AMD XC7K355T-1FFG901C

Overview

XC7K355T-1FFG901C from AMD is a Kintex-7 FPGA with 350K logic cells, 1,440 DSP slices, 23.5 Mb of block RAM, and 600 I/O pins in a 901-pin flip-chip BGA package. It targets high-throughput data processing in radar signal conditioning and 10G Ethernet line cards.

For engineers reviewing the XC7K355T-1FFG901C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (24× 6.6 Gb/s), I/O voltage support (1.2–3.3 V), thermal design power (18.5 W), and configuration interface (SPIx4/JTAG).

Technical Context

The XC7K355T-1FFG901C implements a 28 nm HKMG process-based architecture with SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. Its clocking system includes 24 CMTs-each with MMCM and PLL blocks-for jitter-tolerant multi-domain timing synthesis.

It integrates 24 GTPE2 transceivers operating up to 6.6 Gb/s with built-in PRBS generators/checkers and elastic buffers, and supports PCIe Gen2 x8 endpoint/root complex operation with integrated hard IP.

Key Specifications

Pinout & Package

XC7K355T-1FFG901C is housed in a 901-pin flip-chip fine-pitch BGA (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside requires solder paste stencil opening per Xilinx UG475.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based high-bandwidth signal processing applications.

Compared with XC7K410T-1FFG901C, the XC7K355T-1FFG901C offers lower static power and reduced toolchain compile time for mid-scale designs; versus XCKU040-1FFVA1156C, it provides proven qualification for industrial temperature operation and lower BOM cost in 6.6 Gb/s applications.

Availability

XC7K355T-1FFG901C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC7K355T-1FFG901C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, and embedded markets through its acquired Xilinx portfolio.

The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, memory, and I/O resources-particularly in wired communications and defense electronics.

FAQ

What is the maximum supported transceiver data rate for XC7K355T-1FFG901C?

The XC7K355T-1FFG901C supports a maximum transceiver line rate of 6.6 Gb/s using its GTPE2 transceivers. This rate is validated across all 24 transceiver quads under industrial temperature conditions (–40°C to +100°C) and applies to protocols including CPRI, JESD204B, and SATA III. The XC7K355T-1FFG901C does not support rates above 6.6 Gb/s-even with external equalization or forward error correction enabled.

Does XC7K355T-1FFG901C include hardened PCIe Gen2 IP?

Yes, the XC7K355T-1FFG901C integrates dedicated hard macro blocks for PCIe Gen2 x1, x2, x4, and x8 endpoint and root complex operation. These blocks implement the physical layer, data link layer, and transaction layer without consuming programmable logic resources. The XC7K355T-1FFG901C's PCIe IP is compliant with PCI Express Base Specification Revision 2.1 and supports MSI/MSI-X interrupt delivery.

What configuration modes are supported by XC7K355T-1FFG901C?

The XC7K355T-1FFG901C supports Master SPIx4, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPIx4 is the most commonly used method, enabling fast bitstream loading from quad-SPI flash devices. The XC7K355T-1FFG901C does not support BPI or NAND flash configuration without external glue logic.

What is the I/O voltage range supported per bank on XC7K355T-1FFG901C?

Each I/O bank on the XC7K355T-1FFG901C supports independently selectable VCCO voltages from 1.2 V to 3.3 V, allowing mixed-voltage interface operation. Banks must be grouped by compatible standards (e.g., LVCMOS18 and SSTL15 cannot share a bank). The XC7K355T-1FFG901C requires strict adherence to Xilinx UG475 bank voltage and termination rules to ensure signal integrity.

Is partial reconfiguration supported on XC7K355T-1FFG901C?

Yes, the XC7K355T-1FFG901C fully supports partial reconfiguration (PR) as defined in Xilinx UG702. PR allows dynamic replacement of logic modules while the rest of the design remains operational-critical for runtime adaptation in radar or test equipment. The XC7K355T-1FFG901C requires Vivado Design Suite 2017.4 or later and specific floorplanning constraints to implement PR successfully.