AMD XC7K410T-2FBG900I

Overview

XC7K410T-2FBG900I from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.2 Mb of block RAM, configured in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package with -2 speed grade and industrial temperature range (-40°C to +100°C). It targets high-throughput data processing in radar signal conditioning and PCIe Gen2 endpoint systems.

For engineers reviewing the XC7K410T-2FBG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver line rate (6.6 Gbps), configuration interface (SPIx4/JTAG), and thermal design power (19.2 W typical).

Technical Context

The XC7K410T-2FBG900I implements a 28 nm HKMG process-based architecture with SelectIO™ technology supporting LVDS, SSTL, HSTL, and TMDS I/O standards up to 1.33 Gbps. It integrates 24 multi-gigabit GT transceivers with built-in 8B/10B encoding and PRBS pattern generation for serial link validation.

Configuration is performed via Master SPI or JTAG, with support for dual-boot fallback and bitstream encryption using AES-256. The device includes dedicated clock management tiles with MMCM and PLL blocks capable of generating up to 12 output clocks per tile with sub-150 ps jitter.

Key Specifications

Pinout & Package

XC7K410T-2FBG900I is housed in a 900-pin Flip-Chip BGA (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7K410T-2FBG900I, XCKU040-2FFVA1156I offers higher serial bandwidth but demands new PCB design, while XC7K325T-2FBG900I shares pin compatibility and thermal profile but reduces DSP and RAM capacity by ~20%.

Availability

XC7K410T-2FBG900I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial PCIe endpoint applications requiring stable component supply across long-lifecycle programs.

Supply support for XC7K410T-2FBG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.

The Kintex-7 FPGA product line targets high-performance, cost-optimized applications in aerospace, defense, medical imaging, and industrial automation where balanced logic, DSP, and I/O resources are critical.

FAQ

What is the maximum supported transceiver line rate for XC7K410T-2FBG900I?

The XC7K410T-2FBG900I supports a maximum transceiver line rate of 6.6 Gbps per GT channel. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6 Gbps), and CPRI Option 3 (6.144 Gbps) protocols. All 24 GT transceivers on the XC7K410T-2FBG900I operate within this specification under industrial temperature conditions and -2 speed grade timing constraints.

Does XC7K410T-2FBG900I support partial reconfiguration?

Yes, XC7K410T-2FBG900I fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows runtime swapping of logic modules-such as filter banks or protocol engines-without resetting the entire FPGA fabric. Partial reconfiguration is implemented using frame-based bitstream updates and requires dedicated configuration controller logic within the XC7K410T-2FBG900I design.

What configuration modes are supported by XC7K410T-2FBG900I?

XC7K410T-2FBG900I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-on. Master SPI is most commonly used for single-flash boot; JTAG is reserved for debugging and programming during development. All modes are validated across the -40°C to +100°C operating range for XC7K410T-2FBG900I.

Is XC7K410T-2FBG900I compatible with the same PCB footprint as XC7K325T-2FBG900I?

Yes, XC7K410T-2FBG900I and XC7K325T-2FBG900I share identical 900-pin FCBGA mechanical dimensions, ball map, and thermal lid specifications. This allows direct PCB reuse between the two devices when upgrading logic capacity. However, XC7K410T-2FBG900I draws higher peak current and requires adjusted power delivery network design compared to XC7K325T-2FBG900I.

What is the block RAM capacity of XC7K410T-2FBG900I in megabits?

The XC7K410T-2FBG900I provides 28.2 Mb of total block RAM distributed across 1,472 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port memory or two independent 18 Kb memories. This capacity supports applications such as multi-frame video buffering, packet switching tables, and coefficient storage for adaptive filtering algorithms implemented on XC7K410T-2FBG900I.