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AMD XC7K410T-1FBG900C
- Part No.:
- XC7K410T-1FBG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-1FBG900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,507
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Product details
Overview
XC7K410T-1FBG900C from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, 28.5 Mb of block RAM, and 600 I/O pins in a 900-pin FCBGA package. It operates at -1 speed grade (1.0 ns CLB delay) and supports transceivers up to 13.1 Gb/s for high-speed serial interface applications in radar signal processing and 10G Ethernet line cards.
For engineers reviewing the XC7K410T-1FBG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count and data rate, block RAM depth, DSP slice availability, and thermal envelope for convection-cooled industrial deployments.
Technical Context
The XC7K410T-1FBG900C implements a heterogeneous architecture with programmable logic fabric, hardened multi-gigabit transceivers (MGTs), and integrated memory controllers. It supports PCIe Gen2 x8, SATA 3.0, and CPRI protocols via its 24 GTY transceivers, each configurable for 1.6–13.1 Gb/s operation.
It includes dual 32-bit AXI HP slave interfaces, 24 clock management tiles (CMTs) with PLL and MMCM, and supports JTAG, SelectMAP, and ICAP configuration modes. The device targets deterministic latency and high I/O bandwidth in real-time embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational/sequential logic capacity for algorithm acceleration |
| DSP Slices | 2,040 - enables parallel multiply-accumulate operations for FIR filtering and FFT computation |
| Block RAM | 28.5 Mb - supports large on-chip buffering for video frame storage or packet queuing |
| I/O Pins | 600 - provides high-density interconnect for parallel buses, DDR3/DDR4 memory, and sensor arrays |
| Transceivers | 24 GTY - delivers 13.1 Gb/s per lane for 100G KR4 or 4x25G Ethernet PHY layer implementation |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under industrial temperature |
| Package | 900-pin FCBGA (27×27 mm, 1.0 mm pitch) - enables high I/O density with controlled impedance routing |
Pinout & Package
XC7K410T-1FBG900C is housed in a 900-ball Fine-Pitch Column Grid Array (FCBGA) package with 27×27 ball array, 1.0 mm pitch, and 1.35 mm body height. Thermal pad on underside supports conduction cooling in ruggedized enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA logic fabric; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and select I/O banks |
| VCCO | I/O bank power | Programmable 1.2–3.3V per bank; supports mixed-voltage interfacing |
| MGTAVCC | Transceiver analog supply | 1.0V supply for GTY transceiver analog circuitry; critical for jitter performance |
| CLK_IN | Dedicated clock input | Single-ended or differential reference clock input to CMT for system timing synthesis |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| 24 GTY Transceivers | Each supports 1.6–13.1 Gb/s with built-in 8b/10b and 64b/66b encoding for protocol compliance |
| AXI4-HP Interfaces | Dual 32-bit high-performance slave ports enable direct connection to ARM-based processors without bridge logic |
| PCIe Gen2 x8 Endpoint | Hard IP block reduces integration effort and ensures compliance with PCIe 2.1 electrical and protocol specs |
| Configurable I/O Standards | Supports LVDS, SSTL, HSTL, TMDS, and MIPI D-PHY across 34 I/O banks for sensor and display interfacing |
| Partial Reconfiguration | Enables dynamic logic swapping during operation for adaptive signal processing in phased-array radar |
Applications
| Radar Signal Processing | 10G/25G Ethernet Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTY transceivers interface with ADC/DAC converters and RF front-end modules. Use Value: 2,040 DSP slices and deterministic timing enable sub-microsecond latency for adaptive nulling algorithms. | Use Scenario: Aggregation and switching of 10G/25G Ethernet traffic in telecom central office equipment. IC Role / Device Role / Timing Role: Implements MAC, PCS, and PMA layers; GTY transceivers provide physical layer connectivity to optical modules. Use Value: 24 GTY lanes support 4×25G KR or 10G KR4 configurations with <1 ps RMS jitter for IEEE 802.3bj compliance. |
| Medical Imaging Backend | Industrial Machine Vision Controller |
Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Processes raw k-space data using FFT and iterative reconstruction; interfaces to DDR4 memory and PCIe host CPU. Use Value: 28.5 Mb block RAM buffers full k-space matrices while 405,550 logic cells run parallel reconstruction engines. | Use Scenario: Multi-camera synchronization and real-time defect classification on factory-floor vision systems. IC Role / Device Role / Timing Role: Coordinates camera triggers via I/O banks; runs CNN inference accelerators on programmable logic fabric. Use Value: 600 I/O pins support 8+ MIPI CSI-2 lanes and GPIO for lighting/stage control with sub-100 ns timing precision. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FFVA1156C | UltraScale architecture; 504,000 logic cells; higher transceiver count (40 GTH); 1.2 V core voltage | Better suited for 100G+ coherent optical transport requiring >20 Gb/s per lane | Select when migrating to higher bandwidth or needing native 25.8 Gb/s transceivers |
| XC7K325T-1FBG900C | Same Kintex-7 family; 325,000 logic cells; 1,440 DSP slices; identical 900-pin FCBGA package | Lower gate count and DSP resources; suitable for cost-optimized 10G Ethernet or mid-tier radar | Choose for design reuse where XC7K410T-1FBG900C resources exceed requirements |
Compared with XC7K410T-1FBG900C, XCKU040-1FFVA1156C offers higher transceiver bandwidth and logic density but requires PCB redesign due to different package and voltage rails; XC7K325T-1FBG900C shares footprint and voltage compatibility but trades 20% logic and 30% DSP capacity for lower cost and power.
Availability
XC7K410T-1FBG900C is available at Aetrix Electronics and suitable for radar signal processing, 10G/25G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-1FBG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources-targeting wireless infrastructure, video processing, and industrial automation.
FAQ
What is the maximum transceiver data rate supported by XC7K410T-1FBG900C?
The XC7K410T-1FBG900C supports GTY transceivers with a maximum data rate of 13.1 Gb/s per lane. This enables compliance with 10GBASE-KR, 25GBASE-KR, and CPRI Option 7 standards. The transceiver architecture includes built-in clock data recovery (CDR), equalization, and 8b/10b encoding. All 24 GTY lanes meet this specification under industrial temperature conditions when powered per AMD's recommended voltage and decoupling guidelines for XC7K410T-1FBG900C.
Does XC7K410T-1FBG900C support partial reconfiguration?
Yes, XC7K410T-1FBG900C supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logic modules without resetting the entire device, enabling adaptive functionality in real-time systems such as radar beam steering or protocol-aware network switches. Configuration is managed via ICAP and PCIe-based configuration access ports. Partial bitstreams must be validated for timing and resource usage before deployment on XC7K410T-1FBG900C.
What I/O standards are supported by XC7K410T-1FBG900C?
XC7K410T-1FBG900C supports 21 I/O standards across its 34 configurable I/O banks, including LVDS, SSTL-18/25, HSTL-I/II, TMDS, MIPI D-PHY, and differential signaling standards like BLVDS and RSDS. Each bank is independently powered (VCCO = 1.2–3.3 V), allowing mixed-voltage operation. These capabilities are documented in the Kintex-7 FPGA Data Sheet (DS182) and verified for XC7K410T-1FBG900C in production silicon characterization reports.
Is XC7K410T-1FBG900C pin-compatible with other Kintex-7 devices in the same package?
XC7K410T-1FBG900C shares the 900-pin FCBGA (FBG900) package with XC7K325T-1FBG900C and XC7K355T-1FBG900C, and exhibits identical pinout for power, ground, configuration, and dedicated clock inputs. However, I/O pin functions and bank assignments differ between variants, so PCB layout reuse requires verification of I/O banking constraints and voltage domain mapping specific to XC7K410T-1FBG900C.
What configuration modes does XC7K410T-1FBG900C support?
XC7K410T-1FBG900C supports multiple configuration modes: Master SPI, Slave SelectMAP, JTAG, and ICAP. It also supports fallback configuration and multi-boot via external flash. Configuration bitstream loading can occur over PCIe using the ICAP interface, enabling runtime updates. All modes are fully specified in the Kintex-7 Configuration User Guide (UG470) and validated for XC7K410T-1FBG900C in production test.
XC7K410T-1FBG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-1FBG900C FAQ
1.How can I place an order for XC7K410T-1FBG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-1FBG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-1FBG900C reliable?
The price and inventory of XC7K410T-1FBG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-1FBG900C is usually 5 days.
3.What payment methods are accepted for XC7K410T-1FBG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-1FBG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-1FBG900C?
XC7K410T-1FBG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-1FBG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-1FBG900C?
For technical support, including XC7K410T-1FBG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-1FBG900C requirements.
6.How does Aetrix verify that XC7K410T-1FBG900C is sourced from the original manufacturer or authorized distributors?
All XC7K410T-1FBG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-1FBG900C meets industry standards.
7.What is the process for return or replacement of XC7K410T-1FBG900C?
All XC7K410T-1FBG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-1FBG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-1FBG900C part is unused and in its original packaging.
Return procedure for XC7K410T-1FBG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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