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AMD XC7K410T-1FFG676I
- Part No.:
- XC7K410T-1FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-1FFG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,708
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Product details
Overview
XC7K410T-1FFG676I from AMD is a Kintex-7 FPGA with 405,000 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, configured in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-performance embedded vision and industrial control applications.
For engineers reviewing the XC7K410T-1FFG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (400 user I/Os), transceiver line rate (up to 13.1 Gbps), and -1 speed grade timing performance under industrial temperature range (-40°C to +100°C).
Technical Context
The XC7K410T-1FFG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and integrated 36 Kb block RAM (BRAM) with true dual-port capability. It supports PCI Express Gen2 x8 endpoint functionality and includes hardened Gigabit transceivers compliant with IEEE 802.3 and CPRI standards.
This device integrates clock management tiles (CMT) containing PLLs and MMCMs for jitter reduction and phase alignment, and supports SelectIO™ technology with programmable I/O standards including LVDS, SSTL, HSTL, and TMDS up to 1.8 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,000 - total available LUT-based configurable resources for combinatorial and sequential logic implementation |
| DSP Slices | 2,080 - dedicated arithmetic units supporting 25×18 signed multiplication and accumulation per slice |
| Block RAM | 28.5 Mb - distributed as 1,728 × 36 Kb BRAM primitives, each configurable as single/dual-port memory |
| User I/O Pins | 400 - banked I/Os supporting voltage-standard flexibility and on-die termination calibration |
| Transceiver Line Rate | Up to 13.1 Gbps - enables 10G Ethernet, CPRI, and JESD204B interface implementation |
| Speed Grade | -1 - guarantees maximum operating frequency and timing closure at industrial temperature range (-40°C to +100°C) |
| Package | FFG676 - 676-ball flip-chip FBGA, 27×27 mm, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC7K410T-1FFG676I is housed in a 676-ball Flip-Chip Fine-Pitch BGA (FFG676) package with 400 user-configurable I/Os distributed across 16 I/O banks. Power and ground balls are arranged per AMD Kintex-7 PCB layout guidelines to support simultaneous switching noise (SSN) mitigation and signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and transceivers; shared with I/O banks |
| VCCO | I/O bank power | Programmable 1.2–1.8V per bank; sets output voltage level and compatible I/O standard |
| M0–M2 | Configuration mode pins | Set boot source (e.g., Master SPI, Slave SelectMAP) during power-on reset |
| CCLK | Configuration clock | Drives internal configuration shift register; can be internally generated or externally supplied |
| INIT_B | Configuration status | Active-low open-drain signal indicating configuration memory readiness and error state |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hardened root complex and endpoint logic enabling direct host CPU interfacing without external bridge IC |
| UltraScale-compatible I/O | SelectIO™ supports 24+ I/O standards including MIPI D-PHY, LPDDR3, and sub-1.2V signaling with dynamic impedance control |
| Transceiver Calibration | On-chip eye scan and adaptive equalization enable reliable 13.1 Gbps operation over FR4 backplanes |
| Partial Reconfiguration Support | Enables runtime logic module swapping without full device reboot-critical for radar waveform updates and protocol adaptation |
| Industrial Temperature Rating | Qualified for continuous operation from -40°C to +100°C ambient, meeting EN 50155 for rail transport electronics |
Applications
| Medical Imaging Systems | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in digital X-ray and MRI systems requiring pixel-level filtering and histogram equalization. IC Role / Device Role / Timing Role: FPGA fabric executes parallelized image processing kernels while transceivers stream raw sensor data from CMOS/CCD arrays. Use Value: 405K logic cells and 2,080 DSP slices enable concurrent multi-algorithm execution with deterministic latency under 5 µs. | Use Scenario: High-speed inspection of printed circuit boards using line-scan cameras and real-time defect classification. IC Role / Device Role / Timing Role: Configurable I/O interfaces synchronize camera triggers and lighting strobes; BRAM buffers frame data for CNN inference acceleration. Use Value: 400 user I/Os and 28.5 Mb block RAM support simultaneous multi-camera input and on-device neural network weight storage. |
| Avionics Data Concentrators | 5G Radio Unit (RU) Baseband |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers with deterministic packet scheduling. IC Role / Device Role / Timing Role: Soft-core processor subsystem manages protocol stacks while hard PCIe endpoint connects to central avionics computer. Use Value: -1 speed grade ensures timing closure at 100°C cabinet temperature; FFG676 package meets DO-160 vibration and thermal shock requirements. | Use Scenario: Massive MIMO baseband processing in outdoor 5G radio units requiring CPRI/eCPRI fronthaul and OFDM modulation. IC Role / Device Role / Timing Role: Transceivers handle 13.1 Gbps CPRI links; DSP slices implement real-time FFT/iFFT and channel estimation algorithms. Use Value: 2,080 DSP slices deliver >2.1 TMAC/s peak compute for 64-antenna beamforming with sub-microsecond latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-performance signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FBVA676I | Kintex UltraScale with 443K logic cells, higher transceiver count (20 vs. 16), 15 Gbps line rate, but larger die and higher static power | Better suited for next-gen 5G massive MIMO with >100 antenna elements and higher throughput demands | Select XC7K410T-1FFG676I when cost, power, and thermal envelope constrain deployment in space-constrained industrial enclosures |
| XC7K325T-1FFG676I | Same Kintex-7 family, smaller logic capacity (326K cells), reduced DSP slices (1,920), identical FFG676 package and I/O count | Appropriate for mid-tier machine vision and test equipment where full 405K resource utilization is not required | Choose XC7K410T-1FFG676I when additional logic and DSP headroom is needed for future firmware upgrades or multi-function integration |
Compared with XC7K325T-1FFG676I and XCKU040-1FBVA676I, the XC7K410T-1FFG676I delivers optimal balance of logic density, DSP throughput, and thermal efficiency in the FFG676 footprint-enabling upgrade paths without board redesign or cooling system changes.
Availability
XC7K410T-1FFG676I is available at Aetrix Electronics and suitable for medical imaging systems, industrial machine vision platforms, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-1FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex-7 FPGA family targets cost-optimized, high-throughput applications in industrial automation, aerospace, and communications infrastructure where performance-per-watt and I/O flexibility are critical.
FAQ
What is the maximum transceiver line rate supported by XC7K410T-1FFG676I?
The XC7K410T-1FFG676I supports a maximum transceiver line rate of 13.1 Gbps. This capability enables compliance with CPRI, JESD204B, and 10GBASE-R protocols. The transceivers are hardened and include built-in clock data recovery (CDR), equalization, and eye monitoring features. All 16 transceivers in the XC7K410T-1FFG676I operate within this specification under industrial temperature conditions.
Does XC7K410T-1FFG676I support partial reconfiguration?
Yes, the XC7K410T-1FFG676I fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules-such as protocol engines or filter banks-without resetting the entire device. The feature relies on the device's hierarchical design flow and bitstream encryption support. Partial reconfiguration is validated for use in radar waveform adaptation and multi-standard wireless baseband applications using the XC7K410T-1FFG676I.
What I/O standards are supported by XC7K410T-1FFG676I?
The XC7K410T-1FFG676I supports over 24 I/O standards via its SelectIO™ technology, including LVDS, SSTL-18/15, HSTL-I/II, MIPI D-PHY, and sub-1.2V low-swing standards. Each of the 16 I/O banks can be independently powered between 1.2 V and 1.8 V. I/O calibration (DCI) is supported for impedance matching and signal integrity optimization. These capabilities are documented in the XC7K410T-1FFG676I device user guide UG474.
Is XC7K410T-1FFG676I qualified for industrial temperature operation?
Yes, the XC7K410T-1FFG676I is rated for industrial temperature operation from -40°C to +100°C ambient. This qualification is defined by the "I" suffix in the part number and verified per JEDEC JESD22-A104 and JESD22-A108 standards. Thermal derating curves and power supply stability margins are specified in the XC7K410T-1FFG676I data sheet DS182, ensuring reliable operation in harsh environments such as factory floors and rail transport systems.
What configuration modes does XC7K410T-1FFG676I support?
The XC7K410T-1FFG676I supports multiple configuration modes including Master SPI, Slave SelectMAP, JTAG, and BPI parallel. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from serial NOR flash, parallel NAND flash, or external processors. The INIT_B and DONE pins provide status feedback during configuration, and fallback mechanisms are implemented to recover from CRC errors. These modes are fully supported in the XC7K410T-1FFG676I configuration user guide UG470.
XC7K410T-1FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-1FFG676I FAQ
1.How can I place an order for XC7K410T-1FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-1FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-1FFG676I reliable?
The price and inventory of XC7K410T-1FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-1FFG676I is usually 5 days.
3.What payment methods are accepted for XC7K410T-1FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-1FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-1FFG676I?
XC7K410T-1FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-1FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-1FFG676I?
For technical support, including XC7K410T-1FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-1FFG676I requirements.
6.How does Aetrix verify that XC7K410T-1FFG676I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-1FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-1FFG676I meets industry standards.
7.What is the process for return or replacement of XC7K410T-1FFG676I?
All XC7K410T-1FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-1FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-1FFG676I part is unused and in its original packaging.
Return procedure for XC7K410T-1FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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