My Inquiry
My Account
AMD XC7K410T-2FFG900I
- Part No.:
- XC7K410T-2FFG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FFG900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,934
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K410T-2FFG900I from AMD is a Kintex-7 FPGA with 405,000 logic cells, 2,080 DSP slices, 28.5 Mb of block RAM, and 600 I/O pins in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It targets high-throughput data processing in radar signal conditioning and PCIe Gen2 endpoint interfaces.
For engineers reviewing the XC7K410T-2FFG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, and -2 speed grade timing performance for deterministic latency paths.
Technical Context
The XC7K410T-2FFG900I implements a configurable logic fabric based on 6-input LUTs with integrated flip-flops, supported by dedicated carry chains and shift registers. It integrates 24 transceivers compliant with PCIe Gen2, SATA, and CPRI protocols, each supporting 6.6 Gb/s serial line rates with embedded clock data recovery.
Configuration occurs via Master SPI, Slave SelectMAP, or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and includes hardened IP blocks for PCI Express Endpoint, Gigabit Ethernet MAC, and AXI interconnects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 2,080 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 28.5 Mb - supports large on-chip buffering for video frame stores or packet queues |
| I/O Pins | 600 - provides scalable interface count for multi-protocol parallel bus and SERDES connectivity |
| Transceiver Line Rate | 6.6 Gb/s - meets PCIe Gen2 and CPRI Option 3 physical layer requirements |
| Speed Grade | -2 - guarantees worst-case timing closure at 125 MHz system clock with 1.0 V core supply |
| I/O Voltage Range | 1.2 V to 3.3 V - allows direct interfacing with DDR3, LVDS, and CMOS peripherals |
Pinout & Package
XC7K410T-2FFG900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in sustained compute workloads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Power Ground | Reference plane for all I/O banks and core logic; requires low-inductance connection to PCB ground plane |
| VCCINT | Core Supply | 1.0 V regulated supply for FPGA fabric; must be filtered with ≥22 µF ceramic capacitance per bank |
| VCCAUX | Auxiliary Supply | 1.8 V supply for configuration logic, transceivers, and select I/O banks |
| M0–M2 | Mode Configuration | Defines boot source (SPI, BPI, or JTAG) during power-up reset sequence |
| INIT_B | Configuration Status | Open-drain output indicating bitstream loading progress; pulled high externally |
| CCLK | Configuration Clock | Input clock for Master SPI configuration; frequency ≤ 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Hard IP Endpoint | Integrated endpoint controller with 1x–8x lane support eliminates external PHY and reduces PCIe protocol stack integration effort |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset, critical for adaptive radio and real-time protocol switching |
| AXI Interconnect Infrastructure | Hardened crossbar supporting AXI3/AXI4 protocols simplifies SoC-level bus arbitration and address mapping |
| Bitstream Encryption & HMAC | Prevents unauthorized configuration and ensures firmware integrity in deployed systems |
| Multi-Voltage I/O Banks | 14 independent banks allow concurrent operation with DDR3, LVDS, and single-ended CMOS interfaces |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing of phased-array radar returns with adaptive beamforming. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; transceivers stream ADC samples from RF front-end. Use Value: 2,080 DSP slices enable 16-channel simultaneous Doppler FFT at 100 MSPS input rate. | Use Scenario: High-resolution ultrasound image reconstruction pipeline with echo data aggregation and beam synthesis. IC Role / Device Role / Timing Role: XC7K410T-2FFG900I serves as real-time image processor and PCIe Gen2 host interface to workstation memory. Use Value: 28.5 Mb block RAM buffers 4K×4K pixel frames while maintaining sub-50 µs latency for display refresh. |
| Industrial Machine Vision | 5G Wireless Baseband |
Use Scenario: Multi-camera synchronization and defect classification using CNN inference on factory floor inspection systems. IC Role / Device Role / Timing Role: Configurable logic implements camera interface (SLVS-EC), preprocessing pipeline, and lightweight neural network accelerator. Use Value: 600 I/O pins support 8× SLVS-EC lanes plus GPIO for sensor triggers and actuator control. | Use Scenario: Massive MIMO baseband processing for 5G NR with OFDM symbol generation and channel estimation. IC Role / Device Role / Timing Role: XC7K410T-2FFG900I performs layer-1 PHY functions including FFT/iFFT, channel coding, and precoding. Use Value: -2 speed grade ensures deterministic 1024-point FFT execution within 2.5 µs for sub-1 ms TDD frame timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture; 504,000 logic cells; higher transceiver count (40× 12.5 Gb/s) | Better suited for 5G NR Layer 1 with >100 MHz bandwidth or 100G Ethernet transport | Select when migrating to higher serial bandwidth or requiring hardened 100G MAC/PCS |
| XC7K325T-2FFG900I | Same Kintex-7 family; 326,000 logic cells; 1,620 DSP slices; identical 900-pin FC-FBGA package | Lower resource count limits simultaneous multi-standard radio processing (e.g., LTE + GNSS) | Choose for cost-sensitive designs where XC7K410T-2FFG900I resources exceed functional requirements |
Compared with XC7K410T-2FFG900I, XCKU040-2FFVA1156I delivers higher throughput but requires PCB redesign due to larger package and different power delivery; XC7K325T-2FFG900I offers pin-compatible migration path with reduced logic and DSP capacity for scaled-down implementations.
Availability
XC7K410T-2FFG900I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial machine vision applications requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-2FFG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and AI acceleration.
The Kintex-7 family was designed for balanced performance, power, and cost in high-speed serial and memory-intensive applications such as wireless infrastructure and test equipment.
FAQ
What is the maximum supported transceiver line rate for XC7K410T-2FFG900I?
The XC7K410T-2FFG900I supports transceiver line rates up to 6.6 Gb/s. This specification is validated across all 24 transceivers and enables compliance with PCIe Gen2, SATA III, and CPRI Option 3 standards. The line rate is fixed per transceiver bank and cannot be exceeded even with external equalization or retiming.
Does XC7K410T-2FFG900I support partial reconfiguration?
Yes, XC7K410T-2FFG900I supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This capability allows dynamic replacement of logic modules without resetting the entire device, enabling runtime adaptation in radar waveform switching and protocol-aware communication systems.
What I/O standards are supported by XC7K410T-2FFG900I?
XC7K410T-2FFG900I supports LVCMOS, LVDS, BLVDS, RSDS, Differential SSTL, and HSTL across its 14 independent I/O banks. Each bank operates at selectable voltages from 1.2 V to 3.3 V, allowing concurrent interfacing with DDR3 memory, analog front-end ADCs, and industrial sensors.
Is XC7K410T-2FFG900I compatible with Vivado Design Suite?
Yes, XC7K410T-2FFG900I is fully supported in AMD Vivado Design Suite 2018.3 and later versions. The device appears in the part selection menu, and all timing models, IP integrators, and bitstream generation tools are validated for this specific speed grade and package combination.
What is the operating temperature range for XC7K410T-2FFG900I?
XC7K410T-2FFG900I is rated for industrial temperature operation from –40 °C to +100 °C junction temperature. This rating applies to the I-grade variant indicated by the final 'I' in the part number and is verified per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life standards.
XC7K410T-2FFG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-2FFG900I FAQ
1.How can I place an order for XC7K410T-2FFG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FFG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FFG900I reliable?
The price and inventory of XC7K410T-2FFG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FFG900I is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FFG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FFG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FFG900I?
XC7K410T-2FFG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FFG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FFG900I?
For technical support, including XC7K410T-2FFG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FFG900I requirements.
6.How does Aetrix verify that XC7K410T-2FFG900I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FFG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FFG900I meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FFG900I?
All XC7K410T-2FFG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FFG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FFG900I part is unused and in its original packaging.
Return procedure for XC7K410T-2FFG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K410T-2FFG900I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
