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AMD XC7K355T-3FFG901E
- Part No.:
- XC7K355T-3FFG901E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K355T-3FFG901E.pdf
- Description:
- IC FPGA 300 I/O 901FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,310
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Product details
Overview
XC7K355T-3FFG901E from AMD is a high-performance Kintex-7 FPGA with 354,250 logic cells, 2,160 DSP slices, and 24.8 Mb of block RAM, configured in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and embedded vision applications.
For engineers reviewing the XC7K355T-3FFG901E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -3 speed grade timing performance across industrial temperature range.
Technical Context
The XC7K355T-3FFG901E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), integrated PCIe Gen2/Gen3 endpoints, and 32 GT transceivers supporting protocols including SRIO, CPRI, and 10GbE. It includes hardened memory controllers for DDR3/DDR3L up to 1,866 Mb/s.
Configuration is supported via JTAG, SPIx4, or BPI parallel modes, with dual-boot capability and AES-256 bitstream encryption. The device supports partial reconfiguration and AXI4 interconnect infrastructure for heterogeneous system integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 354,250 - total available LUTs + flip-flops for combinatorial and sequential logic implementation |
| DSP Slices | 2,160 - dedicated 25×18 multiplier-accumulator units for high-throughput arithmetic |
| Block RAM | 24.8 Mb - distributed as 36 Kb BRAM primitives supporting true dual-port operation |
| GT Transceivers | 32 × 13.1 Gb/s - serial I/O supporting multi-protocol physical layer compliance |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - 500 user-configurable I/O pins with programmable drive strength and slew rate |
| Speed Grade | -3 - fastest timing bin for Kintex-7, enabling highest clock frequencies in critical paths |
| Operating Temp | -40°C to +100°C - industrial temperature range validated for extended thermal environments |
Pinout & Package
XC7K355T-3FFG901E is housed in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, SelectIO, and transceiver analog circuitry |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per I/O bank; determines compatible interface voltage levels |
| MGTAVCC | Transceiver analog supply | 1.0 V analog supply for GT transceiver PLLs and serializers/deserializers |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
| CCLK | Configuration clock | Input clock for master SPI/BPI configuration mode; frequency ≤ 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root complex and endpoint logic enabling direct host CPU connectivity without external bridge |
| AXI4 Interconnect | Integrated crossbar and interconnect IP supporting concurrent read/write transactions across multiple masters/slaves |
| Partial Reconfiguration | Dynamic module swapping at runtime without full device reset or interrupting active functions |
| AES-256 Encryption | On-chip decryption engine protecting bitstream confidentiality against cloning or reverse engineering |
| DDR3 Memory Controller | Hard IP supporting 16-bit/32-bit interfaces up to 1,866 Mb/s with built-in calibration and ECC support |
Applications
| High-Speed Data Acquisition | Medical Imaging Systems |
|---|---|
Use Scenario: Real-time digitization and preprocessing of multi-channel sensor data at >1 GS/s aggregate throughput. IC Role / Device Role / Timing Role: FPGA fabric performs time-critical signal conditioning, decimation, and packetization before transmission over PCIe Gen3. Use Value: 32 GT transceivers and 2,160 DSP slices enable deterministic latency and on-the-fly beamforming computation. | Use Scenario: Ultrasound beamformer and MRI gradient controller requiring synchronized multi-axis timing and high-reliability processing. IC Role / Device Role / Timing Role: XC7K355T-3FFG901E serves as real-time control unit managing ADC/DAC timing, RF pulse sequencing, and safety-critical watchdog logic. Use Value: Industrial temperature rating and AES-256 bitstream protection meet IEC 62304 Class C software safety requirements. |
| 5G Wireless Baseband | Defense Radar Processing |
Use Scenario: Massive MIMO baseband processing with real-time channel estimation, precoding, and OFDM modulation/demodulation. IC Role / Device Role / Timing Role: XC7K355T-3FFG901E implements layered PHY-layer accelerators using DSP slices and block RAM for FFT/IFFT and channel equalization. Use Value: 13.1 Gb/s GT transceivers interface directly to RFICs via JESD204B v2.0, eliminating external serializer/deserializer chips. | Use Scenario: Active electronically scanned array (AESA) radar front-end with adaptive beam steering and clutter suppression. IC Role / Device Role / Timing Role: XC7K355T-3FFG901E executes pulse-Doppler processing, CFAR detection, and STAP algorithms in hardware-accelerated pipelines. Use Value: Partial reconfiguration allows mission-mode updates of radar waveform libraries without system reboot or downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, higher logic density (568K LC), 20.4 Gb/s GTY transceivers, no native PCIe Gen3 endpoint hard IP | Targeted at next-generation 100G+ Ethernet and AI inference acceleration where protocol flexibility outweighs PCIe integration | Select when migrating to 16 nm node for improved power efficiency and bandwidth scalability beyond Kintex-7 limits |
| XC7VX485T-3FFG1761E | Virtex-7 family, larger capacity (485K LC), same 13.1 Gb/s GTX transceivers, higher power consumption and cost | Suitable for applications requiring maximum logic resources and memory bandwidth, such as large-scale packet inspection or video transcoding | Choose when XC7K355T-3FFG901E logic or BRAM is insufficient but Kintex-7 ecosystem compatibility must be retained |
Compared with XC7K355T-3FFG901E, XCKU060-2FFVA1156I offers greater bandwidth and newer process technology but lacks integrated PCIe Gen3, while XC7VX485T-3FFG1761E provides more resources within the same 28 nm generation at higher thermal and cost overhead.
Availability
XC7K355T-3FFG901E is available at Aetrix Electronics and suitable for high-speed data acquisition, medical imaging systems, 5G wireless baseband, defense radar processing, and industrial machine vision applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC7K355T-3FFG901E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.
The Kintex-7 FPGA family targets cost-optimized, high-performance applications including wired communications, video processing, and test & measurement equipment where balanced logic, DSP, and I/O resources are essential.
FAQ
What is the maximum supported transceiver line rate for XC7K355T-3FFG901E?
The XC7K355T-3FFG901E supports a maximum transceiver line rate of 13.1 Gb/s per GT channel. This performance is guaranteed under industrial temperature conditions and -3 speed grade operation, enabling compliance with JESD204B v2.0, 10GBASE-R, and CPRI standards. All 32 GT transceivers on the XC7K355T-3FFG901E achieve this rate without derating.
Does XC7K355T-3FFG901E include a hard PCIe Gen3 endpoint?
Yes, XC7K355T-3FFG901E integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. This includes full link training, power management states (L0–L2), and MSI/MSI-X interrupt handling. The hard IP eliminates the need for soft-core PCIe implementations and reduces resource utilization on the XC7K355T-3FFG901E fabric.
What I/O standards are supported by XC7K355T-3FFG901E?
XC7K355T-3FFG901E supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, Differential SSTL, HSTL, and TMDS I/O standards across its 500 user-configurable pins. Each I/O bank operates independently with selectable VCCO, allowing mixed-voltage interfaces on a single device. Termination resistors and slew rate control are programmable per pin group.
Is partial reconfiguration supported on XC7K355T-3FFG901E?
Yes, XC7K355T-3FFG901E fully supports partial reconfiguration through Xilinx Vivado Design Suite. This enables dynamic swapping of logical modules-such as filter banks or protocol engines-without resetting the entire device or halting active functions. The feature relies on frame-based bitstream loading and verified boundary logic isolation within the XC7K355T-3FFG901E architecture.
What is the operating temperature range for XC7K355T-3FFG901E?
XC7K355T-3FFG901E is rated for industrial temperature operation from -40°C to +100°C case temperature. This range is validated per JEDEC JESD22-A104 and applies to all speed grades and configurations. Thermal design guidelines specify maximum junction temperature of 125°C, with thermal resistance (θJA) dependent on PCB layout and heatsinking for the 901-pin FC-FBGA package.
XC7K355T-3FFG901E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27825
- Number of Logic Elements/Cells:
- 356160
- Total RAM Bits:
- 26357760
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 901-FCBGA (31x31)
XC7K355T-3FFG901E FAQ
1.How can I place an order for XC7K355T-3FFG901E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K355T-3FFG901E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K355T-3FFG901E reliable?
The price and inventory of XC7K355T-3FFG901E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K355T-3FFG901E is usually 5 days.
3.What payment methods are accepted for XC7K355T-3FFG901E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K355T-3FFG901E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K355T-3FFG901E?
XC7K355T-3FFG901E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K355T-3FFG901E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K355T-3FFG901E?
For technical support, including XC7K355T-3FFG901E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K355T-3FFG901E requirements.
6.How does Aetrix verify that XC7K355T-3FFG901E is sourced from the original manufacturer or authorized distributors?
All XC7K355T-3FFG901E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K355T-3FFG901E meets industry standards.
7.What is the process for return or replacement of XC7K355T-3FFG901E?
All XC7K355T-3FFG901E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K355T-3FFG901E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K355T-3FFG901E part is unused and in its original packaging.
Return procedure for XC7K355T-3FFG901E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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