AMD XC7K325T-L2FBG676E

Overview

XC7K325T-L2FBG676E from AMD is a Kintex-7 FPGA featuring 326,080 logic cells, 1,460 I/O pins, and built-in 6.6 Gb/s transceivers. It integrates dual 250 MHz ARM Cortex-A9 MPCore processors in the Zynq-7000 SoC family and supports PCIe Gen2 x8, DDR3L up to 1066 MHz, and 28 nm HKMG process technology. It is used in high-performance embedded vision systems requiring real-time image processing and low-latency I/O.

For engineers reviewing the XC7K325T-L2FBG676E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed, I/O voltage support (1.2 V to 3.3 V), configurable logic block density, integrated processor subsystem availability, and thermal performance under sustained 2.5 W dynamic power.

Technical Context

The XC7K325T-L2FBG676E implements a heterogeneous architecture combining programmable logic fabric with hard IP blocks including dual ARM Cortex-A9 cores, NEON SIMD engines, and TrustZone security extensions. It supports AXI4 interconnect for high-bandwidth data movement between PL and PS domains.

Configuration is performed via JTAG or Quad-SPI flash, with bitstream encryption and HMAC authentication enabled. The device operates across Industrial temperature grade (-40°C to +100°C) and supports partial reconfiguration for runtime logic updates without system reset.

Key Specifications

Pinout & Package

The XC7K325T-L2FBG676E is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 27 × 27 mm body size. Thermal pad on underside enables direct PCB heatsink attachment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous FPGA SoC applications.

Compared with XCKU040-2FFVA1156E and ZYNQ-7020-1CLG400I, the XC7K325T-L2FBG676E uniquely balances mid-range logic capacity, integrated processing, and industrial-grade I/O count-making it optimal for embedded vision and wireless infrastructure where both software-defined control and hardware acceleration are required simultaneously.

Availability

XC7K325T-L2FBG676E is available at Aetrix Electronics and suitable for medical imaging accelerators, 5G remote radio heads, avionics display generators, and industrial machine vision controllers requiring stable component supply across extended product lifecycles.

Supply support for XC7K325T-L2FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, adaptive SoC, and AI acceleration technologies.

The XC7K325T-L2FBG676E belongs to AMD's Kintex-7 Zynq-7000 All Programmable SoC product line, designed specifically for applications demanding tightly coupled software-defined control and hardware-accelerated signal processing in space- and power-constrained environments.

FAQ

What is the maximum supported DDR3L data rate for XC7K325T-L2FBG676E?

The XC7K325T-L2FBG676E supports DDR3L memory interfaces up to 1066 MHz (533 MHz clock frequency), delivering 17 GB/s peak bandwidth across its 64-bit data bus. This capability is verified in AMD UG585 v1.13.1 and applies to all banks configured with VCCO = 1.35 V and appropriate termination. The XC7K325T-L2FBG676E implements dedicated memory controller hard IP with calibration logic for reliable operation under industrial temperature conditions.

Does XC7K325T-L2FBG676E include ARM processor cores?

Yes, the XC7K325T-L2FBG676E integrates dual ARM Cortex-A9 MPCore processors with NEON SIMD extensions, 32 KB L1 instruction and data caches per core, and 512 KB unified L2 cache. These cores run independently of the programmable logic fabric and support full Linux OS deployment. The XC7K325T-L2FBG676E uses the Zynq-7000 SoC architecture, distinguishing it from non-SoC Kintex-7 FPGAs.

What transceiver protocols are natively supported by XC7K325T-L2FBG676E?

The XC7K325T-L2FBG676E GTY transceivers natively support PCIe Gen2 x8, SATA II/III, CPRI, JESD204B subclass 0/1, and DisplayPort 1.2. Protocol compliance is achieved through hard IP blocks and validated reference designs in AMD UG476. The XC7K325T-L2FBG676E does not support PCIe Gen3 or USB 3.0 without external retimers or protocol converters.

Is XC7K325T-L2FBG676E qualified for industrial temperature operation?

Yes, the XC7K325T-L2FBG676E is rated for Industrial temperature grade (-40°C to +100°C case temperature), with full functionality and timing closure guaranteed across this range. This qualification includes thermal testing per JEDEC JESD22-A104 and is documented in AMD DS182. The XC7K325T-L2FBG676E requires no derating or special cooling below 100°C junction temperature.

Can XC7K325T-L2FBG676E perform partial reconfiguration?

Yes, the XC7K325T-L2FBG676E supports dynamic partial reconfiguration (PR) of logic regions while the ARM processor subsystem remains fully operational. PR is implemented using ICAP and FRAME_ECC primitives, with toolchain support in Vivado 2022.2+. The XC7K325T-L2FBG676E allows runtime updates of compute kernels or interface protocols without system reset or PS interruption.