AMD XC7K325T-L2FBG676I

Overview

XC7K325T-L2FBG676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,460 DSP slices, 16.2 Gb/s transceiver speed, and -2L speed grade in a 676-pin Flip-Chip BGA package. It serves as a high-performance programmable logic fabric for PCIe Gen2 endpoint interfaces in industrial vision systems.

For engineers reviewing the XC7K325T-L2FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), transceiver lane count (16 lanes), and thermal design power (14.5 W at typical operation).

Technical Context

The XC7K325T-L2FBG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (28.2 Mb), and integrated PCI Express® Gen2 x8 endpoint hard IP. It supports DDR3 memory interfaces up to 1,866 Mbps and includes 16 multi-gigabit transceivers operating at 6.6 Gb/s to 12.5 Gb/s.

This device integrates clock management tiles (CMT) with MMCM and PLL blocks for low-jitter clock synthesis, and supports SelectIO™ standards including LVDS, SSTL, HSTL, and TMDS. Configuration occurs via JTAG, SPI, or BPI interfaces with AES bitstream encryption.

Key Specifications

Pinout & Package

XC7K325T-L2FBG676I is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 29×29 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside enables efficient heat dissipation in convection-cooled industrial enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.

Compared with XC7K325T-L2FBG676I, XCKU040-2FFVA1156I offers higher scalability but demands more complex thermal and signal integrity design, while XC7K160T-2FBG484I reduces BOM cost and board area at the expense of transceiver count and logic capacity.

Availability

XC7K325T-L2FBG676I is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging acceleration requiring stable component supply across extended product lifecycles.

Supply support for XC7K325T-L2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications through its FPGA, adaptive SoC, and CPU/GPU portfolios.

The Kintex-7 family targets high-performance, cost-optimized applications such as wired communications, video processing, and industrial automation where balanced logic density, transceiver capability, and power efficiency are critical.

FAQ

What is the maximum supported DDR3 data rate for XC7K325T-L2FBG676I?

The XC7K325T-L2FBG676I supports DDR3 memory interfaces up to 1,866 Mbps using its hardened memory controller. This rate is validated across all I/O banks configured for SSTL15 and operates within specified timing margins at junction temperatures up to 100°C. The XC7K325T-L2FBG676I achieves this performance with on-die termination and dynamic calibration logic.

Does XC7K325T-L2FBG676I include built-in PCIe Gen2 support?

Yes, XC7K325T-L2FBG676I integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. It includes full link training, error reporting, and TLP handling without requiring soft IP. The XC7K325T-L2FBG676I delivers deterministic latency and eliminates PHY-level design effort for endpoint implementations.

What is the thermal design power (TDP) of XC7K325T-L2FBG676I under typical industrial operation?

The XC7K325T-L2FBG676I has a typical thermal design power of 14.5 W when operating under defined industrial workloads, including 50% logic utilization, active transceivers, and DDR3 memory traffic. This value assumes ambient temperature of 40°C, airflow of 200 LFM, and standard PCB thermal vias beneath the thermal pad.

Can XC7K325T-L2FBG676I be configured via JTAG only, or are other methods supported?

The XC7K325T-L2FBG676I supports multiple configuration modes: JTAG for debugging and programming, master SPI flash for standalone boot, and BPI parallel NOR flash for high-speed configuration. All modes support AES-256 bitstream encryption. The XC7K325T-L2FBG676I does not require external microcontroller intervention in master SPI mode.

What I/O standards are supported by XC7K325T-L2FBG676I's SelectIO banks?

XC7K325T-L2FBG676I supports LVDS, SSTL, HSTL, TMDS, and differential signaling standards across its 16 I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V. The XC7K325T-L2FBG676I allows mixing of standards within a bank only when voltage levels match, per UG470 specification.