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AMD XC7K325T-L2FBG900I
- Part No.:
- XC7K325T-L2FBG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-L2FBG900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,669
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Product details
Overview
XC7K325T-L2FBG900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 DSP slices, and 23.5 Mb of block RAM, configured in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package for high-speed serial interface and PCIe Gen2 endpoint applications in radar signal processing systems.
For engineers reviewing the XC7K325T-L2FBG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, thermal performance at -40°C to 100°C junction temperature, and configuration via Master SelectMAP or JTAG.
Technical Context
The XC7K325T-L2FBG900I implements a 28 nm HKMG process-based architecture with 24 transceiver quads supporting up to 6.6 Gb/s per lane, integrated PCI Express® Gen2 x8 endpoint block, and dual 10-bit 1 MSPS ADCs for auxiliary monitoring. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.
Configuration is performed through dedicated CCLK, INIT_B, PROGRAM_B, and DONE pins using either SPIx4 or BPI parallel mode; bitstream encryption and HMAC authentication are supported for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 1,452 - hardened multiply-accumulate units enabling high-throughput filtering and FFT operations |
| Block RAM | 23.5 Mb - distributed memory capacity usable as FIFOs, buffers, or lookup tables |
| Transceiver Speed | 6.6 Gb/s - maximum serial line rate per GT lane, supporting SRIO, CPRI, and PCIe Gen2 |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage board interfacing with 1.2 V–3.3 V banks |
| Operating Temp | -40°C to +100°C - industrial-grade junction temperature range for embedded deployment |
| Configuration Mode | Master SelectMAP, JTAG, SPIx4 - flexible bitstream loading options with fallback support |
Pinout & Package
XC7K325T-L2FBG900I is housed in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives synchronous configuration clock input for Master SelectMAP mode |
| INIT_B | Initialization Status | Open-drain output indicating device readiness during configuration sequence |
| PROGRAM_B | Configuration Reset | Active-low input that initiates configuration reload and clears internal state |
| DONE | Configuration Completion | Open-drain output signaling successful bitstream loading and startup |
| MGTAVCC / MGTAVTT | Transceiver Power | Dedicated analog power rails for GTY transceiver operation at 1.0 V / 1.2 V |
| VRP / VRN | Reference Voltage | Inputs for differential I/O reference voltage setting per bank |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Block | Hard IP supporting x1/x2/x4/x8 link widths with integrated DMA and TLP parsing |
| Partial Reconfiguration | Enables dynamic logic module swapping without full device reset or system interruption |
| Integrated ADC | Dual 10-bit, 1 MSPS auxiliary converters for on-chip voltage/temperature monitoring |
| Secure Boot | Supports AES-256 bitstream encryption and SHA-256 HMAC authentication |
| AXI4-Stream Interface | Native streaming protocol support for high-bandwidth data transfer between IP blocks |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom filter chains and timing-critical FFT engines while GTY transceivers stream ADC samples from RF front-end. Use Value: 6.6 Gb/s transceiver lanes enable direct connection to high-speed ADCs/DACs without serialization bottlenecks. | Use Scenario: High-resolution ultrasound image reconstruction pipeline with multi-channel echo digitization. IC Role / Device Role / Timing Role: Configurable logic processes time-aligned channel data; PCIe Gen2 x8 provides host-system data offload. Use Value: 23.5 Mb block RAM supports large line buffers for real-time scan conversion and noise reduction. |
| Industrial Test Equipment | Avionics Data Concentrator |
Use Scenario: Modular automated test equipment requiring synchronized multi-instrument control and waveform generation. IC Role / Device Role / Timing Role: Central timing and trigger manager coordinating PXIe modules via deterministic AXI4-Stream and PCIe links. Use Value: 1,452 DSP slices accelerate real-time modulation analysis and error vector magnitude calculation. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control subsystems. IC Role / Device Role / Timing Role: Protocol bridging engine with deterministic latency control and packet buffering across multiple buses. Use Value: Industrial temperature rating (-40°C to +100°C) ensures reliability in uncontrolled avionics bays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, higher logic density (504K LC), 16.3 Gb/s transceivers, no integrated ADC | Better suited for 10G Ethernet or coherent optical interfaces; lacks on-die monitoring converters | Select when >10 Gb/s serial bandwidth or larger logic footprint is required, and external ADC suffices |
| XC7K160T-2FBG676I | Same Kintex-7 family, reduced resources (162K LC, 740 DSP, 12.1 Mb BRAM), 676-pin FCBGA | Limited I/O count and memory depth restrict use in multi-channel high-throughput systems | Choose for cost-sensitive designs where XC7K325T-L2FBG900I resources exceed requirements |
Compared with XC7K325T-L2FBG900I, XCKU040-2FFVA1156I delivers higher serial bandwidth and logic capacity but requires external monitoring circuitry, while XC7K160T-2FBG676I offers identical architecture and toolchain compatibility at lower resource cost and smaller footprint.
Availability
XC7K325T-L2FBG900I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7K325T-L2FBG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - particularly in wireless infrastructure, video processing, and defense electronics.
FAQ
What is the maximum transceiver line rate supported by XC7K325T-L2FBG900I?
The XC7K325T-L2FBG900I supports a maximum transceiver line rate of 6.6 Gb/s per GTY lane. This enables compliance with protocols including PCIe Gen2, SRIO Gen2, and CPRI Option 3. The XC7K325T-L2FBG900I achieves this using dedicated analog transceiver circuitry with programmable equalization and clock recovery, validated across its specified industrial temperature range.
Does XC7K325T-L2FBG900I include built-in analog-to-digital conversion capability?
Yes, the XC7K325T-L2FBG900I integrates two 10-bit, 1 MSPS auxiliary analog-to-digital converters (ADCs). These are intended for on-chip monitoring of supply voltages and die temperature, not for primary signal acquisition. The XC7K325T-L2FBG900I provides dedicated analog input pins (VP/VN) and registers accessible via the XADC wizard in Vivado for calibration and readback.
What configuration modes are supported by XC7K325T-L2FBG900I?
The XC7K325T-L2FBG900I supports Master SelectMAP, JTAG, and SPIx4 configuration modes. Master SelectMAP uses parallel data loading via dedicated configuration pins; JTAG enables debugging and programming through boundary-scan; SPIx4 allows quad-SPI flash boot with faster load times. All modes are implemented in hardware and require no soft-core intervention - a key feature of the XC7K325T-L2FBG900I architecture.
Is XC7K325T-L2FBG900I compatible with Xilinx Vivado Design Suite?
Yes, the XC7K325T-L2FBG900I is fully supported in Xilinx Vivado Design Suite versions 2015.4 through 2023.2. Synthesis, implementation, and bitstream generation for the XC7K325T-L2FBG900I are validated against speed grade -2 and package FBG900. Device-specific constraints, IP integrators, and debug cores (e.g., ILA, VIO) are natively available for the XC7K325T-L2FBG900I in Vivado.
What is the operating temperature range for XC7K325T-L2FBG900I?
The XC7K325T-L2FBG900I is rated for industrial operation with a junction temperature range of -40°C to +100°C. This specification applies to the L2 speed grade and FBG900 package under defined airflow and thermal pad conditions. The XC7K325T-L2FBG900I's thermal characteristics are documented in DS182 and UG475, including θJA and ψJT values for PCB layout guidance.
XC7K325T-L2FBG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-L2FBG900I FAQ
1.How can I place an order for XC7K325T-L2FBG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-L2FBG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-L2FBG900I reliable?
The price and inventory of XC7K325T-L2FBG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-L2FBG900I is usually 5 days.
3.What payment methods are accepted for XC7K325T-L2FBG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-L2FBG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-L2FBG900I?
XC7K325T-L2FBG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-L2FBG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-L2FBG900I?
For technical support, including XC7K325T-L2FBG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-L2FBG900I requirements.
6.How does Aetrix verify that XC7K325T-L2FBG900I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-L2FBG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-L2FBG900I meets industry standards.
7.What is the process for return or replacement of XC7K325T-L2FBG900I?
All XC7K325T-L2FBG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-L2FBG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-L2FBG900I part is unused and in its original packaging.
Return procedure for XC7K325T-L2FBG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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