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AMD XC7K325T-L2FBG900E
- Part No.:
- XC7K325T-L2FBG900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-L2FBG900E.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,410
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Product details
Overview
XC7K325T-L2FBG900E from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and -2L speed grade operating at 1.0V core voltage. It integrates 16 DSP48E1 slices, 16.5 Mb of block RAM, and supports PCIe Gen2 x8 endpoint functionality in high-reliability industrial control and test equipment.
For engineers reviewing the XC7K325T-L2FBG900E datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver lane count (16 GTP), thermal performance (100°C junction), and support for DDR3-1866 memory interfaces.
Technical Context
The XC7K325T-L2FBG900E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated clock management tiles (CMTs) containing MMCM and PLL blocks. It supports multi-gigabit transceivers compliant with SATA, PCIe Gen2, and CPRI protocols.
Its configuration interface includes dual BPI and JTAG modes, and it supports partial reconfiguration via ICAP. The device uses SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS signaling standards across its 1,452 user I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUT/FF pairs for logic implementation |
| I/O Pins | 1,452 - user-configurable single-ended or differential I/O with programmable drive strength |
| Block RAM | 16.5 Mb - distributed as 720 × 36 Kb BRAM primitives for on-chip data buffering |
| DSP Slices | 16 - each with 25 × 18 multiplier, 48-bit accumulator, and pre-adder for filtering |
| Transceivers | 16 GTP - 2.5–6.6 Gb/s serial lanes supporting PCIe Gen2 x8 endpoint mode |
| Speed Grade | -2L - guaranteed timing closure up to 640 MHz for internal logic paths |
| Core Voltage | 1.0 V ±3% - supplies the FPGA fabric; requires tight regulation and low-noise PDN |
Pinout & Package
XC7K325T-L2FBG900E is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside enables efficient heat dissipation in convection-cooled industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCINT | Power supply return / core logic supply | Multiple dedicated balls per power domain; decoupling required within 10 mm of each VCCINT ball |
| VCCAUX / VCCO | Auxiliary supply / I/O bank supply | VCCAUX powers configuration and analog circuitry; VCCO sets I/O voltage per bank (1.2–3.3 V) |
| M0–M2 | Configuration mode select | Three-pin strap defining boot source (BPI, JTAG, or SPI); latched at power-on reset |
| CCLK / INIT_B | Configuration clock / initialization status | CCLK drives external PROM read; INIT_B goes high when configuration memory check passes |
| IO_Lx_y | User I/O bank pin | Each labeled pin belongs to one of 24 SelectIO banks; voltage and standard set per bank |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset; verified using ICAP interface and Vivado tools |
| Integrated Clock Management | Two MMCM + one PLL per CMT tile; supports jitter cleaning, frequency synthesis, and phase shifting |
| PCIe Gen2 Endpoint Compliance | Fully implements root port or endpoint behavior per PCI-SIG specification; no external PHY required |
| DDR3 Memory Interface | Hardened controller supporting 1866 Mbps data rate across up to 16 banks with DQS gating and write leveling |
| Transceiver Power Management | GTP lanes support selective power-down during idle periods to reduce dynamic power by up to 40% |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency and synchronized multi-axis position updates. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, encoder interpolation, and deterministic EtherCAT master stack. Use Value: 1,452 I/O pins enable direct connection to 32+ encoder channels and 16+ PWM outputs; -2L speed grade ensures 640 MHz timing margin for 100 ns control cycles. | Use Scenario: High-speed digital pattern generation and acquisition across 64+ parallel DUT channels at 200+ MHz rates. IC Role / Device Role / Timing Role: XC7K325T-L2FBG900E serves as pattern sequencer, timing engine, and protocol translator between PXIe backplane and DUT interface. Use Value: 16 GTP transceivers route 8-lane PCIe Gen2 host interface while reserving 480+ I/O for parallel vector I/O; block RAM buffers 128 MB of test vectors on-chip. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: Real-time preprocessing of raw ultrasound beamformer data before GPU transfer via PCIe. IC Role / Device Role / Timing Role: DSP48E1 slices perform fixed-point beam summation; BRAM stores channel calibration coefficients. Use Value: 16 DSP slices execute 128-channel beamforming at 40 MSPS; DDR3-1866 interface sustains 14.9 GB/s memory bandwidth for frame buffering. | Use Scenario: Aggregation and protocol conversion of ARINC 429, MIL-STD-1553, and discrete I/O from 24+ avionics subsystems. IC Role / Device Role / Timing Role: XC7K325T-L2FBG900E acts as deterministic time-triggered gateway with hardware timestamping per message. Use Value: Dual MMCMs generate independent 1 MHz and 4 MHz clocks for ARINC and 1553 domains; 100°C junction rating supports operation in uncooled cockpit environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, 384,000 logic cells, 20 GTH transceivers (12.5 Gb/s), 1.2 V core | Higher bandwidth PCIe Gen3 x16 and 10G Ethernet MAC offload; larger die area and higher static power | Select when migrating to 10G+ serial protocols or requiring >500K logic cells; requires new PCB layout and power delivery redesign |
| XC7K325T-2FBG676E | Same Kintex-7 family, identical logic resources, but 676-pin FBGA, 300 I/O fewer, no GTP transceivers | Suitable for cost-sensitive I/O-constrained designs without high-speed serial links | Choose for space-constrained embedded control where PCIe or multi-gigabit serial is unnecessary; retains same toolchain and IP compatibility |
Compared with XC7K325T-L2FBG900E, the XCKU040 offers higher serial bandwidth and logic density at increased power and layout complexity, while the XC7K325T-2FBG676E reduces I/O count and removes transceivers to lower cost and footprint-both require evaluation against signal integrity, thermal, and routing constraints.
Availability
XC7K325T-L2FBG900E is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging backend processing, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-L2FBG900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets high-performance, cost-optimized applications demanding balanced logic, I/O, and transceiver resources-designed specifically for industrial automation, test & measurement, and medical imaging systems.
FAQ
What is the maximum supported DDR3 data rate for XC7K325T-L2FBG900E?
The XC7K325T-L2FBG900E supports DDR3-1866 (933 MHz clock, 1866 Mbps data rate) using its hardened memory controller. This capability is validated across all I/O banks configured for SSTL15, with write-leveling and gate training enabled. The XC7K325T-L2FBG900E achieves this rate under -2L speed grade conditions with proper board-level termination and layout adherence to Xilinx UG470 guidelines.
Does XC7K325T-L2FBG900E support partial reconfiguration?
Yes, XC7K325T-L2FBG900E supports partial reconfiguration through its ICAP (Internal Configuration Access Port) interface. This allows dynamic loading of functional modules into designated reconfigurable partitions without resetting the entire device. The XC7K325T-L2FBG900E implementation requires Vivado Design Suite 2018.3 or later and adheres to Xilinx PG102 documentation for timing-closure validation.
What transceiver protocols are supported by XC7K325T-L2FBG900E?
XC7K325T-L2FBG900E integrates 16 GTP transceivers supporting PCIe Gen2 (5.0 GT/s), SATA Gen2 (3.0 Gb/s), CPRI (up to 6.144 Gb/s), and DisplayPort 1.1. These protocols are implemented using native primitives in Vivado IP catalog; no external PHY is needed. The XC7K325T-L2FBG900E does not support PCIe Gen3 or 10G Ethernet due to GTP bandwidth limitations.
What is the junction temperature rating for XC7K325T-L2FBG900E?
The XC7K325T-L2FBG900E has a maximum junction temperature rating of 100°C, specified for industrial-grade operation. This rating applies under steady-state thermal conditions with appropriate PCB copper pour, thermal vias, and airflow ≥200 LFM. The XC7K325T-L2FBG900E thermal characteristics are documented in Xilinx DS182, and derating curves must be applied above 85°C ambient.
How many configuration modes does XC7K325T-L2FBG900E support?
XC7K325T-L2FBG900E supports three primary configuration modes: Master BPI (parallel NOR flash), Slave SelectMAP (external processor-controlled), and JTAG (debug and programming). Mode selection is controlled by M0–M2 pins at power-up. The XC7K325T-L2FBG900E also supports fallback configuration and multi-boot via external SPI flash with address strapping.
XC7K325T-L2FBG900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-L2FBG900E FAQ
1.How can I place an order for XC7K325T-L2FBG900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-L2FBG900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-L2FBG900E reliable?
The price and inventory of XC7K325T-L2FBG900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-L2FBG900E is usually 5 days.
3.What payment methods are accepted for XC7K325T-L2FBG900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-L2FBG900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-L2FBG900E?
XC7K325T-L2FBG900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-L2FBG900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-L2FBG900E?
For technical support, including XC7K325T-L2FBG900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-L2FBG900E requirements.
6.How does Aetrix verify that XC7K325T-L2FBG900E is sourced from the original manufacturer or authorized distributors?
All XC7K325T-L2FBG900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-L2FBG900E meets industry standards.
7.What is the process for return or replacement of XC7K325T-L2FBG900E?
All XC7K325T-L2FBG900E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-L2FBG900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-L2FBG900E part is unused and in its original packaging.
Return procedure for XC7K325T-L2FBG900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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