My Inquiry
My Account
AMD XC7K355T-1FF901I
- Part No.:
- XC7K355T-1FF901I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K355T-1FF901I.pdf
- Description:
- IC FPGA 300 I/O 901FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,302
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K355T-1FF901I from AMD is a high-performance Kintex-7 FPGA featuring 354,250 logic cells, 1,472 DSP slices, and 28.5 Mb of block RAM, configured in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FF901) package for demanding high-speed serial and signal processing applications in radar and wired communications systems.
For engineers reviewing the XC7K355T-1FF901I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (up to 13.1 Gb/s), thermal performance (–40°C to +100°C junction), and configuration interface compatibility (SPIx4, SelectMAP).
Technical Context
The XC7K355T-1FF901I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices supporting 25 × 18-bit multiply-accumulate operations, and integrated 6.6 Gb/s to 13.1 Gb/s GTY transceivers. It supports PCI Express Gen3 x8, 10G Ethernet MAC, and deterministic AXI interconnects.
Configuration is performed via Master SPI or Slave SelectMAP modes using external flash or processor control; bitstream encryption and HMAC authentication are supported for secure boot. The device includes dual 32-bit AXI HP slave ports and one 64-bit AXI GP master port for high-bandwidth memory-mapped access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 354,250 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,472 - enables parallel execution of up to 1,472 independent 25×18-bit multiply-accumulate operations per clock |
| Block RAM | 28.5 Mb - provides on-chip memory for FIFOs, buffers, coefficient storage, and local data caching |
| User I/O Pins | 500 - supports high-density parallel interfaces including DDR3/DDR4 memory controllers and custom parallel buses |
| GTY Transceivers | 32 channels @ up to 13.1 Gb/s - delivers multi-protocol serial connectivity for 10G/25G Ethernet, CPRI, and JESD204B |
| Operating Temp | –40°C to +100°C - qualified for industrial and extended-temperature embedded deployments without derating |
| Configuration Interface | Master SPI x4 / Slave SelectMAP - enables fast, reliable, and secure bitstream loading from flash or host processor |
Pinout & Package
The XC7K355T-1FF901I is housed in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FF901) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects startup configuration mode (e.g., Master SPI, Slave SelectMAP, JTAG) |
| CCLK | Configuration Clock | Drives synchronous bitstream loading during SPI or SelectMAP configuration |
| DIN / DOUT | Serial Data I/O | Carries configuration data in Master SPI mode; bidirectional in Slave SelectMAP |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and initiates reconfiguration sequence |
| GTYP/GTYN | High-Speed Serial I/O | Differential pairs supporting 6.6–13.1 Gb/s transceiver operation with internal termination |
| HPSIO | High-Performance Single-Ended I/O | Supports 1.8 V, 2.5 V, and 3.3 V I/O standards with programmable drive strength and slew rate |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG Process | Enables higher logic density and lower dynamic power versus 40 nm FPGAs while maintaining timing predictability |
| DSP48E1 Slice | Delivers 25 × 18-bit signed multiplication with pre-adder and pipeline registers for efficient FIR/FFT implementation |
| GTY Transceiver | Integrates CDR, gearbox, and PRBS generator for protocol-agnostic high-speed serial links up to 13.1 Gb/s |
| AXI Interconnect | Provides low-latency, out-of-order transaction support across HP and GP AXI ports for heterogeneous SoC integration |
| Secure Boot | Uses AES-256 bitstream encryption and SHA-256 HMAC authentication to prevent unauthorized configuration and cloning |
Applications
| Radar Signal Processing | 10G/25G Ethernet Line Cards |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute fabric executing time-critical FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 1,472 DSP slices and 28.5 Mb block RAM enable concurrent multi-channel processing without external memory bottlenecks. | Use Scenario: Packet classification, header parsing, and traffic shaping in carrier-grade 10G/25G Ethernet switch line cards. IC Role / Device Role / Timing Role: Programmable packet-processing engine interfacing directly with 10G/25G PHYs via GTY transceivers. Use Value: 32 GTY transceivers at 13.1 Gb/s support full-duplex 25G links with integrated gearbox and FEC offload capability. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: High-throughput image reconstruction and real-time motion correction in MRI and CT scanner backend subsystems. IC Role / Device Role / Timing Role: Co-processor accelerating back-projection and iterative reconstruction kernels alongside host CPU. Use Value: 500 user I/Os allow direct connection to multiple ADC/DAC banks and DDR4 memory controllers for sustained >20 GB/s memory bandwidth. | Use Scenario: Flexible waveform generation, real-time spectral analysis, and protocol emulation in high-end oscilloscopes and protocol analyzers. IC Role / Device Role / Timing Role: Reconfigurable signal path controller synchronizing analog front-end sampling, digital down-conversion, and display rendering pipelines. Use Value: Deterministic AXI interconnect and –40°C to +100°C operation ensure stable timing alignment across temperature-varying lab environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FBVA676I | UltraScale architecture; 504,000 logic cells; 2,016 DSP slices; 32.1 Mb BRAM; 24 GTY transceivers | Higher logic density and DSP count but fewer GTY transceivers; optimized for PCIe Gen4 and 100G Ethernet | Choose for new designs requiring higher compute throughput and Gen4 PCIe root complex support |
| XC7VX485T-1FFG1157I | Virtex-7 family; 485,760 logic cells; 3,600 DSP slices; 37.3 Mb BRAM; 36 GTX transceivers (max 6.6 Gb/s) | Higher DSP and BRAM resources but limited to 6.6 Gb/s transceivers; no GTY-level serial protocol acceleration | Prefer when legacy GTX-based protocols dominate and maximum DSP parallelism outweighs serial speed requirements |
Compared with XC7K355T-1FF901I, XCKU040 offers greater logic scalability and PCIe Gen4 readiness, while XC7VX485T provides higher DSP density at the cost of transceiver speed-selection depends on whether serial bandwidth or arithmetic throughput dominates the system bottleneck.
Availability
XC7K355T-1FF901I is available at Aetrix Electronics and suitable for radar signal processing, 10G/25G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply across long production lifecycles.
Supply support for XC7K355T-1FF901I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets high-performance, cost-sensitive applications requiring balanced logic, DSP, memory, and serial I/O resources-designed specifically for wired communications, video processing, and defense electronics.
FAQ
What is the maximum transceiver line rate supported by the XC7K355T-1FF901I?
The XC7K355T-1FF901I integrates GTY transceivers capable of operating at line rates up to 13.1 Gb/s. This enables support for protocols including 10GBASE-KR, 25GBASE-KR, CPRI Option 10, and JESD204B subclass 1. The XC7K355T-1FF901I achieves this performance using adaptive equalization and built-in clock data recovery circuits without requiring external retimers.
Does the XC7K355T-1FF901I support encrypted configuration?
Yes, the XC7K355T-1FF901I supports AES-256 bitstream encryption and SHA-256 HMAC authentication for secure configuration. These features protect intellectual property and prevent unauthorized programming or cloning. The XC7K355T-1FF901I implements hardware-accelerated cryptographic engines that operate transparently during configuration without impacting startup time.
What I/O standards are compatible with the XC7K355T-1FF901I?
The XC7K355T-1FF901I supports LVCMOS, LVTTL, SSTL, HSTL, differential SSTL, and differential HSTL I/O standards across voltage ranges from 1.2 V to 3.3 V. Each bank is independently configurable, and the XC7K355T-1FF901I includes programmable drive strength, slew rate control, and internal termination for impedance matching.
How many GTY transceivers does the XC7K355T-1FF901I include?
The XC7K355T-1FF901I includes 32 GTY transceiver quads, providing up to 32 full-duplex high-speed serial lanes. Each GTY channel supports data rates from 6.6 Gb/s to 13.1 Gb/s and includes integrated gearbox, PRBS generator/checker, and elastic buffer functionality. This makes the XC7K355T-1FF901I suitable for multi-lane 25G Ethernet and JESD204B applications.
Is the XC7K355T-1FF901I qualified for industrial temperature operation?
Yes, the XC7K355T-1FF901I is rated for industrial temperature operation from –40°C to +100°C junction temperature. It is fully characterized and tested across this range for timing, power, and functionality. The XC7K355T-1FF901I's FF901 package includes a thermal lid to assist heat dissipation in thermally constrained embedded enclosures.
XC7K355T-1FF901I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27825
- Number of Logic Elements/Cells:
- 356160
- Total RAM Bits:
- 26357760
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 901-FCBGA (31x31)
XC7K355T-1FF901I FAQ
1.How can I place an order for XC7K355T-1FF901I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K355T-1FF901I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K355T-1FF901I reliable?
The price and inventory of XC7K355T-1FF901I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K355T-1FF901I is usually 5 days.
3.What payment methods are accepted for XC7K355T-1FF901I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K355T-1FF901I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K355T-1FF901I?
XC7K355T-1FF901I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K355T-1FF901I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K355T-1FF901I?
For technical support, including XC7K355T-1FF901I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K355T-1FF901I requirements.
6.How does Aetrix verify that XC7K355T-1FF901I is sourced from the original manufacturer or authorized distributors?
All XC7K355T-1FF901I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K355T-1FF901I meets industry standards.
7.What is the process for return or replacement of XC7K355T-1FF901I?
All XC7K355T-1FF901I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K355T-1FF901I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K355T-1FF901I part is unused and in its original packaging.
Return procedure for XC7K355T-1FF901I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K355T-1FF901I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
