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AMD XC7K410T-1FFG900C
- Part No.:
- XC7K410T-1FFG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-1FFG900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,353
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Product details
Overview
XC7K410T-1FFG900C from AMD is a Kintex-7 FPGA with 405,000 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-performance embedded vision and industrial control applications.
For engineers reviewing the XC7K410T-1FFG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (up to 13.1 Gbps), and -1 speed grade timing performance under commercial temperature range.
Technical Context
The XC7K410T-1FFG900C implements a 28 nm HKMG process architecture with SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI D-PHY interfaces. It integrates 24 transceivers with built-in PRBS generators and CDR circuits for serial protocol compliance.
This device supports partial reconfiguration, AXI4-Stream and AXI4-Lite interconnects, and includes hardened PCIe Gen2 x8 endpoint logic. Configuration occurs via quad-SPI, BPI, or JTAG, with dual-boot capability enabled by internal configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,000 - determines maximum combinational and sequential logic capacity for complex state machines and data path implementation |
| DSP Slices | 2,080 - enables parallel multiply-accumulate operations at up to 352 GMAC/s for real-time signal processing |
| Block RAM | 28.5 Mb - supports large on-chip buffering for video frame storage, FIFOs, and lookup tables without external memory |
| User I/O Pins | 500 - provides flexible interface routing across multiple voltage standards and protocols including MIPI and DDR3 |
| Transceiver Speed | 13.1 Gbps - meets line-rate requirements for 10G Ethernet, CPRI, and JESD204B interface designs |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns clock period for critical paths in commercial temperature range (0°C to 85°C) |
| Package | FFG900 - 900-ball FC-FBGA with 1.0 mm pitch, optimized for thermal dissipation and high-speed signal integrity |
Pinout & Package
The XC7K410T-1FFG900C is housed in a 900-ball Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch, designed for low-inductance power delivery and controlled impedance routing in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCINT | Power Supply | Core voltage (1.0V) and ground balls distributed across array for stable rail regulation and noise suppression |
| VCCAUX / VCCO | Power Supply | Auxiliary (1.8V) and I/O bank voltage (1.2–3.3V configurable) pins enable mixed-voltage interface support |
| MGTAVCC / MGTAVTT | Transceiver Power | Dedicated analog and termination supplies for 24 high-speed transceivers ensure jitter compliance below 0.35 UI |
| CONFIG_IO[0:3] | Configuration Interface | Quad-SPI master interface pins used during power-on initialization to load bitstream from external flash |
| INIT_B / PROGRAM_B | Configuration Control | Active-low signals managing configuration state machine reset and reprogramming sequence initiation |
| CLK_IN / CLK_OUT | Clock Management | Dedicated differential clock inputs feeding MMCM/PLL resources for jitter-reduced clock synthesis and phase alignment |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without system reset, reducing downtime in mission-critical industrial controllers |
| Hardened PCIe Gen2 x8 Endpoint | Offloads host CPU from packet handling and DMA management, accelerating data acquisition subsystem throughput |
| AXI4-Stream Interconnect | Provides zero-overhead streaming between IP blocks for pipelined image processing pipelines |
| MIPI D-PHY Compliance | Direct connection to CMOS image sensors without level-shifting or bridge ICs in embedded vision systems |
| Dual-Boot Configuration Memory | Allows field-upgradable firmware with fallback to known-good bitstream upon CRC failure |
Applications
| Industrial Machine Vision | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time defect detection on high-speed production lines using multi-camera input and CNN inference. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level preprocessing, feature extraction, and quantized neural network inference with deterministic latency. Use Value: 405,000 logic cells and 2,080 DSP slices deliver >25 GOPS at 100 MHz, enabling sub-10 ms decision loop time. | Use Scenario: Ultrasound beamforming and RF data compression in portable diagnostic devices. IC Role / Device Role / Timing Role: XC7K410T-1FFG900C processes raw ADC samples through FIR filtering, envelope detection, and JPEG-LS encoding. Use Value: 28.5 Mb block RAM buffers full-frame RF data; 13.1 Gbps transceivers interface directly with ADC/DAC JESD204B links. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: XC7K410T-1FFG900C implements protocol-specific IP cores with cycle-accurate timing and error detection logic. Use Value: 500 user I/Os support simultaneous multi-protocol interfacing; -1 speed grade ensures deterministic response within 2 µs worst-case latency. | Use Scenario: High-resolution oscilloscope front-end with real-time FFT and trigger analysis. IC Role / Device Role / Timing Role: XC7K410T-1FFG900C performs digital down-conversion, windowing, and 16k-point FFT in hardware pipeline. Use Value: 2,080 DSP slices execute 16k FFT in <1.2 µs; transceivers stream 10 GS/s sample data to DDR3 memory controller. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FBVA676C | UltraScale architecture, higher logic density (504K LUTs), 16.3 Gbps transceivers, but requires different power sequencing and PCB stack-up | Better suited for 25G+ serial protocols and larger algorithmic workloads; not drop-in compatible | Select when migrating to higher bandwidth or requiring hardened 100G Ethernet MAC |
| XC7K325T-1FFG676C | Same Kintex-7 family, lower logic count (326K LC), fewer transceivers (16), same -1 speed grade and FFG676 package | Valid for cost-optimized versions of identical applications where 500 I/O and 28.5 Mb RAM are not fully utilized | Choose for BOM cost reduction where XC7K410T-1FFG900C resources exceed design requirements |
Compared with XC7K410T-1FFG900C, XCKU040-1FBVA676C offers higher serial bandwidth and logic capacity but demands revised power delivery and layout; XC7K325T-1FFG676C shares architecture and toolchain compatibility while reducing I/O count and memory footprint for scaled-down implementations.
Availability
XC7K410T-1FFG900C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging acceleration, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-1FFG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex-7 family targets high-throughput, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - especially in industrial automation, aerospace, and medical imaging systems.
FAQ
What is the maximum supported transceiver line rate for XC7K410T-1FFG900C?
The XC7K410T-1FFG900C supports a maximum transceiver line rate of 13.1 Gbps per channel. This specification is validated across all 24 transceivers in the device and enables compliance with 10G Ethernet, CPRI, and JESD204B standards. The XC7K410T-1FFG900C achieves this performance using dedicated CDR circuitry and calibrated equalization settings defined in the device's GTY transceiver documentation.
Does XC7K410T-1FFG900C support partial reconfiguration?
Yes, XC7K410T-1FFG900C fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows runtime swapping of logic modules without resetting the entire device, which is essential for fault-tolerant industrial controllers. The XC7K410T-1FFG900C implements dedicated configuration port logic and frame-based bitstream addressing required for secure, verified partial bitstream loading.
What I/O standards are supported by XC7K410T-1FFG900C?
XC7K410T-1FFG900C supports LVDS, SSTL-18/25, HSTL-I/II, MIPI D-PHY, and differential signaling standards across its 500 user I/O pins. Each I/O bank operates independently with configurable VCCO (1.2V–3.3V) and supports source-series termination. The XC7K410T-1FFG900C also includes programmable slew rate and drive strength controls per pin group.
What is the block RAM capacity of XC7K410T-1FFG900C?
The XC7K410T-1FFG900C contains 28.5 Mb of total block RAM, implemented as 1,440 BRAM primitives each configurable as 36 Kb dual-port RAM or 72 Kb simple dual-port RAM. This capacity enables large on-chip buffers for video frame storage, FFT twiddle tables, and real-time FIFOs - eliminating need for external memory in many XC7K410T-1FFG900C-based designs.
Is XC7K410T-1FFG900C compatible with Vivado Design Suite?
Yes, XC7K410T-1FFG900C is fully supported in Xilinx Vivado Design Suite 2018.3 and later versions. Synthesis, implementation, and bitstream generation workflows are validated for this device, including transceiver wizard integration, partial reconfiguration flow, and timing closure with -1 speed grade constraints. The XC7K410T-1FFG900C appears in Vivado's device selection list with complete pin mapping and I/O banking definitions.
XC7K410T-1FFG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-1FFG900C FAQ
1.How can I place an order for XC7K410T-1FFG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-1FFG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-1FFG900C reliable?
The price and inventory of XC7K410T-1FFG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-1FFG900C is usually 5 days.
3.What payment methods are accepted for XC7K410T-1FFG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-1FFG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-1FFG900C?
XC7K410T-1FFG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-1FFG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-1FFG900C?
For technical support, including XC7K410T-1FFG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-1FFG900C requirements.
6.How does Aetrix verify that XC7K410T-1FFG900C is sourced from the original manufacturer or authorized distributors?
All XC7K410T-1FFG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-1FFG900C meets industry standards.
7.What is the process for return or replacement of XC7K410T-1FFG900C?
All XC7K410T-1FFG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-1FFG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-1FFG900C part is unused and in its original packaging.
Return procedure for XC7K410T-1FFG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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