AMD XC7K410T-1FFG676C

Overview

XC7K410T-1FFG676C from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, 28.5 Mb of block RAM, and 480 I/O pins in a 676-pin FCBGA package. It operates at -1 speed grade (1.0 ns CLB delay) and supports transceivers up to 6.6 Gb/s for high-speed serial interface applications in radar signal processing and 10G Ethernet line cards.

For engineers reviewing the XC7K410T-1FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, DSP slice density, and thermal envelope for conduction-cooled embedded systems.

Technical Context

The XC7K410T-1FFG676C implements a heterogeneous architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and 36-Kb block RAMs with true dual-port capability. It integrates 24 GTX transceivers supporting protocols including PCIe Gen2, SRIO Gen2, and CPRI.

Configuration is performed via JTAG or master/slave SPI/BPI modes, with support for partial reconfiguration and bitstream encryption using AES-256. The device uses 28 nm HKMG process technology and operates over 0°C to 85°C junction temperature range.

Key Specifications

Pinout & Package

XC7K410T-1FFG676C is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 29 × 29 mm body size, 1.0 mm ball pitch, and standard I/O power sequencing requirements (VCCINT = 1.0V, VCCAUX = 1.8V, VCCO = 1.2–3.3V).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based compute acceleration applications.

Compared with XC7K325T-2FFG676C and XCKU040-2FFVA1156I, the XC7K410T-1FFG676C offers optimal balance of DSP density, transceiver count, and thermal footprint for mid-bandwidth embedded signal processing where upgrade path to Ultrascale is not yet required.

Availability

XC7K410T-1FFG676C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet line cards, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC7K410T-1FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and AI accelerator technologies.

The Kintex-7 family targets high-performance, cost-sensitive applications such as wireless infrastructure, video processing, and test equipment where balanced logic, DSP, and I/O resources are critical.

FAQ

What is the maximum supported transceiver data rate for XC7K410T-1FFG676C?

The XC7K410T-1FFG676C supports GTX transceivers with a maximum data rate of 6.6 Gb/s per lane. This enables compliance with 10G Ethernet (10GBASE-R), CPRI Option 3, and PCIe Gen2 standards. The transceiver architecture includes built-in clock data recovery, elastic buffers, and 8B/10B encoding/decoding logic. All 24 GTX transceivers on the XC7K410T-1FFG676C meet this specification under industrial temperature conditions.

Does XC7K410T-1FFG676C support partial reconfiguration?

Yes, the XC7K410T-1FFG676C fully supports partial reconfiguration through the Vivado Design Suite. This capability allows dynamic replacement of specific logic modules while the rest of the design remains operational. Implementation requires use of the Pblock constraint methodology and bitstream generation with incremental checkpointing. Partial reconfiguration is validated for XC7K410T-1FFG676C in AMD UG909 and is used in field-deployed radar and instrumentation systems.

What power supply voltages does XC7K410T-1FFG676C require?

The XC7K410T-1FFG676C requires three primary supply rails: VCCINT = 1.0V ±3% for core logic, VCCAUX = 1.8V ±3% for auxiliary circuits including configuration and transceivers, and VCCO = 1.2V to 3.3V (depending on I/O standard) for output drivers. Each rail has defined sequencing requirements-VCCAUX must be stable before VCCINT, and both must be present before configuration begins. These specifications apply directly to the XC7K410T-1FFG676C in its FFG676 package.

Is XC7K410T-1FFG676C compatible with Xilinx Vivado tools?

Yes, the XC7K410T-1FFG676C is fully supported in Xilinx Vivado Design Suite versions 2013.4 through 2023.2. Synthesis, implementation, and bitstream generation are validated for this exact part number. Constraint handling, timing analysis, and power estimation models are calibrated specifically for XC7K410T-1FFG676C's silicon characteristics and FFG676 package parasitics. AMD maintains backward compatibility for this device across all supported Vivado releases.

What is the operating temperature range for XC7K410T-1FFG676C?

The XC7K410T-1FFG676C is rated for industrial temperature operation from 0°C to +85°C junction temperature. This rating applies to the C-grade version indicated by the final 'C' in the part number. Thermal design must ensure junction temperature remains within this range under worst-case power dissipation. The FFG676 package's thermal resistance (θJA) is 5.8°C/W, measured per JEDEC JESD51-2 standards for the XC7K410T-1FFG676C configuration.