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AMD XC7K410T-1FBG676I
- Part No.:
- XC7K410T-1FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-1FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,180
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Product details
Overview
XC7K410T-1FBG676I from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, 28.5 Mb of block RAM, and 600 I/O pins in a 676-pin FCBGA package. It operates at -1 speed grade (1.0 ns CLB delay) and supports transceivers up to 13.1 Gb/s for high-speed serial interface applications in radar signal processing and 10G Ethernet line cards.
For engineers reviewing the XC7K410T-1FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (24 GTs), thermal design power (19.2 W typical), and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XC7K410T-1FBG676I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen2 x8, Gigabit Ethernet MACs, and 24 multi-gigabit transceivers supporting protocols such as CPRI, SRIO, and 10GBASE-R. Its CLB structure uses six-input LUTs with dual flip-flops per slice.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication supported. The device integrates clock management tiles with MMCM and PLL blocks capable of generating output frequencies from 10 MHz to 810 MHz with sub-150 fs jitter performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - total configurable logic resources for complex digital logic implementation |
| DSP Slices | 2,080 - fixed-point arithmetic units supporting 25 × 18-bit multiply-accumulate operations per slice |
| Block RAM | 28.5 Mb - distributed memory capacity usable as true dual-port RAM or FIFO buffers |
| Transceivers | 24 GT - multi-gigabit serial lanes supporting 600 Mb/s to 13.1 Gb/s data rates |
| I/O Pins | 600 - user-configurable pins supporting LVDS, SSTL, HSTL, and TMDS standards |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under industrial temperature range |
| TDP | 19.2 W typical - thermal design power used for heatsink and airflow planning in sealed enclosures |
Pinout & Package
XC7K410T-1FBG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 array, 1.0 mm ball pitch, and 35 mm × 35 mm body size. Thermal pad on underside requires solder paste stencil aperture and ground plane connection for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Power Ground | Reference return path for all I/O banks and internal logic; must be connected to low-impedance PCB ground plane |
| VCCINT | Core Supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Supply | 1.8 V ±3% supply for configuration logic, transceivers, and clock management tiles |
| M0–M2 | Mode Pins | Three-pin strap defining configuration mode (e.g., Master SPI, Slave SelectMAP, JTAG) |
| INIT_B | Status Signal | Open-drain output indicating configuration status; pulled high during valid bitstream loading |
| CCLK | Configuration Clock | Input clock for Master SPI configuration; frequency ≤ 50 MHz; drives internal configuration logic |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Hard IP | Integrated endpoint/root complex controller eliminating external PHY and reducing latency by >300 ns |
| 24 GT Transceivers | Each supports protocol auto-negotiation for CPRI, SRIO, and 10GBASE-R without external retimers |
| MMCM + PLL Clocking | Two independent clock management tiles enabling simultaneous generation of 6 distinct output clocks with <150 fs RMS jitter |
| Bitstream Encryption | AES-256 encryption with HMAC authentication prevents unauthorized configuration and cloning of design IP |
| Partial Reconfiguration | Enables dynamic logic module swapping in-system without full device reset or service interruption |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GT transceivers interface with ADC/DAC over JESD204B. Use Value: 24 GT lanes enable direct connection to eight 12-bit/4-GSPS ADCs, eliminating serializer/deserializer chips and reducing board area by 22%. | Use Scenario: Aggregation and packet forwarding in telecom central office line cards supporting 10GBASE-R and OTU2 interfaces. IC Role / Device Role / Timing Role: Implements MAC, PCS, and FEC layers; GT transceivers handle line-rate 10.3125 Gb/s encoding/decoding. Use Value: Hardened PCIe Gen2 x8 interface allows direct CPU host attachment for control plane traffic, reducing software overhead by 40% versus soft-core implementations. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners using parallelized back-projection algorithms. IC Role / Device Role / Timing Role: Configurable logic processes raw k-space data; block RAM buffers streaming data between processing stages. Use Value: 28.5 Mb of block RAM enables storage of two full 512×512×128 voxel datasets simultaneously, enabling real-time iterative reconstruction. | Use Scenario: Modular digitizer and arbitrary waveform generator modules requiring synchronized multi-channel sampling at ≥1 GS/s. IC Role / Device Role / Timing Role: Manages time-interleaved ADC/DAC channels; MMCM generates phase-aligned clocks for channel skew correction. Use Value: Sub-150 fs clock jitter ensures ENOB ≥ 10.2 bits at 1 GHz input frequency, meeting IEEE 1057 Class A compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture; 504,000 logic cells; higher transceiver count (40 GT); 0.85 V core voltage | Better suited for 25G+ serial protocols and larger algorithm footprints; requires revised power delivery network | Select when migrating to higher bandwidth or needing >24 GT lanes; not pin-compatible with XC7K410T-1FBG676I |
| XC7VX485T-2FFG1761I | Virtex-7 family; 485,760 logic cells; same -2 speed grade; 1761-pin FFG package | Higher I/O count and memory bandwidth; targets compute-intensive video analytics and baseband processing | Choose for applications requiring >600 I/Os or additional GTX transceivers; different package prevents drop-in replacement |
Compared with XC7K410T-1FBG676I, XCKU040-2FFVA1156I offers greater serial bandwidth but demands new PCB layout and power design, while XC7VX485T-2FFG1761I delivers more logic and I/O at the cost of larger footprint and higher TDP-neither is pin-compatible, requiring full redesign for migration.
Availability
XC7K410T-1FBG676I is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-1FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets through FPGA, adaptive SoC, and AI processor technologies.
The Kintex-7 family targets cost-optimized high-performance applications demanding balanced logic, DSP, memory, and I/O resources-designed specifically for wired communications, video processing, and test equipment.
FAQ
What is the maximum transceiver data rate supported by XC7K410T-1FBG676I?
The XC7K410T-1FBG676I supports transceiver data rates from 600 Mb/s up to 13.1 Gb/s per GT lane. This capability enables compliance with 10GBASE-R, CPRI Option 3, and SRIO Gen2 protocols. The actual achievable rate depends on PCB interconnect quality, reference clock stability, and signal integrity margin measured per UG476.
Does XC7K410T-1FBG676I support partial reconfiguration?
Yes, XC7K410T-1FBG676I supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules without resetting the entire device. The feature is validated in UG909 and requires specific HDL coding practices and floorplanning constraints to ensure timing closure of reconfigurable partitions.
What configuration modes are available for XC7K410T-1FBG676I?
XC7K410T-1FBG676I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pin strapping at power-up. Configuration bitstream can be stored in external SPI flash (for Master SPI) or loaded via microprocessor (for Slave SelectMAP), as defined in UG470.
What is the operating temperature range for XC7K410T-1FBG676I?
XC7K410T-1FBG676I is rated for industrial temperature operation from –40 °C to +100 °C case temperature. This rating applies to the -1 speed grade variant and is verified per JEDEC JESD22-A104. Thermal derating curves and junction-to-case resistance (θJC = 0.39 °C/W) are provided in DS182.
How many PCIe Gen2 endpoints can XC7K410T-1FBG676I implement?
XC7K410T-1FBG676I contains one hardened PCIe Gen2 x8 endpoint block. It cannot instantiate multiple independent PCIe endpoints; however, it supports bifurcation into x4/x4 or x2/x2/x2/x2 configurations under root complex mode. Full x8 link width is required for maximum throughput of 4 GB/s bidirectional.
XC7K410T-1FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-1FBG676I FAQ
1.How can I place an order for XC7K410T-1FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-1FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-1FBG676I reliable?
The price and inventory of XC7K410T-1FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-1FBG676I is usually 5 days.
3.What payment methods are accepted for XC7K410T-1FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-1FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-1FBG676I?
XC7K410T-1FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-1FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-1FBG676I?
For technical support, including XC7K410T-1FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-1FBG676I requirements.
6.How does Aetrix verify that XC7K410T-1FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-1FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-1FBG676I meets industry standards.
7.What is the process for return or replacement of XC7K410T-1FBG676I?
All XC7K410T-1FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-1FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-1FBG676I part is unused and in its original packaging.
Return procedure for XC7K410T-1FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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