AMD XC7K325T-3FFG676E

Overview

XC7K325T-3FFG676E from AMD is a high-performance Kintex-7 FPGA with 326,080 logic cells, 1,440 DSP slices, and 16.4 Mb of block RAM, configured in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and embedded vision applications.

For engineers reviewing the XC7K325T-3FFG676E datasheet, pinout, applications, or equivalent options, key selection criteria include speed grade (-3), transceiver count (32 GTP/GTX), I/O voltage support (1.2–3.3 V), and thermal performance in industrial temperature range.

Technical Context

The XC7K325T-3FFG676E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated SelectIO technology supporting single-ended and differential standards including LVDS, SSTL, and HSTL. It includes 32 transceivers operating up to 6.6 Gb/s.

It supports partial reconfiguration, AXI4 interconnect compatibility, and built-in configuration security features including AES encryption and HMAC authentication. The -3 speed grade guarantees timing closure at higher clock frequencies than -2 or -1 grades under industrial temperature conditions.

Key Specifications

Pinout & Package

The XC7K325T-3FFG676E is housed in a 676-ball Flip-Chip Fine-Pitch BGA (FFG676) package with thermal and mechanical characteristics optimized for high-density PCB layouts and thermal dissipation in industrial environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XC7K325T-3FFG676E, XCKU040-2FFVA1156E delivers higher serial bandwidth and logic density at increased cost and layout complexity, while XC7K160T-2FFG676I offers identical packaging and pinout with lower performance and price-enabling scalable design reuse.

Availability

XC7K325T-3FFG676E is available at Aetrix Electronics and suitable for medical imaging systems, industrial machine vision, and wireless infrastructure equipment requiring stable component supply across extended product lifecycles.

Supply support for XC7K325T-3FFG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with emphasis on performance-per-watt and architectural flexibility.

The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources-targeting industrial automation, aerospace, and communications infrastructure.

FAQ

What is the operating temperature range for XC7K325T-3FFG676E?

The XC7K325T-3FFG676E is rated for industrial temperature operation from –40°C to +100°C ambient, verified per AMD's Kintex-7 DC and switching characteristics specifications. This range applies to the full functional performance of all logic, transceivers, and memory resources under specified voltage and cooling conditions. The -3 speed grade ensures timing compliance across this entire range without derating.

Does XC7K325T-3FFG676E support JESD204B interface?

Yes, XC7K325T-3FFG676E supports JESD204B subclass 1 through its 32 GTX transceivers, each capable of 6.6 Gb/s line rates. Implementation requires proper reference clock distribution, lane alignment, and use of AMD's JESD204B IP core in Vivado. The XC7K325T-3FFG676E has been validated with common ADC/DAC vendors including Analog Devices and Texas Instruments.

What configuration modes does XC7K325T-3FFG676E support?

XC7K325T-3FFG676E supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most commonly used for single-device boot from quad-SPI flash; JTAG is standard for debugging and programming during development. Configuration is initiated via dedicated pins (CCLK, INIT_B, DONE) and controlled by internal configuration logic compliant with Xilinx/AMD configuration specification UG470.

Is XC7K325T-3FFG676E pin-compatible with other Kintex-7 FPGAs in FFG676 package?

No-XC7K325T-3FFG676E is not fully pin-compatible with other Kintex-7 devices in the FFG676 package, such as XC7K160T-2FFG676I, due to differences in I/O bank allocation, transceiver placement, and power pin mapping. While both share the same physical footprint and ball count, signal routing and voltage domain assignments differ, requiring board-level validation before substitution.

What is the maximum supported I/O standard voltage for XC7K325T-3FFG676E?

The XC7K325T-3FFG676E supports I/O voltages from 1.2 V to 3.3 V per bank, with individual banks configurable independently. SSTL18_I, HSTL_I, and LVCMOS33 are among the supported standards. Voltage selection is constrained by VCCO supply rail assignment and must comply with AMD's Kintex-7 SelectIO Resources User Guide (UG471) for valid combinations and timing closure.