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AMD XC7K410T-2FB900I
- Part No.:
- XC7K410T-2FB900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FB900I.pdf
- Description:
- IC FPGA 350 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,601
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Product details
Overview
XC7K410T-2FB900I from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, configured in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package with -2 speed grade and industrial temperature range (-40°C to +100°C). It targets high-throughput data processing in radar signal conditioning and PCIe Gen2 endpoint systems.
For engineers reviewing the XC7K410T-2FB900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver line rate (6.6 Gb/s), configuration interface (SPIx4/JTAG), and thermal design power (19.2 W typical).
Technical Context
The XC7K410T-2FB900I implements a 28 nm HKMG process-based architecture with SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS signaling up to 1.33 Gb/s per pin. It integrates 24 multi-gigabit GT transceivers with built-in 8B/10B encoding and PRBS generation for serial link validation.
Configuration is performed via Master SPI or JTAG, with support for dual-boot fallback using external flash. Bitstream encryption and HMAC authentication are enabled through integrated AES-256 and SHA-256 engines for secure configuration loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 – determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 2,040 – enables parallel multiply-accumulate operations for FIR filtering and FFT acceleration |
| Block RAM | 28.5 Mb – supports large on-chip data buffering and FIFO depth without external memory |
| User I/O Pins | 500 – provides scalable interface connectivity across multiple voltage standards and protocols |
| GT Transceivers | 24 × 6.6 Gb/s – delivers native PCIe Gen2 x8 or SATA III link capability with embedded clocking |
| Thermal Design Power | 19.2 W (typical) – defines heatsink sizing and airflow requirements for sustained operation |
| Speed Grade | -2 – guarantees timing closure at specified maximum frequencies for critical paths |
Pinout & Package
XC7K410T-2FB900I is housed in a 900-pin Flip-Chip BGA (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and industrial-grade thermal performance (θJA = 5.5°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/JTAG/BPI) and configuration mode during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; externally generated during master SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| INIT_B | Configuration Control | Active-low signal asserting configuration reset or indicating CRC error |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter input for GT PLLs; supports differential AC-coupled sources |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate supplies for core (1.0V), auxiliary (1.8V), and I/O banks (1.2–3.3V) |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset, reducing system downtime |
| AES-256 Bitstream Encryption | Prevents IP theft by encrypting configuration data stored in external flash memory |
| Integrated System Monitor | Measures on-die temperature and supply voltages with ±5°C accuracy for thermal management |
| PCIe Gen2 Endpoint Hard IP | Reduces RTL integration effort and verification time for compliant root port or endpoint designs |
| UltraScale-Compatible Toolflow | Allows migration path to newer Xilinx/AMD families using same Vivado design environment |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT pipelines; GT transceivers interface with ADC/DAC FMC modules. Use Value: 2,040 DSP slices enable simultaneous 128-channel FFTs at 100 MS/s sample rate with deterministic latency. | Use Scenario: High-speed image reconstruction in CT and MRI scanner backends. IC Role / Device Role / Timing Role: Acts as data concentrator and preprocessing engine between multi-sensor detector arrays and host CPU. Use Value: 500 user I/Os support concurrent LVDS links from 16+ ADC channels while maintaining sub-20 ns inter-channel skew. |
| Industrial PCIe Data Acquisition | Avionics Sensor Fusion Hub |
Use Scenario: Modular DAQ systems requiring deterministic PCIe Gen2 x4 host interface and real-time trigger routing. IC Role / Device Role / Timing Role: Configurable logic handles timestamping, decimation, and DMA arbitration; hard PCIe block manages TLP generation. Use Value: -2 speed grade ensures <5 ns clock-to-out timing margin for 250 MHz sampling clocks synchronized to PCIe reference. | Use Scenario: Integration of inertial measurement unit (IMU), GNSS, and air data inputs in flight control computers. IC Role / Device Role / Timing Role: Time-stamped sensor fusion engine with deterministic interrupt response under DO-254 Level A constraints. Use Value: Built-in System Monitor and ECC on block RAM meet ASIL-D functional safety monitoring requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Higher logic density (504K LUTs), 100G Ethernet MAC hard IP, 20 nm process, higher static power | Better suited for 100G optical transport or AI inference acceleration where bandwidth > 25 Gb/s required | Choose XCKU040 if migrating to UltraScale+ architecture or needing integrated 100G MAC |
| XC7K325T-2FFG900I | Fewer logic cells (326K), same package footprint, identical GT transceiver count and speed grade | Cost-optimized alternative for mid-bandwidth applications with reduced DSP and RAM needs | Choose XC7K325T when system requirements fit within 80% of XC7K410T resources and BOM cost is critical |
Compared with XC7K410T-2FB900I, XCKU040-2FFVA1156I offers higher throughput but requires PCB redesign and new thermal management, while XC7K325T-2FFG900I shares pin compatibility and toolchain but trades off 20% logic capacity for lower cost and power.
Availability
XC7K410T-2FB900I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial PCIe data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7K410T-2FB900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - especially in aerospace, test & measurement, and medical imaging.
FAQ
What is the maximum supported transceiver line rate for XC7K410T-2FB900I?
The XC7K410T-2FB900I supports a maximum transceiver line rate of 6.6 Gb/s per GT channel. This enables native compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gb/s), and DisplayPort 1.2 (5.4 Gb/s) protocols. The XC7K410T-2FB900I achieves this using dedicated CDR circuitry and programmable equalization settings per transceiver lane.
Does XC7K410T-2FB900I support partial reconfiguration?
Yes, XC7K410T-2FB900I fully supports partial reconfiguration through Vivado Design Suite. This allows runtime swapping of logical modules without resetting the entire device. The XC7K410T-2FB900I implements frame-based reconfiguration with dedicated configuration access ports and CRC protection for each reconfigurable partition.
What configuration modes are supported by XC7K410T-2FB900I?
XC7K410T-2FB900I supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7K410T-2FB900I also supports dual-boot fallback using two separate bitstreams stored in external flash memory.
Is XC7K410T-2FB900I qualified for industrial temperature operation?
Yes, XC7K410T-2FB900I is rated for industrial temperature range (-40°C to +100°C case temperature). Its FCBGA package and silicon process are characterized across this range, and all timing specifications in the datasheet apply under these conditions. The XC7K410T-2FB900I includes on-die thermal sensors for real-time monitoring.
What security features does XC7K410T-2FB900I provide for bitstream protection?
XC7K410T-2FB900I integrates AES-256 encryption and HMAC-SHA-256 authentication for bitstream confidentiality and integrity. Encrypted bitstreams can be stored in external flash and decrypted on-the-fly during configuration. The XC7K410T-2FB900I uses battery-backed RAM to store decryption keys securely and supports key revocation via eFUSE programming.
XC7K410T-2FB900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-2FB900I FAQ
1.How can I place an order for XC7K410T-2FB900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FB900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FB900I reliable?
The price and inventory of XC7K410T-2FB900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FB900I is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FB900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FB900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FB900I?
XC7K410T-2FB900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FB900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FB900I?
For technical support, including XC7K410T-2FB900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FB900I requirements.
6.How does Aetrix verify that XC7K410T-2FB900I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FB900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FB900I meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FB900I?
All XC7K410T-2FB900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FB900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FB900I part is unused and in its original packaging.
Return procedure for XC7K410T-2FB900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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