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AMD XC7K410T-2FF900I
- Part No.:
- XC7K410T-2FF900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FF900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,532
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Product details
Overview
XC7K410T-2FF900I from AMD is a high-performance Kintex-7 FPGA with 408,000 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for demanding high-speed serial and signal processing applications in radar and wired communications.
For engineers reviewing the XC7K410T-2FF900I datasheet, pinout, applications, or equivalent options, key selection considerations include speed grade (-2), I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), thermal design power (24W typical), and support for PCIe Gen3 x8 endpoint functionality.
Technical Context
The XC7K410T-2FF900I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and 25 × 18-bit multiplier-accumulators per DSP slice. It supports up to 24 transceivers operating at 600 Mb/s to 13.1 Gb/s with built-in PRBS generation and error detection.
Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces, with bitstream encryption and SEU mitigation features enabled. The device includes dedicated clock management tiles (CMTs) with MMCM and PLL blocks supporting jitter reduction and phase alignment across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 408,000 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 2,040 - enables parallel execution of multiply-accumulate operations in signal processing pipelines |
| Block RAM | 28.5 Mb - provides on-chip memory for FIFOs, buffers, and coefficient storage without external memory latency |
| User I/O Pins | 500 - supports high-density interface routing including DDR3, PCIe, and custom parallel buses |
| Transceiver Line Rate | 13.1 Gb/s - enables single-lane compliance with PCIe Gen3, SATA III, and 10G Ethernet protocols |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (100°C) and VCCINT = 0.95V |
| Thermal Design Power | 24 W (typical) - defines minimum heatsink and airflow requirements for sustained operation |
Pinout & Package
XC7K410T-2FF900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 × 35 array, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Thermal pad on underside requires solder paste stencil design and reflow profile optimization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCINT / VCCAUX | Power supply and reference return | Separate analog/digital power domains require independent decoupling and sequencing control |
| MGTAVCC / MGTAVTT | Transceiver analog and termination supply | Must be filtered with low-ESR capacitors and isolated from digital supplies to minimize jitter |
| CLK_IN / CLK_OUT | Dedicated clock input/output pins | Route directly to CMTs; avoid stubs or vias to preserve signal integrity for <1 ps jitter budgets |
| CONFIG_* / DONE / INIT_B | Configuration control signals | Drive with 3.3V-tolerant drivers; pull-ups required for Master SelectMAP mode startup |
| IO_Lx_yy_YY | User-configurable I/O banks | Each bank supports independent voltage (1.2–3.3V) and IOSTANDARD (LVDS, SSTL, HSTL) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint Support | Integrated hard IP enables full-line-rate endpoint operation without soft-core resource consumption |
| AXI4-Stream Interface Integration | Native streaming data path simplifies DMA and packet forwarding between fabric and transceivers |
| SEU Detection and Correction | On-chip circuitry detects and corrects single-event upsets in configuration memory during radiation-exposed operation |
| Bitstream Encryption (AES-256) | Prevents reverse engineering and unauthorized cloning of implemented logic design |
| Dynamic Reconfiguration | Enables partial reconfiguration of logic regions while other sections remain operational |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; transceivers interface with ADC/DAC over JESD204B v1.1. Use Value: 2,040 DSP slices enable concurrent multi-channel processing; 13.1 Gb/s transceivers support 4×12-bit 1 GSPS ADC links. | Use Scenario: Line-card processing in 10G/25G Ethernet switches and optical transport equipment. IC Role / Device Role / Timing Role: Implements MAC-layer bridging, traffic shaping, and SerDes-to-backplane protocol translation. Use Value: 500 user I/Os route multiple SFP28/CFP2 interfaces; PCIe Gen3 x8 connects to host CPU for control plane offload. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Raw data aggregation and preprocessing in MRI and CT scanner front-end subsystems. IC Role / Device Role / Timing Role: Aggregates parallel LVDS streams from detector ASICs and applies real-time filtering before DRAM buffering. Use Value: 28.5 Mb block RAM stores 2–3 frames of raw k-space data; LVDS I/O banks support 1.2 Gb/s per lane. | Use Scenario: High-resolution waveform capture and analysis in modular digitizers and arbitrary waveform generators. IC Role / Device Role / Timing Role: Controls high-speed ADC/DAC sampling clocks, manages data flow via AXI4-Stream, and performs on-the-fly FFT. Use Value: MMCM-based clock synthesis achieves <100 fs RMS jitter for 1 GS/s sampling; 408K logic cells implement deep trigger logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 504K logic cells, higher transceiver count (32), 16.3 Gb/s line rate | Better suited for 100G Ethernet and coherent optical interfaces requiring >20 Gb/s per lane | Select when migrating to higher bandwidth or needing hardened 100G MAC/PCS blocks |
| XC7VX485T-2FFG1761I | Virtex-7 family, same 28 nm node, 485K logic cells, but larger 1761-pin package and higher TDP (32 W) | Preferred for ultra-deep pipeline compute where logic density outweighs power constraints | Choose when existing PCB layout accommodates larger footprint and cooling capacity permits higher power |
Compared with XC7K410T-2FF900I, XCKU040-2FFVA1156I delivers higher serial bandwidth and logic density at increased cost and board area, while XC7VX485T-2FFG1761I offers greater logic capacity in a thermally heavier package-both require PCB redesign and toolchain migration.
Availability
XC7K410T-2FF900I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-2FF900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets high-performance, cost-sensitive applications requiring balanced logic density, I/O bandwidth, and power efficiency-optimized for wired communications, video processing, and aerospace systems.
FAQ
What is the maximum supported transceiver line rate for XC7K410T-2FF900I?
The XC7K410T-2FF900I supports a maximum transceiver line rate of 13.1 Gb/s per lane, compliant with PCIe Gen3, 10GBASE-KR, and SATA III standards. This rating is guaranteed under -2 speed grade conditions at junction temperatures up to 100°C and VCCINT = 0.95V. The device contains 24 GTPE2 transceivers, each configurable independently within this range.
Does XC7K410T-2FF900I support PCIe Gen3 x8 endpoint functionality?
Yes, XC7K410T-2FF900I includes hardened PCIe Gen3 x8 endpoint blocks in its configuration. These are implemented as dedicated hard IP, not soft logic, enabling full-line-rate operation with minimal fabric resource usage. The implementation complies with PCI-SIG specifications and supports advanced features including ASPM L0s/L1, ECRC, and atomic operations.
What configuration modes are supported by XC7K410T-2FF900I?
XC7K410T-2FF900I supports Master SelectMAP, Slave SelectMAP, JTAG, and SPIx4 configuration modes. Master SelectMAP uses internal oscillator and dedicated CONFIG_IO pins to load bitstream from external parallel NOR flash. JTAG is used for debugging and programming during development, while SPIx4 enables compact quad-SPI flash integration with reduced pin count.
How many user I/O pins does XC7K410T-2FF900I provide?
XC7K410T-2FF900I provides 500 user-configurable I/O pins distributed across 34 I/O banks. Each bank supports independent VCCO voltage (1.2V to 3.3V) and selectable IOSTANDARDs including LVDS, SSTL, HSTL, and TMDS. Bank 34 is reserved for configuration and cannot be used for general-purpose I/O.
Is bitstream encryption available on XC7K410T-2FF900I?
Yes, XC7K410T-2FF900I supports AES-256 bitstream encryption using a 256-bit key stored in on-chip eFUSE. Encryption is enabled during bitstream generation in Vivado and verified during configuration. The feature prevents unauthorized readback and cloning of the programmed logic design, meeting industrial IP protection requirements.
XC7K410T-2FF900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-2FF900I FAQ
1.How can I place an order for XC7K410T-2FF900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FF900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FF900I reliable?
The price and inventory of XC7K410T-2FF900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FF900I is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FF900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FF900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FF900I?
XC7K410T-2FF900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FF900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FF900I?
For technical support, including XC7K410T-2FF900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FF900I requirements.
6.How does Aetrix verify that XC7K410T-2FF900I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FF900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FF900I meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FF900I?
All XC7K410T-2FF900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FF900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FF900I part is unused and in its original packaging.
Return procedure for XC7K410T-2FF900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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