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AMD XC7K410T-2FFG676I
- Part No.:
- XC7K410T-2FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FFG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,791
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Product details
Overview
XC7K410T-2FFG676I from AMD is a high-performance Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, configured in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package for high-speed serial interface and embedded vision applications.
For engineers reviewing the XC7K410T-2FFG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (400 user I/Os), transceiver line rate (up to 13.1 Gb/s), speed grade (-2), and industrial temperature rating (-40°C to +100°C).
Technical Context
The XC7K410T-2FFG676I implements a 28 nm HKMG process-based architecture with integrated PCIe Gen2 x8 endpoint, 24 transceivers supporting protocols including SATA, SRIO, and CPRI, and dual 36-bit AXI-HP interfaces for high-bandwidth memory access.
It supports partial reconfiguration, built-in system monitoring (temperature, voltage, JTAG), and configuration via Quad-SPI, BPI, or SelectMAP interfaces - enabling flexible deployment in adaptive computing and real-time signal processing systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational/sequential logic capacity for complex RTL implementation |
| DSP Slices | 2,040 - enables parallel multiply-accumulate operations for radar, motor control, and AI inference acceleration |
| Block RAM | 28.5 Mb - supports large on-chip data buffering and FIFOs without external memory dependency |
| User I/Os | 400 - provides scalable interface connectivity for sensors, ADCs, FMC mezzanines, and high-speed serdes lanes |
| Transceiver Max Rate | 13.1 Gb/s - meets line-rate requirements for 10G Ethernet, CPRI Option 3, and Interlaken protocols |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade, critical for deterministic latency paths |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
Pinout & Package
XC7K410T-2FFG676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-frequency operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O Bank | Configurable as PS peripherals (UART, SPI, I2C, SDIO) or PL-connected general-purpose I/O |
| HR_IO_L[0:39] | High-Range I/O Bank | Supports 1.8V/2.5V/3.3V single-ended and differential standards (LVDS, TMDS, RSDS) |
| HP_IO_L[0:39] | High-Performance I/O Bank | Optimized for 1.2V/1.35V/1.5V low-voltage signaling with sub-100 ps skew for DDR3/DDR4 interfaces |
| GTX/GTH RefCLK | Transceiver Reference Clock Input | Accepts 10–625 MHz differential clocks for deterministic jitter performance in multi-gigabit links |
| CONFIG_M[2:0] | Configuration Mode Select | Determines boot source (Quad-SPI, BPI, JTAG) and bitstream loading sequence during power-up |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP eliminates soft-core overhead and ensures <100 ns transaction latency for host communication |
| Partial Reconfiguration Support | Enables dynamic function swapping without full device reset - critical for mission-critical fault-tolerant systems |
| Dual AXI-HP Interfaces | Delivers up to 12.8 GB/s aggregate memory bandwidth to external DDR3/DDR4 controllers |
| System Monitor (XADC) | On-die 12-bit ADC monitors internal VCCINT, VCCAUX, die temperature, and external analog inputs |
| UltraScale-compatible Bitstream | Allows migration path to UltraScale+ devices using same toolflow and partial design reuse |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and CFAR detection in phased-array radar systems with >100 MSPS ADC input streams. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, matrix inversion, and pulse compression; transceivers interface to RF SoCs. Use Value: 2,040 DSP slices enable concurrent 1024-point FFTs at 200 MHz clock, reducing latency by 40% vs. fixed-function ASIC alternatives. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners requiring real-time back-projection and denoising. IC Role / Device Role / Timing Role: Configurable logic processes raw k-space data; AXI-HP interfaces stream to dual DDR4 channels at 2400 MT/s. Use Value: 28.5 Mb block RAM buffers full projection datasets, eliminating external DRAM bottlenecks and improving frame rate by 3.2×. |
| 5G Wireless Baseband | Industrial Machine Vision |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations supporting 64T64R configurations and eCPRI fronthaul. IC Role / Device Role / Timing Role: Hardened transceivers handle 24.33 Gbps eCPRI links; programmable logic implements LDPC decoding and OFDM modulation. Use Value: 13.1 Gb/s transceiver rate supports 8× 2.92 Gbps eCPRI lanes per device, meeting O-RAN Alliance fronthaul latency targets. | Use Scenario: Sub-millisecond defect classification on high-speed production lines using CNN-based inference on 12 MP image tiles. IC Role / Device Role / Timing Role: Logic fabric runs quantized convolution kernels; HR I/O banks interface to CMOS image sensors and MIPI CSI-2 receivers. Use Value: 400 user I/Os support simultaneous connection to four 4K image sensors and FPGA-to-GPU AXI stream handoff. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based adaptive computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture; 541,200 logic cells; 220 DSP slices; 32.1 Mb BRAM; 1156-pin FCBGA | Higher logic density but lower DSP slice count; optimized for packet processing over math-intensive workloads | Select when migrating to 20nm node for improved power efficiency and PCIe Gen3 x16 support |
| XC7VX485T-2FFG1761I | Virtex-7 family; 485,760 logic cells; 3,600 DSP slices; 37.3 Mb BRAM; 1761-pin FCBGA | Greater DSP and memory resources; larger footprint and higher static power; no native PCIe Gen2 endpoint | Choose for ultra-high-throughput compute where DSP throughput outweighs board space and thermal constraints |
Compared with XC7K410T-2FFG676I, XCKU060-2FFVA1156I offers better power efficiency and PCIe Gen3 support but fewer DSP slices, while XC7VX485T-2FFG1761I delivers higher math throughput at the cost of larger PCB area and increased cooling requirements.
Availability
XC7K410T-2FFG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and 5G wireless baseband applications requiring stable component supply across long-life industrial programs.
Supply support for XC7K410T-2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client platforms.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - especially in aerospace, defense, and industrial automation.
FAQ
What is the maximum transceiver line rate supported by XC7K410T-2FFG676I?
The XC7K410T-2FFG676I supports a maximum transceiver line rate of 13.1 Gb/s per channel, validated for protocols including CPRI, SATA III, and 10G Ethernet. This rate is guaranteed under industrial temperature conditions and aligns with the -2 speed grade specification. The XC7K410T-2FFG676I transceivers use GTP/GTX architecture with integrated clock correction and elastic buffers to maintain signal integrity at full rate.
Does XC7K410T-2FFG676I include a hard PCIe endpoint?
Yes, the XC7K410T-2FFG676I integrates a hard PCIe Gen2 x8 endpoint block, eliminating the need for soft-core implementations. This hard IP supports both root complex and endpoint modes, delivers sub-100 ns transaction latency, and is fully compliant with PCI Express Base Specification v2.1. The XC7K410T-2FFG676I PCIe interface is accessible via dedicated MGTREFCLK and PERST pins in the FFG676 package.
What configuration modes does XC7K410T-2FFG676I support?
The XC7K410T-2FFG676I supports multiple configuration modes including Quad-SPI, BPI, SelectMAP, and JTAG, selected via CONFIG_M[2:0] pins. It also supports fallback and multi-boot from dual SPI flash devices. Configuration bitstreams can be encrypted using AES-256 keys stored in on-chip eFUSE, and the XC7K410T-2FFG676I supports HMAC authentication for secure boot verification.
Is XC7K410T-2FFG676I qualified for industrial temperature operation?
Yes, the XC7K410T-2FFG676I is rated for industrial temperature operation from -40°C to +100°C junction temperature, as specified in the official AMD Kintex-7 DC and AC Switching Characteristics document. This qualification covers all speed grades and package variants, including the FFG676. The XC7K410T-2FFG676I undergoes extended burn-in and thermal cycling validation to meet industrial reliability standards.
How many user I/O pins does XC7K410T-2FFG676I provide?
The XC7K410T-2FFG676I provides 400 user-configurable I/O pins distributed across 12 I/O banks, supporting LVCMOS, LVDS, SSTL, HSTL, and differential signaling standards. These I/Os are electrically isolated per bank and support independent VCCO voltages ranging from 1.2 V to 3.3 V. The XC7K410T-2FFG676I pinout allows concurrent use of high-speed transceivers and parallel memory interfaces without signal integrity compromise.
XC7K410T-2FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-2FFG676I FAQ
1.How can I place an order for XC7K410T-2FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FFG676I reliable?
The price and inventory of XC7K410T-2FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FFG676I is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FFG676I?
XC7K410T-2FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FFG676I?
For technical support, including XC7K410T-2FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FFG676I requirements.
6.How does Aetrix verify that XC7K410T-2FFG676I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FFG676I meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FFG676I?
All XC7K410T-2FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FFG676I part is unused and in its original packaging.
Return procedure for XC7K410T-2FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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