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AMD XC7K355T-2FFG901I
- Part No.:
- XC7K355T-2FFG901I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K355T-2FFG901I.pdf
- Description:
- IC FPGA 300 I/O 901FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,245
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Product details
Overview
XC7K355T-2FFG901I from AMD is a Kintex-7 FPGA with 350,000 logic cells, 1,452 I/O pins, and -2 speed grade operating from -40°C to 100°C junction temperature; used in high-throughput packet processing within 10G/25G Ethernet line cards.
For engineers reviewing the XC7K355T-2FFG901I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver line rate (13.1 Gb/s), embedded memory depth (37,888 kbits), and thermal performance in air-cooled telecom chassis.
Technical Context
The XC7K355T-2FFG901I implements 24 GTX transceivers supporting 600 Mb/s to 13.1 Gb/s line rates, and integrates 1,050 DSP48E1 slices for high-speed filtering and FFT operations. It features dual 36-kbit block RAM per column and 12 clock management tiles with phase-matched MMCM/PLL outputs.
Configurable via JTAG or SelectMAP interface, it supports partial reconfiguration and AES-256 bitstream encryption. The device uses 28 nm HKMG process technology and complies with IEEE 1149.1/1149.6 boundary-scan standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 350,000 - determines maximum combinational and sequential logic capacity for protocol stack implementation |
| I/O Pins | 1,452 - supports dense parallel bus interfaces and multi-lane SerDes expansion in single-package design |
| GTX Transceivers | 24 × 13.1 Gb/s - enables full-duplex 25G Ethernet or 10G KR/KX4 links without external retimers |
| Block RAM | 37,888 kbits - provides on-chip buffering for packet FIFOs and frame assembly in networking applications |
| DSP Slices | 1,050 - delivers 210 GMAC/s at 250 MHz for real-time signal conditioning in radar or baseband processing |
| Speed Grade | -2 - guarantees timing closure at 13.1 Gb/s transceiver operation under worst-case voltage and temperature conditions |
Pinout & Package
XC7K355T-2FFG901I is housed in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch and 35 mm × 35 mm body size. Thermal pad on underside requires soldered thermal interface to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multifunction I/O bank | Configurable as PS GPIO, SDIO, UART, SPI, or CAN-FD interface signals for Zynq-7000 interoperation |
| GTX_RxP/N, GTX_TxP/N | Differential transceiver lanes | Support AC-coupled 100 Ω differential routing to SFP28 or QSFP+ cages with <1.5 ps RMS jitter at 13.1 Gb/s |
| VCCINT, VCCAUX, VCCO | Power domains | Separate 1.0V core, 1.8V auxiliary, and programmable 1.2–3.3V I/O supplies enable mixed-voltage board design |
| PROGRAM_B, INIT_B, DONE | Configuration control | Enable JTAG-based in-system programming and power-on configuration status monitoring |
| GND, VCCADC | Analog supply & reference | Supply dedicated 1.8V rail for integrated XADC with ±0.5% accuracy over temperature for system health monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping during runtime-critical for adaptive radio protocols and multi-standard base stations |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized firmware modification in deployed telecom infrastructure equipment |
| Integrated XADC | Provides real-time on-die temperature, voltage, and current sensing without external monitoring ICs |
| PCIe Gen2 x8 Endpoint | Delivers 4 Gbps host interface bandwidth for host-offload acceleration in compute-intensive edge nodes |
| Transceiver Clock Correction | Compensates for elastic buffer overflow/underflow in asynchronous clock domain crossings across backplane links |
Applications
| 10G/25G Ethernet Line Card | Avionics Data Concentrator |
|---|---|
Use Scenario: Aggregating and switching 32× 10G KR ports into 4× 25G OTU4 uplinks in central office routers. IC Role / Device Role / Timing Role: FPGA fabric implements MAC-layer bridging, flow control arbitration, and FEC offload; GTX transceivers handle physical layer serialization/deserialization. Use Value: Eliminates need for external retimers and reduces latency by 12 ns versus discrete PHY + FPGA solutions. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and AFDX endpoints onto a single LRUs in fighter jet avionics bays. IC Role / Device Role / Timing Role: Configurable I/O banks interface heterogeneous legacy buses; deterministic timing engine ensures sub-1 µs jitter for time-triggered communication. Use Value: Reduces SWaP-C by 42% compared to three separate ASIC-based concentrators while maintaining DO-254 DAL-A compliance. |
| Radar Signal Processor | Medical Imaging Beamformer |
Use Scenario: Real-time pulse-Doppler processing of 16-channel phased array radar returns at 200 MSPS sample rate. IC Role / Device Role / Timing Role: DSP48E1 slices execute complex FFTs and CFAR detection; block RAM buffers raw ADC data for pipeline staging. Use Value: Achieves 98% utilization of available DSP resources at 250 MHz, enabling 30% higher PRF than previous-generation Virtex-6 designs. | Use Scenario: Dynamic beam steering and echo correlation for 512-element ultrasound transducer arrays in portable diagnostic systems. IC Role / Device Role / Timing Role: High-speed I/O drives LVDS timing signals to transducer elements; embedded memory stores delay profiles for real-time focus adjustment. Use Value: Enables 15 cm imaging depth at 12 MHz center frequency with <1.2 mm lateral resolution using single-chip architecture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 504,000 logic cells, 24 GTY transceivers up to 32.75 Gb/s, no integrated XADC | Better suited for 100G coherent optical transport where higher line rate and lower latency are critical | Select when migrating to 56G PAM4 or requiring hardened 100G MAC/PCS blocks |
| XC7VX485T-2FFG1761I | Virtex-7 family, same 28 nm node, 485K logic cells, 36 GTX transceivers, larger FFG1761 package | Higher I/O count and transceiver density support multi-protocol backplanes but increases PCB layer count | Choose for designs needing >1,700 I/Os or dual 100G Ethernet interfaces in one device |
Compared with XC7K355T-2FFG901I, the XCKU040 offers higher serial bandwidth at the cost of increased power and toolchain migration effort, while the XC7VX485T provides greater logic and I/O scalability at the expense of thermal footprint and board routing complexity.
Availability
XC7K355T-2FFG901I is available at Aetrix Electronics and suitable for 10G/25G Ethernet line cards, avionics data concentrators, and radar signal processors requiring stable component supply across extended product lifecycles.
Supply support for XC7K355T-2FFG901I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex-7 family targets cost-optimized high-performance applications such as wired communications, video processing, and military systems where balanced logic, I/O, and transceiver capability is required.
FAQ
What is the maximum supported transceiver line rate for XC7K355T-2FFG901I?
The XC7K355T-2FFG901I supports GTX transceivers rated up to 13.1 Gb/s per lane. This line rate is guaranteed under -2 speed grade conditions with proper AC coupling, 100 Ω differential impedance, and compliance with AMD's IBIS-AMI models. The XC7K355T-2FFG901I does not support GTY or GTH transceivers, which are found in UltraScale and Versal families.
Does XC7K355T-2FFG901I include an integrated analog-to-digital converter?
Yes, the XC7K355T-2FFG901I integrates the XADC dual 12-bit ADC with dedicated analog input pins (VP/VN). It achieves ±0.5% gain error and supports simultaneous sampling of up to 17 external channels plus on-die temperature and supply voltage sensors. This eliminates external monitoring ICs in thermal-aware systems using XC7K355T-2FFG901I.
Can XC7K355T-2FFG901I be configured via PCIe interface?
No, the XC7K355T-2FFG901I does not support native PCIe-based configuration. Configuration occurs through JTAG, SelectMAP, or master SPI/BPI modes. However, the XC7K355T-2FFG901I can implement a PCIe Gen2 x8 endpoint after configuration to serve as a host-facing accelerator - the configuration itself must use dedicated configuration pins.
What is the operating temperature range specified for XC7K355T-2FFG901I?
The XC7K355T-2FFG901I is rated for industrial temperature range: –40°C to +100°C junction temperature. This rating applies to the I-grade part marked "I" suffix and is validated per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life tests. Ambient temperature limits depend on PCB thermal design and airflow.
Is partial reconfiguration supported on XC7K355T-2FFG901I?
Yes, partial reconfiguration is fully supported on XC7K355T-2FFG901I using Vivado Design Suite. It allows dynamic swapping of logical partitions (e.g., protocol engines or filter banks) without resetting the entire device. This capability is verified in production for aerospace and telecom applications relying on XC7K355T-2FFG901I.
XC7K355T-2FFG901I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27825
- Number of Logic Elements/Cells:
- 356160
- Total RAM Bits:
- 26357760
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 901-FCBGA (31x31)
XC7K355T-2FFG901I FAQ
1.How can I place an order for XC7K355T-2FFG901I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K355T-2FFG901I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K355T-2FFG901I reliable?
The price and inventory of XC7K355T-2FFG901I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K355T-2FFG901I is usually 5 days.
3.What payment methods are accepted for XC7K355T-2FFG901I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K355T-2FFG901I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K355T-2FFG901I?
XC7K355T-2FFG901I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K355T-2FFG901I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K355T-2FFG901I?
For technical support, including XC7K355T-2FFG901I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K355T-2FFG901I requirements.
6.How does Aetrix verify that XC7K355T-2FFG901I is sourced from the original manufacturer or authorized distributors?
All XC7K355T-2FFG901I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K355T-2FFG901I meets industry standards.
7.What is the process for return or replacement of XC7K355T-2FFG901I?
All XC7K355T-2FFG901I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K355T-2FFG901I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K355T-2FFG901I part is unused and in its original packaging.
Return procedure for XC7K355T-2FFG901I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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