 speed grade timing margin, and thermal performance in industrial temperature range (-40°C to +100°C).
Technical Context
The XC7K325T-3FBG676E implements a 28 nm HKMG process FPGA architecture with configurable logic blocks (CLBs), integrated multi-gigabit transceivers (MGTs), and hardened PCI Express® v2.1 endpoint blocks. It supports up to 480 user I/Os across 19 banks with SelectIO™ technology.
It includes dual 36 Kb block RAMs per column, 18 x 25 multiplier capability per DSP48E1 slice, and clock management tiles with MMCM and PLL for jitter reduction and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| DSP Slices | 1,460 - dedicated arithmetic units supporting 18 × 25 signed multiplication and accumulation per slice |
| Block RAM | 16.3 Mb - distributed as 36 Kb dual-port RAM blocks usable for FIFOs, buffers, or lookup tables |
| Transceiver Line Rate | Up to 12.5 Gb/s - supports protocols including PCIe Gen2, SATA, and CPRI in serial connectivity applications |
| I/O Banks | 19 - independent voltage domains enabling mixed-voltage interface design with bank-specific VCCO |
| Speed Grade | -3 - highest commercial speed bin, guaranteeing timing closure at maximum operating frequencies per device characterization |
| Operating Temperature | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC7K325T-3FBG676E is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0 V) powering CLBs, interconnect, and configuration logic |
| A14 | VCCAUX | 1.8 V auxiliary supply for configuration, clock management, and transceiver reference circuitry |
| P22 | VCCO_13 | I/O bank 13 output driver supply (1.2–3.3 V selectable) defining signal swing and termination |
| H20 | MRCC_L15P | Multi-Region Clock Capable differential input pair for high-fanout clock distribution |
| T10 | GTPE2_CHANNEL_111 | Transceiver channel RX/TX differential pair supporting 12.5 Gb/s serial data links |
| R15 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Hard IP Endpoint | Integrated endpoint block supporting x1/x2/x4/x8 lane configurations with AXI4 streaming interface |
| MMCM + PLL Clock Management | Two independent clock synthesis units enabling sub-100 fs jitter performance and multi-domain clock generation |
| SelectIO™ Technology | Supports LVDS, SSTL, HSTL, TMDS, and MIPI D-PHY standards across 19 I/O banks with programmable drive strength |
| Configuration via JTAG/SMAP/BPI | Multiple boot modes including quad-SPI flash, parallel NOR, and boundary-scan programming for flexible system integration |
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in real-time applications |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and digital down-conversion algorithms with deterministic latency. Use Value: 1,460 DSP slices enable concurrent multi-channel processing at 12.5 Gb/s ADC/DAC interface rates. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Accelerates iterative reconstruction kernels and DICOM compression using parallelized logic and block RAM buffers. Use Value: 16.3 Mb block RAM provides on-chip storage for multi-frame pixel buffers, eliminating external DRAM latency bottlenecks. |
| 5G Wireless Baseband | Industrial Machine Vision |
Use Scenario: Layer 1 PHY processing for massive MIMO and OFDM modulation/demodulation in small-cell base stations. IC Role / Device Role / Timing Role: Implements synchronized multi-antenna channel estimation and precoding with hard PCIe Gen2 host interface. Use Value: -3 speed grade ensures timing closure for 200+ MHz FFT engines under worst-case voltage/temperature conditions. | Use Scenario: Sub-millisecond defect classification and metrology in automated optical inspection (AOI) systems. IC Role / Device Role / Timing Role: Processes high-resolution sensor streams (e.g., 4K@120 fps) using pipelined convolution and thresholding logic. Use Value: 480 user I/Os support direct connection to multiple CMOS image sensors and high-speed parallel interfaces without glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, higher logic density (504K LC), 16.3 Gb/s transceivers, but requires different power sequencing and PCB stack-up | Better suited for 5G NR Layer 1 acceleration requiring >250 GMACs; not drop-in compatible due to pinout and voltage rail changes | Select when migrating to higher throughput and lower power per MAC, accepting board redesign effort |
| XC7K160T-2FBG484I | Same Kintex-7 family, lower logic count (162K LC), reduced DSP slices (600), smaller 484-pin FCBGA package | Targeted for cost-sensitive embedded vision or motor control where full XC7K325T capacity is unused | Choose for footprint-constrained designs needing partial feature set and industrial temp rating |
Compared with XC7K325T-3FBG676E, XCKU040-2FFVA1156E delivers higher bandwidth and efficiency at architectural cost, while XC7K160T-2FBG484I offers proven Kintex-7 compatibility with reduced scale and BOM cost.
Availability
XC7K325T-3FBG676E is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and 5G wireless baseband applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7K325T-3FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets with focus on performance-per-watt innovation.
The Kintex-7 FPGA product line targets high-performance, cost-optimized applications in communications, video, and industrial systems where balanced logic, DSP, and I/O resources are critical.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-3FBG676E?
The XC7K325T-3FBG676E supports a maximum transceiver line rate of 12.5 Gb/s across its GTP and GTX transceivers. This enables compliance with PCIe Gen2, SATA III, and CPRI protocols. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margins verified during hardware validation of the XC7K325T-3FBG676E.
Does XC7K325T-3FBG676E support partial reconfiguration?
Yes, XC7K325T-3FBG676E supports partial reconfiguration through Vivado Design Suite tools and runtime configuration port (RCP). This allows dynamic replacement of logic modules without resetting the entire device, which is essential for mission-critical systems like radar and medical imaging where continuous operation is required. Implementation requires specific HDL partitioning and bitstream generation workflows for XC7K325T-3FBG676E.
What I/O standards are supported by XC7K325T-3FBG676E?
XC7K325T-3FBG676E supports LVDS, SSTL, HSTL, TMDS, MIPI D-PHY, and differential signaling standards across its 19 I/O banks. Each bank operates independently with configurable VCCO (1.2 V to 3.3 V), enabling mixed-voltage interfaces on a single device. These capabilities are documented in the SelectIO Resource User Guide for XC7K325T-3FBG676E.
Is XC7K325T-3FBG676E qualified for industrial temperature range?
Yes, XC7K325T-3FBG676E is rated for operation from -40°C to +100°C ambient temperature and is qualified per industrial-grade reliability standards. This makes it suitable for deployment in harsh environments such as outdoor radar enclosures or factory-floor medical equipment without thermal derating. The qualification applies specifically to the -3 speed grade in FBG676E packaging for XC7K325T-3FBG676E.
What configuration modes does XC7K325T-3FBG676E support?
XC7K325T-3FBG676E supports JTAG, Master SPI (quad-capable), Slave Parallel (SMAP), and Boundary Scan configuration modes. It also enables fallback and multi-boot from external flash devices. These options provide flexibility for field updates, secure boot, and system-level recovery strategies in deployed XC7K325T-3FBG676E applications.
XC7K325T-3FBG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-3FBG676E FAQ
1.How can I place an order for XC7K325T-3FBG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-3FBG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-3FBG676E reliable?
The price and inventory of XC7K325T-3FBG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-3FBG676E is usually 5 days.
3.What payment methods are accepted for XC7K325T-3FBG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-3FBG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-3FBG676E?
XC7K325T-3FBG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-3FBG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-3FBG676E?
For technical support, including XC7K325T-3FBG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-3FBG676E requirements.
6.How does Aetrix verify that XC7K325T-3FBG676E is sourced from the original manufacturer or authorized distributors?
All XC7K325T-3FBG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-3FBG676E meets industry standards.
7.What is the process for return or replacement of XC7K325T-3FBG676E?
All XC7K325T-3FBG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-3FBG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-3FBG676E part is unused and in its original packaging.
Return procedure for XC7K325T-3FBG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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