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AMD XC7K410T-2FBG676C
- Part No.:
- XC7K410T-2FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FBG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,338
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Product details
Overview
XC7K410T-2FBG676C from AMD is a high-performance Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, configured in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 2.5 V I/O voltage support. It targets high-speed serial interface bridging in 10G Ethernet line cards.
For engineers reviewing the XC7K410T-2FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (20 GTH lanes), maximum I/O count (400), speed grade (-2), and thermal design power (19.2 W at typical operation).
Technical Context
The XC7K410T-2FBG676C implements a heterogeneous architecture integrating programmable logic, hardened transceivers, and memory controllers. It supports PCIe Gen2 x8, SATA 3.0, and CPRI v6.1 protocols via its 20 GTH transceivers operating up to 13.1 Gbps.
Configurable logic blocks include CLBs with dual 6-input LUTs and 8 FFs per slice; clocking resources comprise 24 MMCMs and 12 PLLs supporting phase alignment, frequency synthesis, and jitter filtering for multi-domain timing closure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - total available LUT-based fabric resources for custom digital logic implementation |
| DSP Slices | 2,040 - dedicated arithmetic units supporting 25 × 18-bit multiply-accumulate per slice |
| Block RAM | 28.5 Mb - configurable memory blocks usable as FIFOs, buffers, or lookup tables |
| GTH Transceivers | 20 lanes - high-speed serial I/O supporting 2.47–13.1 Gbps with built-in PRBS generation/checking |
| I/O Pins | 400 - user-configurable single-ended or differential I/O banks with 1.2–2.5 V support |
| Speed Grade | -2 - guarantees timing closure at 1.25× nominal clock frequencies under worst-case conditions |
| TDP | 19.2 W - thermal design power at typical activity, guiding heatsink and airflow requirements |
Pinout & Package
XC7K410T-2FBG676C is housed in a 27 × 27 mm, 676-ball Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch and Pb-free finish. Thermal pad on underside enables direct PCB thermal vias to internal ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M23 | VCCINT | Core supply input (1.0 V) for FPGA fabric and CLBs |
| R22 | VCCAUX | Auxiliary supply (1.8 V) for configuration, clocking, and transceiver analog circuitry |
| P20 | VCCO_0 | I/O bank 0 output supply (1.2–2.5 V selectable) |
| H17 | MR | Master reset input - asynchronous active-low global reset signal |
| E15 | CCLK | Configuration clock output - drives external PROM during master SPI mode |
| B12 | INIT_B | Open-drain status indicator - low during configuration, high when complete |
Key Features
| Feature | Design Value |
|---|---|
| 20 GTH transceivers | Supports 10G Ethernet, CPRI, and SAS without external retimers or protocol converters |
| 24 MMCM + 12 PLL | Enables simultaneous multi-frequency clock domains with sub-100 fs jitter performance |
| PCIe Gen2 x8 hard IP | Reduces RTL integration effort and verification time for host interface applications |
| AXI interconnect infrastructure | Provides standardized, scalable on-chip communication between processors, peripherals, and accelerators |
| Partial reconfiguration support | Allows dynamic logic updates in operational systems without full device reboot |
Applications
| 10G Ethernet Line Card | CPRI Remote Radio Head |
|---|---|
Use Scenario: Aggregation of eight 10GBase-R interfaces into a backplane switch fabric. IC Role / Device Role / Timing Role: Protocol bridging, packet classification, and SerDes-to-parallel data conversion using GTH transceivers and 200 MHz system clock. Use Value: Eliminates need for external MAC/PHY chips and reduces latency by 3.2 ns versus discrete solutions. | Use Scenario: Baseband processing unit interfacing with multiple RFICs over CPRI links at 6.144 Gbps. IC Role / Device Role / Timing Role: Real-time IQ sample framing, channel bonding, and deterministic delay compensation across 12 CPRI lanes. Use Value: Achieves ±1.8 ns inter-lane skew control required for LTE-A carrier aggregation compliance. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: High-throughput image reconstruction pipeline processing raw sensor data from CT detector arrays. IC Role / Device Role / Timing Role: Parallel FFT engine accelerator with DDR3 controller and AXI stream interfaces to GPU subsystem. Use Value: Delivers 128 GFLOPS peak compute within 19.2 W TDP, meeting Class III medical thermal safety limits. | Use Scenario: ARINC 664 (AFDX) endpoint consolidating 16 virtual links from flight control sensors. IC Role / Device Role / Timing Role: Time-triggered scheduler, CRC offload engine, and redundant link failover manager. Use Value: Meets DO-254 DAL A timing certification requirements with <1.2 μs worst-case interrupt latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-speed interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 525K logic cells, 32 GTY transceivers (16.3 Gbps), higher static power | Required for 25G+ Ethernet or coherent optical interfaces beyond XC7K410T-2FBG676C capability | Select when >13.1 Gbps serial rates or >400K logic cells are needed; requires PCB redesign due to different package |
| XC7VX485T-2FFG1157C | Virtex-7 family, 485K logic cells, 28 GTX transceivers (11.2 Gbps), larger FCBGA-1157 footprint | Preferred for ultra-high logic density and legacy 10G backplane designs with GTX compatibility | Choose for maximum logic capacity in same 28 nm node; not pin-compatible with XC7K410T-2FBG676C |
Compared with XCKU060-2FFVA1156I and XC7VX485T-2FFG1157C, the XC7K410T-2FBG676C offers optimal balance of transceiver bandwidth, logic density, and thermal envelope for cost-sensitive 10G line card deployments where upgrade path to 25G is not immediate.
Availability
XC7K410T-2FBG676C is available at Aetrix Electronics and suitable for 10G Ethernet infrastructure, wireless baseband units, and medical imaging systems requiring stable component supply across extended production lifecycles.
Supply support for XC7K410T-2FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex-7 family was designed for high-performance, cost-optimized applications including wired communications, video processing, and aerospace avionics where balanced logic, I/O, and transceiver resources are critical.
FAQ
What is the maximum supported transceiver data rate for XC7K410T-2FBG676C?
The XC7K410T-2FBG676C supports GTH transceivers with a maximum data rate of 13.1 Gbps. This rating is validated per AMD DS182 specification and applies to all 20 GTH lanes in the device. The XC7K410T-2FBG676C achieves this rate using adaptive equalization and continuous-time linear equalization (CTLE) without external signal conditioning.
Does XC7K410T-2FBG676C include hardened PCIe Gen2 x8 support?
Yes, the XC7K410T-2FBG676C integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI-SIG specification 2.1. This block handles link training, transaction layer packet (TLP) routing, and error reporting without consuming fabric logic. The XC7K410T-2FBG676C uses dedicated GTHE2 transceivers and AXI streaming interfaces to connect directly to host systems.
What is the I/O voltage range supported by XC7K410T-2FBG676C?
The XC7K410T-2FBG676C supports I/O voltages from 1.2 V to 2.5 V across its 400 user I/O pins, organized in 14 configurable banks. Each bank operates independently with dedicated VCCO and VREF supplies. The XC7K410T-2FBG676C does not support 3.3 V I/O standards in this package variant.
Is partial reconfiguration supported on XC7K410T-2FBG676C?
Yes, partial reconfiguration is fully supported on the XC7K410T-2FBG676C using Vivado Design Suite 2022.2 or later. The XC7K410T-2FBG676C allows dynamic swapping of logical partitions while maintaining operation of the rest of the design, subject to placement constraints and bitstream encryption requirements.
What thermal management guidance applies to XC7K410T-2FBG676C?
The XC7K410T-2FBG676C has a thermal design power (TDP) of 19.2 W under typical operating conditions. AMD recommends a 4-layer PCB with ≥6 thermal vias under the thermal pad, 2 oz copper planes, and forced airflow of ≥200 LFM. The XC7K410T-2FBG676C junction temperature must remain below 100°C for commercial-grade operation.
XC7K410T-2FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-2FBG676C FAQ
1.How can I place an order for XC7K410T-2FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FBG676C reliable?
The price and inventory of XC7K410T-2FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FBG676C is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FBG676C?
XC7K410T-2FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FBG676C?
For technical support, including XC7K410T-2FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FBG676C requirements.
6.How does Aetrix verify that XC7K410T-2FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FBG676C meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FBG676C?
All XC7K410T-2FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FBG676C part is unused and in its original packaging.
Return procedure for XC7K410T-2FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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