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AMD XC7K325T-L2FFG676I
- Part No.:
- XC7K325T-L2FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K325T-L2FFG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,467
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Product details
Overview
XC7K325T-L2FFG676I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and -2L speed grade, operating at 1.0V core voltage and supporting -40°C to +100°C industrial temperature range. It serves as a high-performance programmable logic fabric in radar signal processing, high-speed data acquisition, and PCIe Gen2 endpoint systems.
For engineers reviewing the XC7K325T-L2FFG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver lane count (16 GTX), block RAM capacity (16,416 Kb), and thermal performance under sustained 2.5W dynamic power.
Technical Context
The XC7K325T-L2FFG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 16 GTX transceivers rated up to 6.6 Gb/s, and integrated clock management tiles (CMT) featuring MMCM and PLL for jitter reduction. It supports SelectIO standards including LVDS, SSTL, and HSTL across its 1,452 user I/Os.
Configuration is performed via Master SPI or JTAG, with support for dual-boot and fallback modes. The device includes built-in configuration security features such as AES decryption and HMAC authentication for bitstream protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total available LUT/FF pairs for combinational and sequential logic implementation |
| I/O Pins | 1,452 - user-configurable single-ended and differential I/Os with bank-wise voltage support |
| GTX Transceivers | 16 lanes - each supports 6.6 Gb/s serial protocols including PCIe Gen2 and SATA |
| Block RAM | 16,416 Kb - distributed across 720 BRAM primitives, usable as true dual-port memory or FIFO |
| Speed Grade | -2L - guarantees timing closure at 1.0V core supply with industrial temperature operation |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC7K325T-L2FFG676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Thermal pad on underside enables direct PCB thermal coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Determines boot source (SPI/JTAG) and configuration mode at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI programming |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and error state |
| GTXREFCLK0/1 | Transceiver Reference Clock | Dedicated differential inputs for GTX transceiver PLL reference timing |
Key Features
| Feature | Design Value |
|---|---|
| High-Speed Serial Connectivity | 16 GTX transceivers supporting 6.6 Gb/s line rates for PCIe Gen2 x8 or SATA III interfaces |
| Configurable I/O Standards | Support for 1.2V–3.3V I/O banks with LVDS, SSTL-18/25, HSTL-I/II, and MIPI D-PHY compatibility |
| Embedded Memory Resources | 16,416 Kb of block RAM plus 2,916 Kb of distributed RAM for flexible memory mapping |
| Advanced Clock Management | Integrated MMCM and PLL with sub-100 fs jitter performance and dynamic phase shift capability |
| Bitstream Security | AES-256 encryption and HMAC-SHA256 authentication prevent unauthorized configuration and cloning |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Programmable logic fabric executing custom FFT, CFAR, and digital down-conversion pipelines with deterministic latency. Use Value: 326,080 logic cells and 16 GTX transceivers enable parallel processing of 16 RF channels at 125 MSPS with <500 ns end-to-end latency. | Use Scenario: Multi-channel oscilloscope front-end capturing analog signals at ≥1 GS/s with real-time waveform analysis. IC Role / Device Role / Timing Role: Interface controller aggregating ADC data streams and performing on-the-fly decimation, triggering, and memory buffering. Use Value: 1,452 I/O pins support 32-channel LVDS ADC interfacing while block RAM provides 16 MB deep capture buffer. |
| PCIe Gen2 Endpoint | Industrial Machine Vision |
Use Scenario: Embedded vision processor interfacing with host CPU via x4 PCIe Gen2 link for low-latency image streaming. IC Role / Device Role / Timing Role: Root Complex-compatible endpoint implementing DMA engines, TLP parsing, and MSI-X interrupt handling. Use Value: Native PCIe hard IP with integrated PHY eliminates external SerDes, reducing BOM cost and board area by 35% vs. soft-core solutions. | Use Scenario: Smart camera system performing real-time object detection and classification using CNN inference acceleration. IC Role / Device Role / Timing Role: Reconfigurable accelerator executing convolution layers and pooling operations with pipelined DSP48E1 slices. Use Value: 960 DSP48E1 slices deliver 2.4 GOPS at 250 MHz, enabling 60 FPS inference on 1080p video with <12 ms pipeline latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 384,000 logic cells, 20 GTY transceivers (16.3 Gb/s), higher static power | Better suited for 10G Ethernet, 4K video processing, and AI edge inference requiring >10 Gb/s serial bandwidth | Select when migrating to higher serial bandwidth or larger logic density; requires PCB redesign due to different package and pinout |
| XC7K160T-2FFG676I | Same Kintex-7 family, 162,240 logic cells, 8 GTX transceivers, identical FFG676 package and pin compatibility | Targeted for cost-sensitive mid-range applications where full XC7K325T resources are unused | Drop-in replacement for designs scaling down logic utilization below 50%; retains same thermal and layout footprint |
Compared with XC7K325T-L2FFG676I, XCKU040-2FFVA1156I offers higher bandwidth but demands new layout and power delivery, while XC7K160T-2FFG676I provides verified pin-compatible downsizing with no PCB changes required.
Availability
XC7K325T-L2FFG676I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and PCIe Gen2 endpoint applications requiring stable component supply across long production lifecycles.
Supply support for XC7K325T-L2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Kintex-7 family targets high-performance, cost-optimized applications in wired communications, video processing, and industrial automation, balancing logic density, I/O bandwidth, and power efficiency.
FAQ
What is the maximum supported transceiver data rate for XC7K325T-L2FFG676I?
The XC7K325T-L2FFG676I integrates 16 GTX transceivers, each capable of operation up to 6.6 Gb/s. This supports PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gb/s), and SRIO Gen2 (5.0 GT/s) protocols. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margin, but the silicon specification is fixed at 6.6 Gb/s per lane.
Does XC7K325T-L2FFG676I support JTAG boundary-scan testing?
Yes, XC7K325T-L2FFG676I fully supports IEEE 1149.1 (JTAG) boundary-scan testing through dedicated TDI, TDO, TMS, and TCK pins. The device implements mandatory instructions including SAMPLE/PRELOAD, EXTEST, and BYPASS, and supports IDCODE readback for automated board-level test verification during manufacturing.
What configuration modes are supported by XC7K325T-L2FFG676I?
XC7K325T-L2FFG676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for standalone operation using external flash memory, while JTAG is used for debugging and in-system programming during development.
Is XC7K325T-L2FFG676I qualified for industrial temperature operation?
Yes, the "I" suffix in XC7K325T-L2FFG676I denotes industrial temperature grade, certified for continuous operation from -40°C to +100°C ambient. This qualification includes thermal cycling, high-temperature operating life (HTOL), and burn-in testing per AMD's industrial reliability standards, making it suitable for harsh-environment deployments.
How many block RAM primitives are available in XC7K325T-L2FFG676I?
XC7K325T-L2FFG676I contains 720 block RAM (BRAM) primitives, totaling 16,416 Kb of dedicated memory. Each BRAM can be configured as 36 Kb dual-port RAM, 18 Kb single-port RAM, or 32 × 1024-bit ROM. These resources are distributed across CLB columns and accessible without consuming logic cell resources.
XC7K325T-L2FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K325T-L2FFG676I FAQ
1.How can I place an order for XC7K325T-L2FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-L2FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-L2FFG676I reliable?
The price and inventory of XC7K325T-L2FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-L2FFG676I is usually 5 days.
3.What payment methods are accepted for XC7K325T-L2FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-L2FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-L2FFG676I?
XC7K325T-L2FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-L2FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-L2FFG676I?
For technical support, including XC7K325T-L2FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-L2FFG676I requirements.
6.How does Aetrix verify that XC7K325T-L2FFG676I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-L2FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-L2FFG676I meets industry standards.
7.What is the process for return or replacement of XC7K325T-L2FFG676I?
All XC7K325T-L2FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-L2FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-L2FFG676I part is unused and in its original packaging.
Return procedure for XC7K325T-L2FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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