AMD XC7K410T-1FF900I
- Part No.:
- XC7K410T-1FF900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-1FF900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,343
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Product details
Overview
XC7K410T-1FF900I from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, packaged in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FF900). It targets high-throughput data processing in radar signal conditioning, PCIe Gen2 endpoint interfaces, and 10G Ethernet MAC layer acceleration.
For engineers reviewing the XC7K410T-1FF900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O bank voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, thermal design power (14.5 W typical), and -40°C to +100°C industrial temperature grade.
Technical Context
The XC7K410T-1FF900I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated carry chains, and dual-register LUTs. It integrates 24 GTX transceivers supporting protocols including CPRI, SRIO, and PCIe Gen2.
It features SelectIO technology with programmable I/O standards (LVDS, SSTL, HSTL), on-chip termination, and per-pin delay control. Configuration occurs via JTAG, SPIx4, or BPI parallel modes using external flash or PROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 2,040 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 28.5 Mb - supports large on-die buffering for video frame stores or packet queues |
| GTX Transceivers | 24 × 6.6 Gb/s - provides serial connectivity for optical modules or backplane links |
| I/O Pins | 500 - usable single-ended or differential signals across 34 I/O banks |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without forced cooling |
| TDP | 14.5 W typical - informs heatsink sizing and PCB copper pour requirements |
Pinout & Package
XC7K410T-1FF900I uses a 900-ball Flip-Chip Fine-Pitch BGA (FF900) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Pin assignment follows Xilinx UG475 v1.13 (Kintex-7 FPGA Packaging and Pinouts).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for configuration circuitry, clock management, and transceiver analog blocks |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V output driver voltage per bank, enabling mixed-voltage interface |
| MRCC/MRCC_N | Multi-Gigabit RefClk | Dedicated differential input pair for GTX transceiver reference clocks (100–650 MHz) |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% analog rail for GTX PLLs and serializers/deserializers |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping during operation without full device reset |
| AXI Interconnect Integration | Reduces integration effort for ARM-based Zynq-7000 co-processing systems |
| PCIe Gen2 Endpoint Hard IP | Offloads link-layer protocol handling, reducing soft-logic resource usage |
| UltraScale-Compatible Toolflow | Allows migration path to newer architectures using same Vivado design environment |
| Bitstream Encryption | Prevents reverse engineering via AES-256 decryption with battery-backed eFUSE key storage |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with latency-critical beamforming. IC Role / Device Role / Timing Role: FPGA fabric executes time-sliced FFTs and CFAR detection; GTX transceivers stream ADC samples from RF front-end. Use Value: 2,040 DSP slices enable concurrent 1024-point FFTs at 200 MS/s, meeting sub-5 µs latency budget. | Use Scenario: High-resolution ultrasound beamformer with 128-channel echo digitization and synthetic aperture reconstruction. IC Role / Device Role / Timing Role: Configurable I/O interfaces LVDS ADCs; block RAM buffers channel data before GPU offload. Use Value: 500 I/O pins support simultaneous 128× LVDS pairs; 28.5 Mb RAM holds 4-frame buffer at 16-bit depth. |
| 10G Ethernet Line Card | Industrial Machine Vision Controller |
Use Scenario: Optical transport node aggregating eight 1G Ethernet streams into a single 10G SFP+ uplink. IC Role / Device Role / Timing Role: MAC-layer packet classification, VLAN tagging, and flow control using hardwired Ethernet IP cores. Use Value: PCIe Gen2 endpoint handles host CPU communication; GTX transceivers drive SFP+ electrical interface directly. | Use Scenario: Embedded vision system performing real-time defect detection on PCB assembly lines using multi-camera fusion. IC Role / Device Role / Timing Role: Synchronizes four MIPI CSI-2 camera inputs and runs Sobel edge detection kernels in fabric. Use Value: SelectIO supports MIPI D-PHY 1.2 signaling; 405,550 logic cells accommodate four parallel image pipelines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FFVA1156I | Ultrascale architecture, 504,000 logic cells, higher transceiver count (40 × 12.5 Gb/s), 20.2 W TDP | Better suited for 25G/100G Ethernet and AI inference acceleration | Select when migrating to higher bandwidth or requiring hardened 25G Ethernet MAC |
| XC7K325T-1FF676I | Same Kintex-7 family, 326,080 logic cells, 16 GTX transceivers, 400 I/O pins, lower TDP (11.2 W) | Optimized for cost-sensitive embedded vision or motor control where full XC7K410T resources are unused | Choose for footprint-compatible down-bin option with reduced logic and I/O count |
Compared with XC7K410T-1FF900I, the XCKU040 offers higher throughput but requires new PCB layout and thermal redesign, while the XC7K325T retains identical toolflow and pin compatibility within the FF676 package-making it suitable for scalable design reuse where performance headroom allows.
Availability
XC7K410T-1FF900I is available at Aetrix Electronics and suitable for radar signal conditioning, 10G Ethernet line cards, and industrial machine vision controllers requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-1FF900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, graphics, and AI technologies, delivering high-performance programmable logic solutions since acquiring Xilinx in 2022.
The Kintex-7 family was originally designed by Xilinx for mid-range performance-per-watt applications in wired communications, video processing, and test equipment-balancing logic density, transceiver capability, and power efficiency.
FAQ
What is the maximum supported transceiver line rate for XC7K410T-1FF900I?
The XC7K410T-1FF900I supports GTX transceivers rated up to 6.6 Gb/s per lane. This line rate is validated for protocols including CPRI, SRIO 2.0, and PCIe Gen2. Operation at 6.6 Gb/s requires proper board-level signal integrity design, including controlled impedance routing and appropriate AC coupling capacitor placement as specified in Xilinx UG476.
Does XC7K410T-1FF900I support partial reconfiguration?
Yes, XC7K410T-1FF900I fully supports partial reconfiguration through Vivado Design Suite. This capability allows runtime modification of designated logic regions without resetting the entire device. The feature relies on dedicated configuration logic and frame-based bitstream addressing, and is documented in Xilinx UG909.
What I/O standards are supported by XC7K410T-1FF900I?
XC7K410T-1FF900I supports LVCMOS, LVTTL, SSTL, HSTL, HSUL, and differential standards including LVDS, BLVDS, RSDS, and TMDS. Each of its 34 I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V, enabling mixed-interface designs such as DDR3 memory controllers alongside sensor interfaces.
Is XC7K410T-1FF900I qualified for industrial temperature operation?
Yes, XC7K410T-1FF900I is rated for -40°C to +100°C case temperature operation and is marked with the 'I' speed grade suffix indicating industrial qualification. Thermal derating curves and junction-to-case resistance values are provided in Xilinx DS182, confirming suitability for fanless enclosures in factory automation equipment.
What configuration modes does XC7K410T-1FF900I support?
XC7K410T-1FF900I supports Master SPIx4, Slave Serial, Slave Parallel, and JTAG configuration modes. Primary boot typically uses quad-SPI flash, while JTAG remains available for debugging and field updates. Configuration bitstream encryption and HMAC authentication are enabled via eFUSE programming in the device's security register set.
XC7K410T-1FF900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-1FF900I FAQ
1.How can I place an order for XC7K410T-1FF900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-1FF900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-1FF900I reliable?
The price and inventory of XC7K410T-1FF900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-1FF900I is usually 5 days.
3.What payment methods are accepted for XC7K410T-1FF900I?
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Once your XC7K410T-1FF900I order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for XC7K410T-1FF900I?
For technical support, including XC7K410T-1FF900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-1FF900I requirements.
6.How does Aetrix verify that XC7K410T-1FF900I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-1FF900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-1FF900I meets industry standards.
7.What is the process for return or replacement of XC7K410T-1FF900I?
All XC7K410T-1FF900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-1FF900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-1FF900I part is unused and in its original packaging.
Return procedure for XC7K410T-1FF900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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