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AMD XC7K410T-2FFG676C
- Part No.:
- XC7K410T-2FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FFG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,925
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Product details
Overview
XC7K410T-2FFG676C from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, configured in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 0.8 mm pitch and -2 speed grade. It targets high-throughput data processing in radar signal conditioning systems.
For engineers reviewing the XC7K410T-2FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 12.5 Gb/s, and integrated PCIe Gen2 x8 endpoint capability.
Technical Context
The XC7K410T-2FFG676C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen2, Gigabit Ethernet MACs, and multi-gigabit transceivers. It supports JTAG and SelectMAP configuration modes and operates across industrial temperature range (0°C to 85°C).
It integrates 24 transceivers compliant with SATA, PCIe, and CPRI protocols, and features dual-register 6-input LUTs with distributed RAM and shift register capability per CLB. Configuration is performed via external SPIx4 or BPI parallel flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - total configurable logic resources for complex digital functions |
| DSP Slices | 2,040 - fixed-point arithmetic units supporting 25 × 18-bit multiply-accumulate |
| Block RAM | 28.5 Mb - embedded memory organized as 36 Kb blocks with true dual-port access |
| Transceivers | 24 - multi-gigabit serial I/O supporting 600 Mb/s to 12.5 Gb/s line rates |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage interfaces up to 3.3 V |
| Speed Grade | -2 - guarantees timing closure at specified maximum operating frequencies |
| Operating Temp | 0°C to +85°C - qualified for industrial environment deployment |
Pinout & Package
XC7K410T-2FFG676C is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 0.8 mm ball pitch and 27 × 27 array footprint. Thermal characteristics include 1.9°C/W junction-to-case thermal resistance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable bank-shared pins supporting PS-side peripherals and GPIO |
| HR[0:83] | High-Range I/O Bank | Supports 1.2–3.3 V signaling with programmable slew rate and drive strength |
| HP[0:167] | High-Performance I/O Bank | Optimized for DDR3/DDR4 memory interface and high-speed SerDes reference clocks |
| GTXE2_CLK[0:3] | Transceiver Reference Clock | Dedicated differential inputs for 100 MHz–800 MHz transceiver clocking |
| CONFIG_MODE | Configuration Mode Select | Defines boot source: JTAG, Master/Slave SPI, or BPI parallel flash |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hardened root complex and endpoint logic enabling direct host communication without soft IP overhead |
| 24 GTXE2 Transceivers | Each supports protocol-specific encoding (8b/10b, 64b/66b) and built-in PRBS generation/checking |
| Dual-Register LUTs | Enables pipelined logic implementation with one-cycle latency reduction per stage |
| Integrated Memory Controller | Hard IP supporting DDR3/DDR3L/DDR2/LPDDR2 with 1600 MT/s data rate and ECC capability |
| AXI Interconnect | Programmable interconnect fabric compliant with AXI3/AXI4 protocols for SoC subsystem integration |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GTXE2 transceivers interface with ADC/DAC over JESD204B. Use Value: 24 transceivers enable simultaneous multi-channel JESD204B links at 12.5 Gb/s, reducing board-level interconnect complexity. | Use Scenario: High-resolution ultrasound image reconstruction and DICOM compression pipeline. IC Role / Device Role / Timing Role: Configurable logic processes raw RF data; integrated DDR3 controller buffers frame data at 1600 MT/s. Use Value: 28.5 Mb block RAM and 2,040 DSP slices support real-time 2D/3D beam synthesis and JPEG2000 encoding. |
| Avionics Data Concentrator | Industrial Vision Inspection |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Hardened PCIe Gen2 x8 endpoint connects to host processor; MIO pins manage legacy avionics buses. Use Value: Single-chip consolidation eliminates discrete protocol translators and reduces SWaP-C by 35%. | Use Scenario: Sub-millisecond defect classification on high-speed production lines using CNN inference. IC Role / Device Role / Timing Role: Logic fabric runs binary neural network kernels; HP I/O banks drive 10 GbE vision cameras via SFP+. Use Value: 405,550 logic cells provide sufficient LUTs for 12-layer binary CNN with <100 ns inference latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 504,000 logic cells, higher transceiver count (40), 15 Gb/s max rate | Better suited for 5G fronthaul and AI edge inference requiring >10 TOPS equivalent throughput | Select when migrating to higher bandwidth or needing PCIe Gen3 x16 support |
| XC7K325T-2FFG676C | Same Kintex-7 family, lower density (326,080 logic cells), reduced DSP slices (1,920), same package and speed grade | Valid for cost-optimized radar subsystems where full XC7K410T capacity is unused | Choose for BOM cost reduction while retaining identical PCB layout and thermal profile |
Compared with XC7K410T-2FFG676C, XCKU040-2FFVA1156I delivers higher throughput but requires new PCB design and power delivery; XC7K325T-2FFG676C offers drop-in compatibility with 20% lower logic and DSP resources for scaled-down implementations.
Availability
XC7K410T-2FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and industrial vision inspection requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7K410T-2FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, memory, and I/O resources - especially in wireless infrastructure, video processing, and test equipment.
FAQ
What is the maximum transceiver line rate supported by XC7K410T-2FFG676C?
The XC7K410T-2FFG676C supports transceiver line rates from 600 Mb/s up to 12.5 Gb/s. This range enables compliance with JESD204B, PCIe Gen2, SATA III, and CPRI standards. All 24 GTXE2 transceivers on the XC7K410T-2FFG676C are individually configurable within this range, with dedicated reference clock inputs and built-in PRBS generators for link validation.
Does XC7K410T-2FFG676C include hard IP for PCIe Gen2?
Yes, XC7K410T-2FFG676C integrates hardened PCIe Gen2 x8 endpoint logic. It supports both root port and endpoint configurations without consuming programmable logic resources. The hard IP handles link training, transaction layer packet routing, and MSI/MSI-X interrupt generation, reducing design effort and ensuring protocol compliance for host interface applications using XC7K410T-2FFG676C.
What I/O voltage standards does XC7K410T-2FFG676C support?
XC7K410T-2FFG676C supports LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), LVDS, BLVDS, RSDS, Differential SSTL, and HSTL I/O standards. Each I/O bank is independently configurable for voltage and standard, allowing mixed-signal interfacing with DDR3 memory, ADCs, DACs, and legacy peripherals on the same XC7K410T-2FFG676C device.
Is XC7K410T-2FFG676C qualified for industrial temperature operation?
Yes, XC7K410T-2FFG676C is rated for industrial temperature range operation from 0°C to +85°C ambient. This qualification applies to the -2 speed grade in the FFG676 package. Thermal design must account for 1.9°C/W junction-to-case resistance and ensure adequate heatsinking under worst-case power dissipation conditions for XC7K410T-2FFG676C.
What configuration methods are supported by XC7K410T-2FFG676C?
XC7K410T-2FFG676C supports multiple configuration modes: JTAG boundary scan, Master/Slave SPIx4, and Master/Slave BPI parallel flash. Configuration bitstream can be loaded from external SPI flash, QSPI flash, or parallel NOR flash. The CONFIG_MODE pins determine the active method, and fallback mechanisms are available for robust field updates in deployed XC7K410T-2FFG676C systems.
XC7K410T-2FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-2FFG676C FAQ
1.How can I place an order for XC7K410T-2FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FFG676C reliable?
The price and inventory of XC7K410T-2FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FFG676C is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FFG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FFG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FFG676C?
XC7K410T-2FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FFG676C?
For technical support, including XC7K410T-2FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FFG676C requirements.
6.How does Aetrix verify that XC7K410T-2FFG676C is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FFG676C meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FFG676C?
All XC7K410T-2FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FFG676C part is unused and in its original packaging.
Return procedure for XC7K410T-2FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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