AMD XC7K410T-2FBG900C

Overview

XC7K410T-2FBG900C from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, fabricated on 28 nm process technology and operating at -2 speed grade. It integrates PCIe Gen2 x8 endpoint capability and supports DDR3 memory interfaces up to 1866 Mbps for high-throughput data processing in reconfigurable acceleration systems.

For engineers reviewing the XC7K410T-2FBG900C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver line rate (6.6 Gb/s), thermal design power (21.5 W typical), and package footprint compatibility with BGA-900.

Technical Context

The XC7K410T-2FBG900C implements a fully programmable logic fabric with configurable logic blocks (CLBs), distributed RAM, and shift registers. It includes 24 transceivers supporting protocols including PCIe Gen2, SATA, and SRIO, each capable of 6.6 Gb/s operation.

It features dual-register 6-input LUTs, carry chains for arithmetic, and integrated clock management with MMCM and PLL blocks supporting jitter filtering and frequency synthesis across multiple domains.

Key Specifications

Pinout & Package

XC7K410T-2FBG900C is housed in a 900-ball flip-chip ball grid array (FBGA) package with 1.0 mm ball pitch and thermal lid. The package supports thermal dissipation up to 21.5 W TDP and provides 500 user-configurable I/Os across 24 banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.

Compared with XCKU060-2FFVA1156I, XC7K410T-2FBG900C offers lower power and mature toolchain support at reduced transceiver bandwidth; versus XC7K325T-2FFG900C, it delivers 24% more logic and 8% more DSP slices within the same package footprint and thermal envelope.

Availability

XC7K410T-2FBG900C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply across extended production lifecycles.

Supply support for XC7K410T-2FBG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, adaptive SoCs, and FPGA solutions for data center, aerospace, defense, and industrial markets.

The Kintex-7 family targets mid-range reconfigurable systems demanding optimized price/performance ratio, low power, and high I/O bandwidth for signal processing and connectivity applications.

FAQ

What is the maximum supported DDR3 data rate for XC7K410T-2FBG900C?

The XC7K410T-2FBG900C supports DDR3 memory interfaces up to 1866 Mbps using its hardened memory controller. This rate is validated across all I/O banks configured for SSTL15 standards and requires board-level impedance control and write-leveling calibration. The XC7K410T-2FBG900C datasheet specifies timing parameters for 1600 and 1866 Mbps operation under -2 speed grade conditions.

Does XC7K410T-2FBG900C include built-in PCIe Gen2 support?

Yes, XC7K410T-2FBG900C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. It supports both endpoint and root complex configurations, includes AXI4 streaming interfaces, and requires no external PHY. The XC7K410T-2FBG900C implements link training, error reporting, and power management states natively.

What is the thermal design power (TDP) of XC7K410T-2FBG900C?

The typical thermal design power (TDP) of XC7K410T-2FBG900C is 21.5 W under worst-case operating conditions with full resource utilization. This value assumes VCCINT = 1.0 V, ambient temperature of 85°C, and standard PCB thermal vias. Actual power consumption varies with design utilization and I/O activity, and the XC7K410T-2FBG900C power estimator tool provides accurate modeling.

Can XC7K410T-2FBG900C be used for partial reconfiguration?

Yes, XC7K410T-2FBG900C supports partial reconfiguration through its ICAP and FRAME_ECC interfaces. This allows dynamic swapping of logical modules while the rest of the design remains operational. The XC7K410T-2FBG900C configuration logic enables bitstream loading into designated reconfigurable partitions without system reset or interrupting active data paths.

What package type does XC7K410T-2FBG900C use?

XC7K410T-2FBG900C uses a 900-ball flip-chip BGA (FBG900) package with 1.0 mm ball pitch and 31 × 31 mm body size. It features a thermal lid for enhanced heat dissipation and supports standard reflow profiles. The XC7K410T-2FBG900C pinout is documented in UG475 and includes 500 user I/Os distributed across 24 banks.