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AMD XC7K355T-L2FFG901I
- Part No.:
- XC7K355T-L2FFG901I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K355T-L2FFG901I.pdf
- Description:
- IC FPGA 300 I/O 901FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,982
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Product details
Overview
XC7K355T-L2FFG901I from AMD is a Kintex-7 FPGA with 350K logic cells, 1,440 DSP slices, 28.1 Mb of block RAM, and support for DDR3 memory interfaces up to 800 MHz. It operates at -2 speed grade and features 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging, deployed in high-throughput data acquisition systems requiring deterministic latency and parallel processing.
For engineers reviewing the XC7K355T-L2FFG901I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility (1.2V/1.35V/1.5V/1.8V), transceiver line rates (up to 6.6 Gb/s), and configuration interface options (SPIx4, BPI, SelectMAP).
Technical Context
The XC7K355T-L2FFG901I implements a heterogeneous architecture integrating programmable logic fabric, hardened IP blocks (PCIe Gen2 x8, Gigabit Ethernet MACs), and high-speed serial transceivers. It supports partial reconfiguration and AXI4 interconnect protocols for system-on-module integration.
Configuration is performed via master SPI or JTAG, with dual-boot capability using external flash. The device uses 28 nm HKMG process technology and supports industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 350,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,440 - enables concurrent multiply-accumulate operations for signal processing pipelines |
| Block RAM | 28.1 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| Transceiver Max Rate | 6.6 Gb/s - supports 10GbE, CPRI, and JESD204B serial links with embedded clock recovery |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing to DDR3, ADCs, DACs, and FPGAs across mixed-voltage systems |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under industrial thermal conditions |
Pinout & Package
XC7K355T-L2FFG901I is housed in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and industrial-grade thermal performance (θJA = 3.5°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source (SPI/BPI/SelectMAP) and configuration mode at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI programming; externally generated |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Initialization | Active-low signal asserting reset during configuration failure or reconfiguration request |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter reference for multi-gigabit transceivers; requires dedicated differential input pair |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Hard IP | Reduces integration effort for host interface applications by eliminating soft-core PCIe stack synthesis and timing closure |
| AXI4 Interconnect Support | Enables plug-and-play integration of custom IP with Xilinx-provided peripherals and memory controllers |
| Partial Reconfiguration | Allows dynamic logic swapping without full device reset-critical for mission-critical systems requiring continuous operation |
| Industrial Temp Range | Validated operation from –40°C to +100°C junction temperature, supporting deployment in uncontrolled environments |
| 28 nm HKMG Process | Delivers improved power efficiency and higher gate density versus previous 40 nm generation FPGAs |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR detection; transceivers interface with ADC/DACs at 1 GSPS. Use Value: 350K logic cells and 1,440 DSP slices enable simultaneous multi-channel processing with sub-microsecond latency. | Use Scenario: High-resolution CT/MRI image reconstruction pipeline with real-time motion correction. IC Role / Device Role / Timing Role: Configurable logic implements back-projection algorithms; DDR3 controller manages 800 MHz frame buffer access. Use Value: 28.1 Mb block RAM eliminates need for external SRAM, reducing board area and power in compact imaging modules. |
| 5G Baseband Unit | Test & Measurement Equipment |
Use Scenario: Layer 1 PHY processing for massive MIMO radio units with CPRI/eCPRI fronthaul. IC Role / Device Role / Timing Role: GTX transceivers handle 6.6 Gb/s CPRI lanes; hardened Ethernet MACs manage OAM traffic. Use Value: Native 6.6 Gb/s transceivers and PCIe Gen2 x8 support scalable fronthaul aggregation without retiming ICs. | Use Scenario: Modular digital oscilloscope with 10 GS/s sampling and deep memory capture. IC Role / Device Role / Timing Role: Logic fabric processes trigger logic and waveform analysis; I/O banks interface to multiple ADC front-ends. Use Value: Multi-voltage I/O support (1.2V–1.8V) enables direct connection to diverse high-speed ADC families without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 504K logic cells, higher transceiver count (20× 12.5 Gb/s), no native PCIe Gen2 hard IP | Better suited for 25G+ serial protocols and larger-scale packet processing; lacks integrated PCIe Gen2 x8 | Select when >6.6 Gb/s line rates or >350K logic cells are required; verify PCIe implementation uses soft IP |
| XC7K410T-2FFG901I | Same Kintex-7 family, 407K logic cells, identical pinout and package, higher logic density at same speed grade | Direct upgrade path for designs needing more LUTs or DSP slices without PCB change | Choose for capacity-limited designs where footprint and thermal profile must remain unchanged |
Compared with XC7K355T-L2FFG901I, XC7K410T-2FFG901I offers higher logic density in identical packaging, while XCKU040-2FFVA1156I delivers superior serial bandwidth and scalability at the cost of increased power and PCIe implementation complexity.
Availability
XC7K355T-L2FFG901I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and 5G baseband unit applications requiring stable component supply across extended product lifecycles.
Supply support for XC7K355T-L2FFG901I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, AI, and high-performance processing solutions for data centers, embedded systems, and edge devices.
The Kintex-7 FPGA family targets cost-optimized, high-performance applications including wired communications, video processing, and test equipment-designed to balance logic capacity, transceiver bandwidth, and power efficiency.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7K355T-L2FFG901I?
The XC7K355T-L2FFG901I supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s), implemented via its MIG (Memory Interface Generator) IP core with calibration support for industrial temperature range operation. This speed applies to single-ended and differential address/control signals with matched trace routing per UG586 guidelines. XC7K355T-L2FFG901I does not support DDR4 or LPDDR3 natively.
Does XC7K355T-L2FFG901I include hard IP for PCIe Gen2?
Yes, XC7K355T-L2FFG901I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. It supports both root complex and endpoint configurations, with automatic link training and error reporting. The hard IP reduces resource usage and simplifies timing closure compared to soft-core implementations in XC7K355T-L2FFG901I designs.
What configuration modes are supported by XC7K355T-L2FFG901I?
XC7K355T-L2FFG901I supports master SPI, slave SPI, BPI, and SelectMAP configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for single-flash boot; BPI supports parallel NOR flash for faster configuration. All modes are validated across the industrial temperature range for XC7K355T-L2FFG901I.
Is XC7K355T-L2FFG901I qualified for industrial temperature operation?
Yes, XC7K355T-L2FFG901I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. Thermal validation includes package-level θJA = 3.5°C/W and derating curves per DS182. This qualification applies specifically to the -L2FFG901I speed/package variant, not lower-grade versions.
Can XC7K355T-L2FFG901I perform partial reconfiguration?
Yes, XC7K355T-L2FFG901I supports partial reconfiguration through Vivado Design Suite tools, enabling dynamic logic module swapping without resetting the entire device. This capability is verified in hardware for the XC7K355T-L2FFG901I using frame-based bitstream updates and secure configuration registers.
XC7K355T-L2FFG901I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27825
- Number of Logic Elements/Cells:
- 356160
- Total RAM Bits:
- 26357760
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 901-FCBGA (31x31)
XC7K355T-L2FFG901I FAQ
1.How can I place an order for XC7K355T-L2FFG901I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K355T-L2FFG901I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K355T-L2FFG901I reliable?
The price and inventory of XC7K355T-L2FFG901I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K355T-L2FFG901I is usually 5 days.
3.What payment methods are accepted for XC7K355T-L2FFG901I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K355T-L2FFG901I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K355T-L2FFG901I?
XC7K355T-L2FFG901I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K355T-L2FFG901I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K355T-L2FFG901I?
For technical support, including XC7K355T-L2FFG901I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K355T-L2FFG901I requirements.
6.How does Aetrix verify that XC7K355T-L2FFG901I is sourced from the original manufacturer or authorized distributors?
All XC7K355T-L2FFG901I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K355T-L2FFG901I meets industry standards.
7.What is the process for return or replacement of XC7K355T-L2FFG901I?
All XC7K355T-L2FFG901I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K355T-L2FFG901I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K355T-L2FFG901I part is unused and in its original packaging.
Return procedure for XC7K355T-L2FFG901I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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