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AMD XC7K325T-3FFG900E
- Part No.:
- XC7K325T-3FFG900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-3FFG900E.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,450
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Product details
Overview
XC7K325T-3FFG900E from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 14,520 Kb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and PCIe Gen2 endpoint applications in radar signal processing.
For engineers reviewing the XC7K325T-3FFG900E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, -3 speed grade timing closure, and thermal performance under sustained 28 W typical power dissipation.
Technical Context
The XC7K325T-3FFG900E implements a synchronous, SRAM-based programmable logic architecture with configurable logic blocks (CLBs), dedicated carry chains, and hierarchical clock routing. It integrates 24 transceivers supporting protocols including PCIe Gen2, SATA, and CPRI at up to 6.6 Gb/s per lane.
Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and includes integrated analog-to-digital converter (XADC) for on-chip monitoring of temperature and supply voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 1,452 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 14,520 Kb - supports large on-chip data buffering and FIFOs without external memory |
| Transceiver Speed | 6.6 Gb/s - meets line rate requirements for PCIe Gen2 x8 and dual-lane CPRI interfaces |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with DDR3 memory, ADCs, and FMC mezzanine connectors |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths in high-performance designs |
Pinout & Package
XC7K325T-3FFG900E is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in conduction-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode; requires stable 50 MHz max clock |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and release of I/O pins from high-Z state |
| INIT_B | Configuration Initialization Input | Active-low signal used to reset configuration controller and clear internal configuration memory |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, Slave Serial, Master SelectMAP) at power-up; sampled on PROG_B deassertion |
| VRN/VRP | Differential Input Reference | Provide internal reference voltage for differential I/O standards such as LVDS and TMDS |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reboot-critical for adaptive radar waveform updates |
| XADC Integrated Monitoring | Provides real-time die temperature and supply voltage measurements with ±5°C accuracy, eliminating need for external sensors |
| PCIe Gen2 Endpoint Hard IP | Dedicated, uncore logic block implementing PHY and data link layers-reduces RTL integration effort and timing risk |
| Bitstream Encryption | AES-256 encryption with HMAC authentication prevents unauthorized configuration and intellectual property theft |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels while transceivers interface with ADC/DAC mezzanine cards. Use Value: 6.6 Gb/s transceivers sustain 16-channel, 125 MSPS ADC data ingestion without bottlenecking; -3 speed grade ensures deterministic latency under worst-case timing. | Use Scenario: High-throughput image reconstruction pipeline in portable ultrasound machines with multi-element probe arrays. IC Role / Device Role / Timing Role: Configurable logic processes raw RF echo data; XADC monitors thermal drift of front-end analog components. Use Value: 14,520 Kb block RAM buffers full-frame echo data for GPU-assisted reconstruction; partial reconfiguration allows modality switching without system reset. |
| Avionics Data Concentrator | Industrial Test Equipment |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers with deterministic latency requirements. IC Role / Device Role / Timing Role: Implements protocol engines and time-triggered scheduler using hard-wired clock domains and I/O registers. Use Value: LVDS I/O banks interface directly with avionics transceivers; -3 speed grade guarantees sub-50 ns path delays for safety-critical response windows. | Use Scenario: Automated test equipment performing high-speed digital pattern generation and acquisition across 64+ DUT channels. IC Role / Device Role / Timing Role: Generates synchronized stimulus waveforms and captures response data with picosecond-level timestamping. Use Value: 326,080 logic cells implement parallel pattern engines; 24 transceivers support simultaneous multi-protocol validation (JESD204B, MIPI D-PHY, USB 3.0). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, higher logic density (503K LC), 16.3 Gb/s transceivers, larger package (1156-pin) | Targets next-gen radar with wider bandwidth and higher channel count; requires PCB redesign | Select when migrating to higher throughput or adding AI-accelerated preprocessing; not pin-compatible |
| XC7K160T-2FFG676I | Same Kintex-7 family, lower logic count (162K LC), 676-pin FC-FBGA, industrial temperature grade | Suitable for cost-optimized embedded vision or motor control where full XC7K325T resources are unused | Choose for thermal-constrained environments or reduced BOM cost; shares toolchain but differs in I/O count and transceiver lanes |
Compared with XC7K325T-3FFG900E, the XCKU040 offers higher bandwidth and scalability at the cost of layout change, while the XC7K160T provides identical architecture and tool compatibility with relaxed resource and thermal requirements.
Availability
XC7K325T-3FFG900E is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and industrial test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-3FFG900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt leadership.
The Kintex-7 FPGA family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources-designed for radar, medical imaging, and industrial automation systems.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-3FFG900E?
The XC7K325T-3FFG900E supports a maximum transceiver line rate of 6.6 Gb/s per lane. This specification is validated across all 24 transceiver quads in the device and enables compliance with PCIe Gen2, SATA III, and CPRI protocols. The XC7K325T-3FFG900E achieves this rate under -3 speed grade conditions with junction temperature ≤ 85°C and VCCINT = 1.0V.
Does XC7K325T-3FFG900E support partial reconfiguration?
Yes, XC7K325T-3FFG900E supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. The XC7K325T-3FFG900E implements this using frame-based bitstream loading into designated reconfigurable partitions, verified per UG908 v2023.1.
What configuration modes are available for XC7K325T-3FFG900E?
XC7K325T-3FFG900E supports JTAG, Master SelectMAP, Slave SelectMAP, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins sampled at PROG_B deassertion. The XC7K325T-3FFG900E also supports fallback configuration and multi-boot via external SPI flash with address lines.
Is XC7K325T-3FFG900E qualified for industrial temperature operation?
No, XC7K325T-3FFG900E is specified for extended temperature range (–40°C to +100°C), denoted by the 'E' suffix. It is not rated for industrial grade (–40°C to +85°C) or commercial grade (0°C to +70°C). The XC7K325T-3FFG900E meets extended temperature requirements per DS182 v2.10, with derating applied above 85°C junction temperature.
What is the purpose of the XADC in XC7K325T-3FFG900E?
The XADC in XC7K325T-3FFG900E is a dual 12-bit, 1 MSPS analog-to-digital converter used for on-chip monitoring of die temperature and supply voltages (VCCINT, VCCAUX, VCCBRAM). It operates independently of the FPGA fabric and delivers calibrated readings via dedicated DRP ports. The XC7K325T-3FFG900E uses XADC data for thermal throttling and power rail health checks in mission-critical systems.
XC7K325T-3FFG900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-3FFG900E FAQ
1.How can I place an order for XC7K325T-3FFG900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-3FFG900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-3FFG900E reliable?
The price and inventory of XC7K325T-3FFG900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-3FFG900E is usually 5 days.
3.What payment methods are accepted for XC7K325T-3FFG900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-3FFG900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-3FFG900E?
XC7K325T-3FFG900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-3FFG900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-3FFG900E?
For technical support, including XC7K325T-3FFG900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-3FFG900E requirements.
6.How does Aetrix verify that XC7K325T-3FFG900E is sourced from the original manufacturer or authorized distributors?
All XC7K325T-3FFG900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-3FFG900E meets industry standards.
7.What is the process for return or replacement of XC7K325T-3FFG900E?
All XC7K325T-3FFG900E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-3FFG900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-3FFG900E part is unused and in its original packaging.
Return procedure for XC7K325T-3FFG900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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