AMD XC7K410T-1FBG676C

Overview

XC7K410T-1FBG676C from AMD is a Kintex-7 FPGA with 405,000 logic cells, 2,080 DSP slices, 28.25 Mb of block RAM, and 600 I/O pins in a 676-pin FCBGA package. It operates at -1 speed grade (1.0 ns CLB delay), supports transceivers up to 6.6 Gb/s, and targets high-performance digital signal processing in radar and wired communications systems.

For engineers reviewing the XC7K410T-1FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2 V to 3.3 V), thermal design power (21.5 W typical), and configuration interface compatibility (SPIx4, SelectMAP).

Technical Context

The XC7K410T-1FBG676C implements a heterogeneous architecture with programmable logic fabric, hardened transceivers, and integrated memory controllers. It includes 24 GTX transceivers supporting protocols including PCIe Gen2, SRIO, and CPRI, and features dual 32-bit DDR3 memory interfaces with 800 MHz data rates.

Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI interconnect for SoC-style integration, targeting deterministic latency and high-throughput data path applications.

Key Specifications

Pinout & Package

XC7K410T-1FBG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG475.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC7K410T-1FBG676C, XCKU040-1FBVA676C offers higher serial bandwidth and logic density but requires new PCB layout and toolchain migration, while XC7K325T-1FBG676C shares pin compatibility and tooling but reduces DSP and memory capacity for lower-cost deployment.

Availability

XC7K410T-1FBG676C is available at Aetrix Electronics and suitable for radar signal processing, medical ultrasound systems, high-speed test equipment, and wired communications infrastructure requiring stable component supply and long-term program support.

Supply support for XC7K410T-1FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets through its acquired Xilinx product portfolio.

The Kintex-7 family was designed for balanced performance, power, and cost in high-throughput, I/O-intensive applications such as wireless infrastructure, video processing, and test instrumentation.

FAQ

What is the maximum supported transceiver data rate for XC7K410T-1FBG676C?

The XC7K410T-1FBG676C supports GTX transceivers with a maximum data rate of 6.6 Gb/s. This rate is validated for protocols including CPRI, SRIO Gen2, and 10GBASE-R. Each GTX transceiver can be configured independently, and the device contains 24 such transceivers. The XC7K410T-1FBG676C does not support GTH or GTY transceivers, which appear in later FPGA families.

Does XC7K410T-1FBG676C support DDR4 memory interfaces?

No, XC7K410T-1FBG676C does not support DDR4. It integrates hardened controllers for DDR3 and LPDDR3 only, with data rates up to 800 MHz (1600 MT/s). DDR4 support was introduced in the UltraScale and later families. For DDR4 requirements, engineers should evaluate alternatives such as XCKU040-1FBVA676C or newer AMD Versal devices.

What configuration modes are supported by XC7K410T-1FBG676C?

XC7K410T-1FBG676C supports Master SPI, Slave Serial, Slave Parallel (SelectMAP), and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Bitstream encryption and HMAC authentication are available in all modes except JTAG-only programming. The XC7K410T-1FBG676C requires external non-volatile storage (e.g., SPI flash) for autonomous boot.

Is XC7K410T-1FBG676C pin-compatible with other Kintex-7 devices in the FBG676 package?

XC7K410T-1FBG676C is pin-compatible with other Kintex-7 FPGAs in the same FBG676 package, including XC7K325T-1FBG676C and XC7K160T-1FBG676C. Pin functions are consistent across speed grades and temperature grades within the same package. However, unused pins may differ in bank voltage assignment or I/O standard support depending on total logic resource utilization.

What thermal management guidance applies to XC7K410T-1FBG676C?

XC7K410T-1FBG676C has a typical thermal design power (TDP) of 21.5 W under representative workloads. AMD recommends a 4-layer PCB with internal ground/power planes, thermal vias under the package's exposed thermal pad, and a heatsink rated for ≥15°C/W junction-to-ambient. Junction temperature must remain below 100°C for commercial-grade operation. The XC7K410T-1FBG676C includes on-die temperature sensors accessible via XADC.