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AMD XC7K410T-2FBG676I
- Part No.:
- XC7K410T-2FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,352
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Product details
Overview
XC7K410T-2FBG676I from AMD is a high-performance Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, configured in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with -2 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable system-on-chip for high-bandwidth data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC7K410T-2FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver capability (16 GTP/GTX transceivers up to 6.6 Gb/s), configuration interface (SPIx4, JTAG, SelectMAP), and thermal design margin for industrial ambient operation.
Technical Context
The XC7K410T-2FBG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and dedicated clock management tiles (CMTs) containing PLLs and MMCMs. It supports multi-voltage I/O banks (1.2 V to 3.3 V) and includes integrated PCI Express® Gen2 x8 endpoint capability.
Configuration is performed via Master SPI, Slave SelectMAP, or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path integration with ARM-based processing systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational/sequential logic capacity for complex control and datapath implementation |
| DSP Slices | 2,040 - enables parallel multiply-accumulate operations for FIR filtering, FFT, and beamforming |
| Block RAM | 28.5 Mb - supports large on-chip buffering for video frame storage or packet queuing without external memory |
| User I/O Pins | 400 - provides scalable interface density for sensor arrays, ADC/DAC buses, and backplane connectivity |
| Transceivers | 16 GTX - delivers 10G Ethernet, CPRI, and JESD204B serial links with built-in PCS/PMA |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies under industrial temperature conditions |
| Temperature Range | -40°C to +100°C - validated for deployment in uncooled industrial enclosures and outdoor base stations |
Pinout & Package
XC7K410T-2FBG676I is housed in a 676-ball Flip-Chip BGA (FBG) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB routing and thermal dissipation in dense compute modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SPI mode; requires stable 50 MHz source |
| DIN | Configuration Data Input | Serial bitstream input for SPI configuration; tied high when unused |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, SPI, SelectMAP) at power-up; must be pulled to defined logic levels |
| GND / VCCINT / VCCAUX / VCCO | Power Terminals | Separate supply domains enable independent voltage scaling and noise isolation per I/O bank and core logic |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP reduces latency and FPGA resource usage for host interface bridging in embedded servers |
| AXI4 Interconnect Support | Enables seamless integration with Zynq-7000 or MicroBlaze subsystems using standardized memory-mapped protocol |
| Partial Reconfiguration | Allows dynamic logic module swapping without full device reboot-critical for mission-critical radar waveform updates |
| Bitstream Encryption | HMAC-SHA-256 authentication prevents unauthorized configuration loading and intellectual property theft |
| Multi-Voltage I/O Banks | Supports concurrent 1.8 V LVDS, 2.5 V HSTL, and 3.3 V LVTTL interfaces on same device-eliminates level-shifter components |
Applications
| Radar Signal Processing Unit | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based air surveillance radar with adaptive clutter cancellation. IC Role / Device Role / Timing Role: Configurable datapath accelerator handling FFT, CFAR, and beam steering with deterministic sub-microsecond latency. Use Value: 2,040 DSP slices enable simultaneous 128-channel FFTs; GTX transceivers route digitized IF data directly from ADC front-end at 5 Gb/s. | Use Scenario: Aggregation node in telecom central office supporting 16× 10G SFP+ ports with MAC-layer traffic shaping. IC Role / Device Role / Timing Role: Line-side PHY-to-MAC bridge with integrated PCIe Gen2 x8 upstream interface to host CPU. Use Value: Hard PCIe endpoint eliminates soft-core overhead; 400 I/Os support dual 10G MACs plus management interfaces (I²C, UART, GPIO). |
| Medical Imaging Subsystem | Industrial Machine Vision Controller |
Use Scenario: Ultrasound beamformer with 256-channel echo digitization and real-time image reconstruction. IC Role / Device Role / Timing Role: Time-aligned data concentrator and FPGA-accelerated image pipeline processor. Use Value: 28.5 Mb block RAM buffers full-frame RF data; LVDS I/O banks interface directly to 14-bit, 125 MSPS ADCs. | Use Scenario: High-speed inspection system capturing 100 MP/s image streams from four CMOS sensors for defect classification. IC Role / Device Role / Timing Role: Synchronized multi-sensor controller with pixel-level timestamping and ROI extraction engine. Use Value: -2 speed grade ensures deterministic timing across 400-MHz pixel clocks; GTX transceivers feed compressed frames to NVMe SSD via PCIe Gen2. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 568K logic cells, higher transceiver count (32 GTY), 15G+ serial rates | Better suited for 25G/100G optical transport and AI inference acceleration | Select when bandwidth >10 Gb/s per lane or >1 Mb BRAM required |
| XC7K325T-2FFG676I | Same Kintex-7 family, 326K logic cells, 1,440 DSP slices, identical package footprint and pinout | Lower cost option for mid-complexity radar or imaging where 405K cells are over-provisioned | Drop-in replacement with reduced resources; verified pin-compatible and functionally subset |
Compared with XC7K410T-2FBG676I, XCKU060-2FFVA1156I offers higher serial bandwidth and logic density but requires PCB redesign and new power delivery; XC7K325T-2FFG676I shares identical packaging and timing model, enabling direct substitution where resource headroom allows.
Availability
XC7K410T-2FBG676I is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical ultrasound subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, and I/O resources-optimized for wireless infrastructure, video processing, and industrial automation.
FAQ
What is the maximum supported transceiver data rate for XC7K410T-2FBG676I?
The XC7K410T-2FBG676I integrates GTX transceivers rated for operation up to 6.6 Gb/s. This rate is guaranteed across the full industrial temperature range (-40°C to +100°C) and supports protocols including 10GBASE-R, CPRI, and SATA. The XC7K410T-2FBG676I does not support higher-rate GTY or GTH transceivers found in UltraScale devices.
Does XC7K410T-2FBG676I support partial reconfiguration?
Yes, XC7K410T-2FBG676I fully supports partial reconfiguration through Vivado Design Suite. This capability allows runtime swapping of logic modules without resetting the entire device-enabling dynamic waveform adaptation in radar systems. The XC7K410T-2FBG676I requires specific floorplanning and checkpoint-based bitstream generation to implement this feature.
What configuration modes are supported by XC7K410T-2FBG676I?
XC7K410T-2FBG676I supports Master SPI, Slave SelectMAP, JTAG, and BMC (Boundary-Scan Mode Configuration). Mode selection is controlled by M0–M2 pins at power-up. The XC7K410T-2FBG676I also supports fallback configuration and multi-boot via external flash addressing, enabling field-upgradable firmware.
Is XC7K410T-2FBG676I pin-compatible with other Kintex-7 devices in the FBG676 package?
XC7K410T-2FBG676I shares the same 676-ball FBG package and pinout with XC7K325T-2FFG676I and XC7K160T-2FFG676I. Power, configuration, and I/O bank assignments are consistent across these variants. However, XC7K410T-2FBG676I enables additional transceivers and clock resources not present in lower-density variants.
What is the industrial temperature rating for XC7K410T-2FBG676I?
XC7K410T-2FBG676I is qualified for industrial temperature operation from -40°C to +100°C. This rating applies to junction temperature under specified voltage and airflow conditions. The XC7K410T-2FBG676I undergoes extended burn-in and characterization across this range to ensure timing closure and SRAM stability.
XC7K410T-2FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-2FBG676I FAQ
1.How can I place an order for XC7K410T-2FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FBG676I reliable?
The price and inventory of XC7K410T-2FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FBG676I is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FBG676I?
XC7K410T-2FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FBG676I?
For technical support, including XC7K410T-2FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FBG676I requirements.
6.How does Aetrix verify that XC7K410T-2FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FBG676I meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FBG676I?
All XC7K410T-2FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FBG676I part is unused and in its original packaging.
Return procedure for XC7K410T-2FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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