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AMD XC7K410T-1FBG900I
- Part No.:
- XC7K410T-1FBG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-1FBG900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,380
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Product details
Overview
XC7K410T-1FBG900I from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, and 28.25 Mb of block RAM, packaged in a 900-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch. It targets high-performance serial transceiver applications including 10G Ethernet and PCIe Gen2 endpoint designs.
For engineers reviewing the XC7K410T-1FBG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gbps, and -40°C to +100°C industrial temperature grade.
Technical Context
The XC7K410T-1FBG900I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36-Kb RAM blocks, and integrated multi-gigabit transceivers (MGTs) supporting protocols including CPRI, SATA, and SRIO. It includes dedicated clock management tiles with MMCM and PLL blocks for low-jitter clock synthesis.
Configuration is performed via JTAG, SelectMAP, or SPI interfaces, and it supports partial reconfiguration. The device uses configuration memory with AES-256 bitstream encryption and HMAC authentication for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 2,080 - enables high-throughput arithmetic operations for filtering, FFT, and math-intensive algorithms |
| Block RAM | 28.25 Mb - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| Transceiver Line Rate | 6.6 Gbps - meets minimum requirement for 10GBASE-R, PCIe Gen2, and CPRI Option 3 |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - allows direct interface to DDR3, video PHYs, and high-speed ADCs/DACs |
| Operating Temperature | -40°C to +100°C - qualified for industrial and extended-temperature embedded systems |
| Configuration Interface | JTAG, SPIx4, SelectMAP x16 - provides flexibility for in-system programming and production test access |
Pinout & Package
XC7K410T-1FBG900I is housed in a 900-pin Flip-Chip BGA (FCBGA) package with 0.8 mm ball pitch, 31 × 31 mm body size, and thermal lid. Pin assignment follows Xilinx UG475 v1.14 (Kintex-7 FPGA Packaging and Pinout) for Bank 0–35, including dedicated configuration, clock, MGT, and I/O pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTVCCAUX | Analog & auxiliary transceiver supply | Must be independently filtered and regulated to ±3% for stable 6.6 Gbps operation |
| CLK_IN / CLK_OUT | Dedicated single-ended clock input/output | Connects to on-board oscillators or system clocks; supports 10–1000 MHz range |
| PROGRAM_B / INIT_B | Configuration control signals | Active-low PROGRAM_B resets configuration logic; INIT_B indicates configuration status |
| CCLK / DINS / DOUT | Master SPI configuration interface | Enables serial bitstream loading from flash memory during power-up |
| VCCO_13 / VCCO_16 | I/O bank output voltage supplies | Set per-bank voltage (1.2–3.3 V) to match interfaced peripheral signaling standards |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic updates in operational systems without full device reset or downtime |
| AES-256 Bitstream Encryption | Protects intellectual property by preventing unauthorized readback or cloning of configured logic |
| Integrated Clock Management | MMCM and PLL blocks deliver sub-150 fs jitter for deterministic timing closure in high-speed SerDes links |
| PCIe Gen2 Endpoint Hard IP | Reduces integration effort and verification time for host-compliant endpoints using AXI4 streaming interface |
| UltraScale-Compatible Toolflow | Allows migration path to UltraScale+ devices using same Vivado design environment and constraints methodology |
Applications
| 10G Ethernet Line Card | Medical Imaging Accelerator |
|---|---|
Use Scenario: High-density packet processing and MAC-layer offload in telecom infrastructure. IC Role / Device Role / Timing Role: FPGA fabric implements custom packet classifiers, flow managers, and 10GBASE-R PCS/PMA with precise 156.25 MHz reference clocking. Use Value: XC7K410T-1FBG900I delivers deterministic latency and 6.6 Gbps transceiver performance required for wire-speed forwarding. | Use Scenario: Real-time image reconstruction in MRI and CT scanners using parallelized back-projection algorithms. IC Role / Device Role / Timing Role: XC7K410T-1FBG900I serves as compute accelerator interfacing with high-speed ADCs and DDR3 memory subsystems. Use Value: 2,080 DSP slices and 28.25 Mb block RAM enable on-chip execution of iterative reconstruction kernels without off-chip bottlenecks. |
| Avionics Data Concentrator | Industrial Vision Controller |
Use Scenario: ARINC 664 (AFDX) end-system aggregation of sensor and actuator data across multiple LRUs. IC Role / Device Role / Timing Role: XC7K410T-1FBG900I implements deterministic AFDX endpoint logic with time-triggered scheduling and CRC-32 validation. Use Value: Industrial temperature rating (-40°C to +100°C) and SEU mitigation features ensure reliability in uncontrolled avionics bays. | Use Scenario: Multi-camera machine vision inspection in semiconductor wafer handling equipment. IC Role / Device Role / Timing Role: XC7K410T-1FBG900I synchronizes four MIPI CSI-2 receivers and performs real-time blob analysis using binary morphology operators. Use Value: 405,550 logic cells support concurrent pixel pipelines and frame buffering across eight camera channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-performance logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K420T-1FBG900I | Higher logic density (423,550 cells), identical package and pinout, same speed grade | Offers margin for future RTL expansion; no change to PCB or power delivery | Select when additional CLB headroom is needed for post-silicon feature upgrades |
| XCKU040-1FBVA676I | UltraScale architecture, 533,950 logic cells, 22.1 Mb BRAM, 16.3 Gbps transceivers | Requires new PCB layout, updated power sequencing, and Vivado 2016.4+ toolflow | Choose for next-generation designs requiring higher bandwidth and lower power per logic cell |
Compared with XC7K410T-1FBG900I, XC7K420T-1FBG900I offers incremental logic capacity within identical mechanical and electrical constraints, while XCKU040-1FBVA676I delivers architectural advancement at the cost of redesign effort and toolchain upgrade.
Availability
XC7K410T-1FBG900I is available at Aetrix Electronics and suitable for 10G Ethernet line cards, medical imaging accelerators, avionics data concentrators, and industrial vision controllers requiring stable component supply across long product lifecycles.
Supply support for XC7K410T-1FBG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic, DSP, memory, and transceiver resources - particularly in wired communications, video processing, and industrial automation.
FAQ
What is the maximum transceiver line rate supported by XC7K410T-1FBG900I?
The XC7K410T-1FBG900I supports a maximum transceiver line rate of 6.6 Gbps per channel. This specification is validated per Xilinx DS182 (Kintex-7 DC and Switching Characteristics) and enables compliance with 10GBASE-R, PCIe Gen2, and CPRI Option 3 protocols. The device contains 24 GTPE2 transceivers, each configurable within this rate range under industrial temperature conditions.
Does XC7K410T-1FBG900I support partial reconfiguration?
Yes, XC7K410T-1FBG900I fully supports partial reconfiguration through the Vivado Design Suite. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. Implementation requires proper floorplanning, checkpoint-based flows, and use of the RECONFIG_PORT primitive - all documented in UG908 (Vivado Design Suite User Guide: Partial Reconfiguration).
What configuration modes are available for XC7K410T-1FBG900I?
XC7K410T-1FBG900I supports three primary configuration modes: JTAG for debugging and programming, Master SPI for serial flash-based boot, and SelectMAP for high-speed parallel loading. Each mode uses dedicated pins and has defined power-on reset sequences. Configuration mode selection is controlled by mode pins (M[2:0]) and must be set before INIT_B deassertion.
Is XC7K410T-1FBG900I qualified for industrial temperature operation?
Yes, XC7K410T-1FBG900I is rated for industrial temperature operation from -40°C to +100°C (junction). This qualification is specified in the device's ordering information and confirmed in DS182, which lists thermal derating curves and power consumption limits across the full range. Thermal management must comply with UG475's package-specific thermal guidelines.
What security features does XC7K410T-1FBG900I provide?
XC7K410T-1FBG900I includes AES-256 bitstream encryption and HMAC authentication for secure configuration. These features prevent unauthorized readback, cloning, or modification of the programmed logic. Key provisioning is performed via battery-backed RAM or eFUSE, and decryption occurs transparently during configuration - all enforced in hardware without software dependency.
XC7K410T-1FBG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-1FBG900I FAQ
1.How can I place an order for XC7K410T-1FBG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-1FBG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-1FBG900I reliable?
The price and inventory of XC7K410T-1FBG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-1FBG900I is usually 5 days.
3.What payment methods are accepted for XC7K410T-1FBG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-1FBG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-1FBG900I?
XC7K410T-1FBG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-1FBG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-1FBG900I?
For technical support, including XC7K410T-1FBG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-1FBG900I requirements.
6.How does Aetrix verify that XC7K410T-1FBG900I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-1FBG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-1FBG900I meets industry standards.
7.What is the process for return or replacement of XC7K410T-1FBG900I?
All XC7K410T-1FBG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-1FBG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-1FBG900I part is unused and in its original packaging.
Return procedure for XC7K410T-1FBG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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