AMD XC7K410T-2FF676I

Overview

XC7K410T-2FF676I from AMD (Xilinx) is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG676) package rated for -40°C to +100°C industrial temperature operation. It targets high-throughput data processing in radar signal conditioning and PCIe Gen3-based test instrumentation.

For engineers reviewing the XC7K410T-2FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver line rates up to 13.1 Gbps, and configuration via Master SPI or JTAG.

Technical Context

The XC7K410T-2FF676I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated 6.6 Gbps–13.1 Gbps GTY transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.

Configuration is performed through dual-mode (Master SPI or JTAG) with bitstream encryption enabled via AES-256 and HMAC-SHA-256. The device includes hardened IP for PCIe Gen3 x8, 10 Gigabit Ethernet MAC, and DDR3/DDR3L memory controllers operating at up to 1866 Mbps.

Key Specifications

Pinout & Package

XC7K410T-2FF676I is packaged in a 676-ball Flip-Chip Fine-Pitch BGA (FFG676) with 0.8 mm ball pitch, thermal lid, and exposed thermal pad. Package dimensions are 27 mm × 27 mm, compatible with standard reflow profiles for lead-free assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XC7K410T-2FF676I, XCKU060-2FFVA1156I offers higher density and speed at the cost of increased power and lack of hardened PCIe Gen3, while XC7K325T-2FF676I delivers pin-compatible scalability down to lower resource tiers without changing PCB layout.

Availability

XC7K410T-2FF676I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test instrumentation, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC7K410T-2FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) designs adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, aerospace, and industrial markets.

The Kintex-7 family was developed for high-performance, cost-sensitive applications demanding balanced logic, DSP, and transceiver resources-targeting communications infrastructure, medical imaging, and defense electronics.

FAQ

What is the maximum supported transceiver line rate for XC7K410T-2FF676I?

The XC7K410T-2FF676I supports GTY transceivers with a maximum line rate of 13.1 Gbps. This enables compliance with 10GBASE-R Ethernet, CPRI Option 3, and JESD204B subclass 1 standards. Line rate configuration is set per transceiver quad via GTYE2_CHANNEL attributes in Vivado, and requires proper PCB impedance control and reference clock stability below 100 ppm.

Does XC7K410T-2FF676I include a hardened PCIe Gen3 controller?

Yes, XC7K410T-2FF676I integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. It supports both root port and endpoint modes, hot-plug detection, and Advanced Error Reporting (AER). The controller operates without consuming fabric logic resources and is configured through the Vivado IP Integrator PCIe core.

What configuration modes does XC7K410T-2FF676I support?

XC7K410T-2FF676I supports Master SPI and JTAG configuration modes. In Master SPI mode, it boots directly from a standard SPI flash device (e.g., Micron MT25QL) using the CCLK, DIN, and associated status pins. JTAG mode enables boundary-scan testing and in-system programming via standard debug probes like Xilinx Platform Cable USB II.

Is XC7K410T-2FF676I qualified for industrial temperature operation?

Yes, XC7K410T-2FF676I is rated for industrial temperature range (-40°C to +100°C) and carries the 'I' speed grade suffix. This qualification includes thermal cycling, high-temperature operating life (HTOL), and bias-HAST testing per JEDEC JESD22-A108. The FFG676 package includes a thermal lid and exposed pad for enhanced heat dissipation in convection-cooled enclosures.

Can XC7K410T-2FF676I perform partial reconfiguration?

Yes, XC7K410T-2FF676I supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and dedicated PR boundary logic. This allows dynamic swapping of functional modules-such as different filter banks or protocol engines-without resetting the entire device. Implementation requires Vivado Design Suite 2018.3 or later and adherence to PR design checkpoint and routing constraints.