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AMD XC7K325T-L2FFG900E
- Part No.:
- XC7K325T-L2FFG900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-L2FFG900E.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,343
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Product details
Overview
XC7K325T-L2FFG900E from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and 1,350 DSP slices, fabricated on 28 nm process technology. It integrates dual 10.3125 Gb/s transceivers and supports PCIe Gen3 x8, targeting high-bandwidth data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC7K325T-L2FFG900E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O voltage support (1.2 V to 3.3 V), thermal design power (14.5 W typical), and configuration interface compatibility (SPIx4, BPI, SelectMAP).
Technical Context
The XC7K325T-L2FFG900E implements a heterogeneous architecture with CLB-based logic, block RAM (37,080 Kb), and UltraScale-compatible clock management tiles including MMCM and PLL blocks. It supports multi-voltage I/O banks with independent VCCO and VREF per bank.
Configuration occurs via master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device includes integrated PCI Express® Gen3 hard IP with AXI4 streaming interface and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total configurable logic resources for complex state machines and datapaths |
| I/O Pins | 1,452 - user-accessible bidirectional pins distributed across 34 I/O banks |
| DSP Slices | 1,350 - dedicated 25×18 multiplier-accumulator units for high-throughput filtering |
| Transceivers | 16 lanes @ 10.3125 Gb/s - supports 10GBASE-R, CPRI, and JESD204B protocols |
| Block RAM | 37,080 Kb - distributed as 1,824 × 20 Kb BRAM primitives for FIFOs and buffers |
| TDP | 14.5 W typical - thermal budget constraint requiring active cooling in dense PCB layouts |
Pinout & Package
XC7K325T-L2FFG900E uses a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Pin assignment follows Xilinx/AMD Kintex-7 FFG900 footprint standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/JTAG/BPI) during power-up reset sequence |
| CCLK | Configuration Clock | Drives master SPI clock input; frequency up to 100 MHz determines config speed |
| DIN | Serial Data Input | Receives configuration bitstream in master SPI mode |
| INIT_B | Initialization Status | Open-drain output indicating successful CRC check or config failure |
| PROGRAM_B | Reset Control | Active-low signal initiating full reconfiguration and clearing internal state |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for lane 0 transceiver clocking; supports 100–625 MHz range |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 Hard IP | Integrated endpoint/root port supporting x1/x2/x4/x8 widths with AXI4-Lite/Streaming interfaces |
| Partial Reconfiguration | Enables runtime swap of logic partitions without system reset or interrupting active functions |
| SEU Detection & Correction | On-chip circuitry detects and corrects single-event upsets in configuration memory using EDAC |
| Multi-Voltage I/O Banks | 34 independent banks each supporting selectable VCCO (1.2–3.3 V) and VREF (0.6–1.8 V) |
| UltraFast Compile Technology | Reduces place-and-route time by ~40% vs. prior generation tools for equivalent designs |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute fabric handling FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 1,350 DSP slices enable concurrent 1024-point FFTs at 200 MS/s; transceiver lanes interface directly to ADC/DAC JESD204B links. | Use Scenario: MAC-to-PHY bridging and packet classification in telecom edge routers. IC Role / Device Role / Timing Role: Protocol translation engine between 10GBASE-R MAC and SFP+ optical modules. Use Value: Integrated PCIe Gen3 x8 provides host CPU interface; 16 transceiver lanes support dual 10G ports with forward error correction. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Raw sensor data aggregation and real-time image reconstruction in MRI and CT scanners. IC Role / Device Role / Timing Role: High-throughput data concentrator and FPGA-accelerated back-projection engine. Use Value: 37,080 Kb block RAM buffers multi-channel parallel acquisition streams; 1,452 I/O pins route LVDS sensor interfaces and DDR3 memory controllers. | Use Scenario: Flexible waveform generation and protocol analysis in high-speed oscilloscopes and protocol analyzers. IC Role / Device Role / Timing Role: Real-time pattern generator and deep-buffered capture controller. Use Value: Partial reconfiguration allows switching between USB3.1, PCIe, and SATA test modes without hardware change; transceivers support 8b/10b and 64b/66b encoding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-performance computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, 504,000 logic cells, higher transceiver count (20 lanes), 15W TDP | Better suited for 25G/100G interconnect and AI inference acceleration | Select when >326K LUTs or >10.3 Gb/s transceiver speed required |
| XC7K160T-2FFG676I | Same Kintex-7 family, 162,240 logic cells, 600 I/O pins, 676-ball FCBGA | Lower cost and power for mid-range 10G PHY offload and video processing | Choose for space-constrained designs where full XC7K325T capacity is unused |
Compared with XC7K325T-L2FFG900E, XCKU040 offers higher density and bandwidth at increased power and cost, while XC7K160T delivers proven Kintex-7 functionality in a smaller footprint-enabling tiered design reuse across product families.
Availability
XC7K325T-L2FFG900E is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply and long-term industrial availability.
Supply support for XC7K325T-L2FFG900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in FPGA, GPU, and CPU technologies for datacenter, embedded, and client markets.
The Kintex-7 family was designed for balanced performance, power efficiency, and cost in high-speed wired communications, aerospace, and scientific instrumentation applications.
FAQ
What is the maximum supported transceiver data rate for XC7K325T-L2FFG900E?
The XC7K325T-L2FFG900E supports transceiver data rates up to 10.3125 Gb/s per lane, compliant with 10GBASE-R, CPRI, and JESD204B standards. This rate is achievable across all 16 transceiver lanes under specified voltage and temperature conditions, and requires proper reference clock jitter compliance per UG476.
Does XC7K325T-L2FFG900E support partial reconfiguration?
Yes, XC7K325T-L2FFG900E supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module swaps without resetting the entire device. This capability is implemented in hardware and verified per Xilinx AR# 55912 and UG909, allowing runtime adaptation in radar and test equipment applications.
What configuration modes are available for XC7K325T-L2FFG900E?
XC7K325T-L2FFG900E supports master SPI, slave SPI, JTAG, and BPI parallel configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and all modes are documented in UG470 with timing requirements and pin assignments specific to the FFG900 package.
Is XC7K325T-L2FFG900E pin-compatible with other Kintex-7 devices?
No, XC7K325T-L2FFG900E is not pin-compatible with other Kintex-7 devices due to its unique 900-ball FFG900 footprint. While electrical characteristics align with the Kintex-7 family, mechanical layout requires dedicated PCB design; migration to XC7K160T or XC7K410T necessitates board redesign.
What is the thermal design power (TDP) of XC7K325T-L2FFG900E?
The typical thermal design power of XC7K325T-L2FFG900E is 14.5 W under worst-case operating conditions defined in UG475. Actual power varies with design utilization, clock frequency, and I/O activity; thermal solution must accommodate peak junction temperature limits of 100°C for commercial grade operation.
XC7K325T-L2FFG900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-L2FFG900E FAQ
1.How can I place an order for XC7K325T-L2FFG900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-L2FFG900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-L2FFG900E reliable?
The price and inventory of XC7K325T-L2FFG900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-L2FFG900E is usually 5 days.
3.What payment methods are accepted for XC7K325T-L2FFG900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-L2FFG900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-L2FFG900E?
XC7K325T-L2FFG900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-L2FFG900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-L2FFG900E?
For technical support, including XC7K325T-L2FFG900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-L2FFG900E requirements.
6.How does Aetrix verify that XC7K325T-L2FFG900E is sourced from the original manufacturer or authorized distributors?
All XC7K325T-L2FFG900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-L2FFG900E meets industry standards.
7.What is the process for return or replacement of XC7K325T-L2FFG900E?
All XC7K325T-L2FFG900E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-L2FFG900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-L2FFG900E part is unused and in its original packaging.
Return procedure for XC7K325T-L2FFG900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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