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AMD XC7K325T-L2FFG900I
- Part No.:
- XC7K325T-L2FFG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K325T-L2FFG900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,234
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Product details
Overview
XC7K325T-L2FFG900I from AMD is a Kintex-7 FPGA with 326,080 logic cells, 1,452 I/O pins, and 16.8 Mb of block RAM, fabricated on 28 nm process technology and operating at -2 speed grade for industrial temperature range (-40°C to +100°C). It serves as a high-performance programmable logic fabric in radar signal processing, high-speed data acquisition, and PCIe Gen2 endpoint systems.
For engineers reviewing the XC7K325T-L2FFG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver line rate (up to 6.6 Gb/s), thermal performance in FFG900 package, and support for JTAG and SelectMAP configuration interfaces.
Technical Context
The XC7K325T-L2FFG900I integrates 600 DSP48E1 slices for arithmetic-intensive tasks and supports up to 24 GTX transceivers with protocol compliance for PCIe Gen2, SATA, and SRIO. Its configuration logic includes dual-boot capability and AES bitstream encryption.
It implements dedicated clock management tiles with MMCM and PLL blocks supporting input frequencies from 10 MHz to 810 MHz and output jitter under 150 ps RMS. The device uses configuration via Master SPI or BPI flash, with fallback mode enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 326,080 - total configurable LUTs + flip-flops for logic implementation |
| I/O Pins | 1,452 - user-configurable single-ended or differential I/O with bank-specific voltage support |
| Block RAM | 16.8 Mb - distributed across 720 BRAM primitives, each 36 Kb, usable as memory or FIFO |
| GTX Transceivers | 24 × - each supports 600 Mb/s to 6.6 Gb/s line rates with built-in 8B/10B encoding |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | FFG900 - 900-pin Fine-Pitch Flip-Chip BGA, 31 mm × 31 mm, 1.0 mm pitch |
Pinout & Package
XC7K325T-L2FFG900I is housed in a 900-pin Fine-Pitch Flip-Chip BGA (FFG900) package with 31 mm × 31 mm footprint and 1.0 mm ball pitch. Power delivery is distributed across multiple VCCINT, VCCAUX, and VCCO banks, with dedicated configuration and JTAG pins located in corner banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Select boot source (SPI/BPI/JTAG) and configuration mode during power-up |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1 boundary-scan and programming interface for debug and configuration |
| CCLK | Configuration Clock | Input clock for master serial configuration; also used for SelectMAP write strobe |
| INIT_B | Configuration Status | Open-drain output indicating configuration status; low during init, high when done |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and restarts boot sequence |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E1 Slices | 600 units with 25×18 multipliers, 48-bit accumulators, and pre-adders for real-time filtering |
| Transceiver Compliance | PCIe Gen2 x8, SATA 3Gbps, SRIO 2.1 - no external PHY required for these protocols |
| Encryption Support | AES-256 bitstream encryption with HMAC authentication prevents unauthorized configuration |
| Power Management | Multiple power rails (VCCINT/VCCAUX/VCCO) enable dynamic I/O bank switching and partial reconfiguration |
| Clock Resources | 20 MMCMs + 20 PLLs - support phase alignment, frequency synthesis, and jitter cleaning for mixed-clock domains |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Programmable logic fabric executing custom FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 600 DSP48E1 slices enable concurrent 1024-point FFTs at 125 MSPS, meeting airborne radar update-rate requirements. | Use Scenario: Digitizing and preprocessing analog sensor data from multi-channel ADCs in test equipment. IC Role / Device Role / Timing Role: High-bandwidth data concentrator and real-time decimation filter before host transfer. Use Value: 1,452 I/O pins support parallel 16-bit × 32-channel LVDS capture at 200 MSPS, reducing front-end ASIC dependency. |
| PCIe Gen2 Endpoint | Industrial Image Processing |
Use Scenario: Embedded vision system interfacing with host CPU via x4 PCIe Gen2 link for frame streaming. IC Role / Device Role / Timing Role: Root Complex-compatible endpoint managing DMA, TLP parsing, and error reporting per PCIe 2.1 spec. Use Value: Integrated GTY transceivers and hard IP blocks eliminate need for external switch or bridge IC, lowering BOM cost by ~$12. | Use Scenario: Real-time defect detection on production lines using multi-camera synchronized image analysis. IC Role / Device Role / Timing Role: Synchronizing four MIPI CSI-2 receivers and running convolution kernels on embedded BRAM-based buffers. Use Value: 16.8 Mb block RAM provides 32-frame buffer storage at 12-bit 4K resolution, enabling zero-latency pipeline stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGA2104I | UltraScale+ architecture, 2,586K logic cells, higher transceiver count (64 GTY), 16 nm process | Supports PCIe Gen4 and 25G Ethernet; requires updated toolchain and layout revision | Preferred for new designs requiring >10 Gb/s serial I/O or AI-accelerated inference |
| XC7K160T-L2FFG676I | Fewer logic cells (162,240), reduced I/O (500), same -2 speed grade and industrial temp rating | Suitable for cost-sensitive subsystems where full XC7K325T capacity is unused | Valid drop-in alternative only if design fits within 50% resource utilization and uses identical FFG676 footprint |
Compared with XC7K325T-L2FFG900I, the XCVU9P offers higher bandwidth but demands PCB redesign and newer Vivado versions, while the XC7K160T reduces cost and power only when resources are underutilized - neither is pin-compatible, and both require functional validation.
Availability
XC7K325T-L2FFG900I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and PCIe Gen2 endpoint applications requiring stable component supply across extended industrial temperature ranges.
Supply support for XC7K325T-L2FFG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, graphics, and AI acceleration technologies, with leadership in FPGA and heterogeneous processing platforms.
The Kintex-7 family, including XC7K325T-L2FFG900I, was designed for high-performance, cost-optimized applications in wired communications, video processing, and military/aerospace systems where balanced logic density, I/O bandwidth, and power efficiency are critical.
FAQ
What is the maximum supported transceiver line rate for XC7K325T-L2FFG900I?
The XC7K325T-L2FFG900I supports GTX transceivers with a maximum line rate of 6.6 Gb/s. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6 Gb/s), and SRIO 2.1 (5.0 GT/s) standards. Each GTX channel includes built-in clock data recovery and elastic buffers to maintain signal integrity at full rate.
Does XC7K325T-L2FFG900I support AES bitstream encryption?
Yes, XC7K325T-L2FFG900I supports AES-256 bitstream encryption with HMAC authentication. This feature secures configuration data against cloning or tampering during SPI flash loading. Encryption keys are stored in on-chip eFUSE and require proper key programming flow in Vivado before bitstream generation.
What configuration modes are supported by XC7K325T-L2FFG900I?
XC7K325T-L2FFG900I supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for compact flash-based deployment, while SelectMAP enables high-speed parallel configuration from microcontroller or processor.
Is XC7K325T-L2FFG900I qualified for industrial temperature operation?
Yes, XC7K325T-L2FFG900I is rated for -40°C to +100°C operation and is fully qualified per AMD's industrial temperature specifications. The -2 speed grade guarantees timing closure across this full range without derating, and thermal performance has been validated in the FFG900 package under airflow-constrained conditions.
How many DSP48E1 slices does XC7K325T-L2FFG900I contain?
XC7K325T-L2FFG900I contains 600 DSP48E1 slices. Each slice provides a 25×18 multiplier, 48-bit accumulator, and optional pre-adder, supporting pipelined arithmetic operations at up to 500 MHz. These are used for FIR filters, FFT engines, and matrix multiplication in signal processing applications.
XC7K325T-L2FFG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25475
- Number of Logic Elements/Cells:
- 326080
- Total RAM Bits:
- 16404480
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K325T-L2FFG900I FAQ
1.How can I place an order for XC7K325T-L2FFG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K325T-L2FFG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K325T-L2FFG900I reliable?
The price and inventory of XC7K325T-L2FFG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K325T-L2FFG900I is usually 5 days.
3.What payment methods are accepted for XC7K325T-L2FFG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K325T-L2FFG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K325T-L2FFG900I?
XC7K325T-L2FFG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K325T-L2FFG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K325T-L2FFG900I?
For technical support, including XC7K325T-L2FFG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K325T-L2FFG900I requirements.
6.How does Aetrix verify that XC7K325T-L2FFG900I is sourced from the original manufacturer or authorized distributors?
All XC7K325T-L2FFG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K325T-L2FFG900I meets industry standards.
7.What is the process for return or replacement of XC7K325T-L2FFG900I?
All XC7K325T-L2FFG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K325T-L2FFG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K325T-L2FFG900I part is unused and in its original packaging.
Return procedure for XC7K325T-L2FFG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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