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AMD XC7K410T-1FFV900I
- Part No.:
- XC7K410T-1FFV900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-1FFV900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,783
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Product details
Overview
XC7K410T-1FFV900I from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, packaged in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) with 0.8 mm pitch. It targets high-throughput data processing in radar signal conditioning and PCIe Gen2 endpoint interfaces.
For engineers reviewing the XC7K410T-1FFV900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gbps, and -40°C to +100°C industrial temperature grade operation.
Technical Context
The XC7K410T-1FFV900I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic acceleration, and integrated 7-series transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It includes dual 32-bit AXI interconnects and supports partial reconfiguration.
Configuration is performed via JTAG or master/slave SPI/BPI modes using external flash. The device supports SelectIO standards including LVCMOS, LVDS, TMDS, and HSTL across 34 user-configurable I/O banks, each with independent VCCO and VREF settings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - total available LUT/FF pairs for combinational and sequential logic implementation |
| DSP Slices | 2,040 - fixed-point multiply-accumulate units with 25×18-bit pre-adders and 48-bit accumulators |
| Block RAM | 28.5 Mb - distributed as 1,728 × 36 Kb BRAM primitives usable as memory or FIFO buffers |
| Transceiver Speed | 6.6 Gbps - maximum line rate per GT lane, supporting PCIe Gen2 x8 or SATA III x4 configurations |
| I/O Banks | 34 - independently powered banks enabling mixed-voltage interface design without level shifters |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments with full timing closure at max junction temp |
Pinout & Package
XC7K410T-1FFV900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFV) package with 0.8 mm ball pitch and 31 × 31 array footprint. Thermal characteristics include 0.28°C/W junction-to-case thermal resistance and 1.2°C/W junction-to-board under JEDEC JESD51-7 conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M17 | MRCC_L15P | Multi-Region Clock Capable input pair - supports differential clock injection into MRCC region with <15 ps skew |
| P18 | IO_L15N_T2_MRCC_34 | Multi-Region Clock Capable input pair - complements M17 for low-jitter clock distribution across multiple CLB columns |
| A12 | IO_L1P_T0_33 | User I/O bank 33 - supports LVCMOS12/15/18/25/33 and SSTL15 on same bank with shared VCCO |
| E14 | GTXE2_CHANNEL_113 | GT transceiver channel - provides full-duplex serial link with programmable equalization and 8B/10B encoding |
| R1 | VCCINT | Core power supply - requires regulated 1.0 V ±3% with ≤10 mV p-p ripple for stable configuration and operation |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during runtime without system reset - critical for adaptive radar waveform updates |
| Dual 32-bit AXI Interconnect | Provides non-blocking, low-latency data paths between processor subsystems and custom IP accelerators |
| Integrated Configuration Memory | On-chip SEU detection and correction for configuration memory - reduces need for external scrubbing controllers |
| 7-Series Transceivers | Each GT lane supports protocol-specific presets (PCIe/SATA/SRIO) with auto-negotiation and built-in PRBS generators |
| SelectIO Technology | Per-bank I/O standard flexibility allows simultaneous LVDS, HSTL, and TMDS signaling without external translators |
Applications
| Radar Signal Processing | PCIe Gen2 Endpoint |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based surveillance radar systems with adaptive beamforming. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms while GT transceivers stream digitized IF data to host CPU. Use Value: 2,040 DSP slices enable concurrent 1024-point FFTs at 100 MHz clock; 6.6 Gbps GT lanes sustain 5.0 GB/s PCIe Gen2 x8 throughput. | Use Scenario: High-bandwidth data acquisition card interfacing with x86 host via PCIe Gen2 slot for test instrumentation. IC Role / Device Role / Timing Role: Acts as PCIe endpoint controller and DMA engine, managing scatter-gather transfers between host memory and local DDR3 buffers. Use Value: Dual AXI interconnect enables concurrent PCIe read/write operations and internal memory access with <200 ns latency. |
| Medical Imaging Backend | Industrial Video Analytics |
Use Scenario: CT scanner image reconstruction pipeline requiring deterministic latency and high computational density. IC Role / Device Role / Timing Role: Configurable logic implements back-projection kernels and real-time histogram equalization prior to GPU offload. Use Value: 28.5 Mb block RAM stores full sinogram datasets; 405,550 logic cells support parallel 64-channel reconstruction pipelines. | Use Scenario: Smart camera system performing real-time object classification and motion tracking in factory automation. IC Role / Device Role / Timing Role: Accelerates CNN inference layers and handles MIPI CSI-2 video ingestion with pixel-level timestamping. Use Value: SelectIO supports direct MIPI D-PHY v1.2 interface; DSP slices execute quantized convolution ops at 25 GOPS sustained. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FBVA676I | UltraScale architecture, 504,000 logic cells, 2,280 DSP slices, 32.1 Mb BRAM, 16.3 Gbps GT speed | Higher bandwidth and lower latency required for PCIe Gen3 x16 or 10G Ethernet MAC offload | Choose XCKU040-1FBVA676I when migrating to higher-speed serial protocols or needing >100 Gb/s aggregate I/O bandwidth |
| XC7K325T-1FFG900I | Same Kintex-7 family, 326,080 logic cells, 1,620 DSP slices, 22.5 Mb BRAM, identical FFV900 package | Lower gate count and reduced DSP resources suitable for cost-sensitive radar front-end control or sensor fusion nodes | Choose XC7K325T-1FFG900I when design fits within 80% of XC7K410T resource utilization and requires identical PCB footprint |
Compared with XC7K410T-1FFV900I, XCKU040-1FBVA676I delivers 24% more logic and 12% more DSP but requires new PCB layout and power delivery redesign; XC7K325T-1FFG900I shares pin compatibility and thermal profile but reduces peak compute throughput by 20%.
Availability
XC7K410T-1FFV900I is available at Aetrix Electronics and suitable for radar signal conditioning, PCIe Gen2 endpoint designs, and medical imaging backend processing requiring stable component supply over extended product lifecycles.
Supply support for XC7K410T-1FFV900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex-7 FPGA family targets mid-range performance-per-watt applications including wired communications, video processing, and defense electronics where balanced logic, DSP, and I/O resources are essential.
FAQ
What is the maximum supported transceiver line rate for XC7K410T-1FFV900I?
The XC7K410T-1FFV900I supports a maximum transceiver line rate of 6.6 Gbps per GT lane. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gbps), and SRIO Gen2 (6.25 Gbps) standards. All 24 GT transceivers on the XC7K410T-1FFV900I are rated for this speed under industrial temperature conditions with appropriate reference clock jitter specifications met.
Does XC7K410T-1FFV900I support partial reconfiguration?
Yes, XC7K410T-1FFV900I fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic replacement of logic modules during operation without resetting the entire device. The XC7K410T-1FFV900I's configuration logic includes frame-based addressing and CRC protection for reconfigurable partitions, making it suitable for adaptive radar waveform updates and protocol switching in field-deployed systems.
What I/O standards are supported by XC7K410T-1FFV900I?
XC7K410T-1FFV900I supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, Differential SSTL, HSTL, and TMDS across its 34 I/O banks. Each bank operates with independent VCCO and VREF settings, enabling mixed-standard interfaces on a single device. The XC7K410T-1FFV900I does not support current-mode logic (CML) or PECL natively without external termination networks.
What is the operating temperature range for XC7K410T-1FFV900I?
The XC7K410T-1FFV900I is rated for industrial temperature operation from -40°C to +100°C ambient. This rating applies to the full speed grade (-1) and guarantees timing closure, configuration integrity, and transceiver performance across the range. The XC7K410T-1FFV900I uses junction temperature monitoring diodes and thermal shutdown circuitry to protect against overheating in sealed enclosures.
How many block RAM primitives are available in XC7K410T-1FFV900I?
The XC7K410T-1FFV900I contains 1,728 block RAM primitives, each configurable as 36 Kb dual-port RAM, 18 Kb single-port RAM, or 36 Kb ROM. This totals 28.5 Mb of on-chip memory, usable for FIFOs, lookup tables, or frame buffers. The XC7K410T-1FFV900I allocates these BRAMs across eight columns, with up to 216 per column, enabling localized memory access for high-throughput streaming applications.
XC7K410T-1FFV900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-1FFV900I FAQ
1.How can I place an order for XC7K410T-1FFV900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-1FFV900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-1FFV900I reliable?
The price and inventory of XC7K410T-1FFV900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-1FFV900I is usually 5 days.
3.What payment methods are accepted for XC7K410T-1FFV900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-1FFV900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-1FFV900I?
XC7K410T-1FFV900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-1FFV900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-1FFV900I?
For technical support, including XC7K410T-1FFV900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-1FFV900I requirements.
6.How does Aetrix verify that XC7K410T-1FFV900I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-1FFV900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-1FFV900I meets industry standards.
7.What is the process for return or replacement of XC7K410T-1FFV900I?
All XC7K410T-1FFV900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-1FFV900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-1FFV900I part is unused and in its original packaging.
Return procedure for XC7K410T-1FFV900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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